JP2018010927A - Imprint device, imprint method, and method of manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device capable of detecting an image by a mark for use in alignment accurately, even if the types of the mold for use in patterning changes.SOLUTION: An imprint device 100 for patterning an imprint material 30 on an object 9 by using a mold 6 has image detection means 2 including photodetectors 2a for receiving light from a mark provided on at least one of the mold 6 and object 9 via the mold 6, and adjustment means for adjusting the focus state of an image formed on the photodetectors 2a by the light from the mark, according to the type of the mold 6 used for patterning.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an imprint apparatus, an imprint method, and an article manufacturing method.

  There is known an imprint apparatus that forms a cured product pattern in which an uneven pattern of a mold is transferred by bringing an imprint material supplied on a substrate into contact with a mold and applying energy for curing to the imprint material. ing.

  In Patent Document 1, a replica mold in which the uneven pattern of the master mold is transferred by imprint processing using a master mold having an uneven pattern formed using an electron beam lithography apparatus with a uniform thickness is reproduced. It is described to do. In the replica mold, a concave portion not formed in the master mold is formed on the side opposite to the side on which the pattern is formed.

JP2013-175671

  The replicated replica mold is used as a mold for forming a pattern on a substrate. Therefore, as a mold for forming a pattern on an object such as a substrate or a replica mold, a mold having a substantially constant thickness such as a master mold may be used, or a recess such as a replica mold is provided. Sometimes molds are used.

  When adjusting the relative position of the mold and the substrate, an image formed by light (detection light) that is light from marks provided on the mold and the object and transmitted through the mold is detected. However, the distance (thickness) through which the detection light passes through the mold differs depending on the presence or absence of the concave portion when the master mold is used and when the replica mold is used. As a result, the image formation position of the image formed by the light from the mark is shifted in the optical axis direction of the detection light, making it difficult to detect the image with high resolution. Therefore, an error may occur in the adjustment of the relative position.

  An object of the present invention is to provide an imprint apparatus capable of accurately detecting an image formed by light from a mark used for alignment even when the type of a mold used for forming a pattern changes.

  The present invention is an imprint apparatus that forms a pattern of an imprint material on an object using a mold, and receives light from a mark provided on at least one of the mold and the object through the mold. Image detecting means including a light receiving element, and adjusting means for adjusting a focus state of an image formed on the light receiving element by light from the mark according to the type of the mold used for forming the pattern. It is characterized by that.

  According to the present invention, even if the type of a mold used for pattern formation changes, an image formed by light from a mark used for alignment can be detected with high accuracy.

It is a figure which shows the structure of the imprint apparatus which concerns on 1st Embodiment. It is a figure which shows the example of the combination of a mold and a to-be-processed object. It is a figure which shows the structure of the imprint apparatus which concerns on 2nd Embodiment. It is a figure explaining the position of the optical member which concerns on 3rd Embodiment, and the mark of a detection target. It is a flowchart which shows the adjustment method of the optical path length which concerns on 3rd Embodiment. It is a figure which shows the structure of the modification of the imprint apparatus which concerns on 3rd Embodiment. It is a figure explaining the position of the optical member which concerns on 4th Embodiment, and the mark of a detection target. It is a figure explaining the modification of the position of the optical member which concerns on 4th Embodiment, and the mark of a detection target. It is a figure which shows the structure of the imprint apparatus which concerns on 5th Embodiment. It is a figure which shows the structure of the imprint apparatus which concerns on 5th Embodiment. It is a figure which shows the structure of a drive mechanism. It is a flowchart which shows the adjustment method of the optical path length which concerns on 5th Embodiment. It is a figure explaining operation | movement of a drive mechanism. It is a figure which shows the structure of the imprint apparatus which concerns on 6th Embodiment. It is a figure which shows the structure of the imprint apparatus which concerns on 7th Embodiment. It is a figure which shows the structure of a slip prevention means. It is a figure which shows the structure of the modification of a slip prevention means. It is a figure which shows the manufacturing method of articles | goods.

[First Embodiment]
(Configuration of imprint device)
FIG. 1 is a diagram illustrating a configuration of an imprint apparatus 100 according to the first embodiment. A vertical axis is a Z axis, and two axes orthogonal to each other in a plane perpendicular to the Z axis are an X axis and a Y axis.

  In the present embodiment, the adjustment unit that adjusts the focus state of the image in the imaging element (light receiving element) 2b that receives the detection light 2d is the drive mechanism 3b. The drive mechanism 3b adjusts the focus state by driving the optical element in the optical path of the detection light (first light) 2b along the optical path based on information indicating the presence / absence of the recess 6d of the mold 6.

  The imprint apparatus 100 brings the imprint material 30 supplied on the substrate (object) 9 into contact with the mold (mold) 6 and applies energy for curing to the imprint material 30, whereby the uneven pattern of the mold 6 is changed. An apparatus for forming a pattern of a transferred cured product.

  As the imprint material 30, a curable composition (which may be referred to as an uncured resin) that is cured when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, or the like is used. The electromagnetic wave is, for example, light such as infrared light, visible light, or ultraviolet light whose wavelength is selected from a range of 10 nm to 1 mm.

  A curable composition is a composition which hardens | cures by irradiation of light or by heating. Among these, the photocurable composition cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

  The imprint material 30 is supplied onto the substrate 9 by the supply unit 40. When the supply unit 40 is a spin coater, a slit coater or the like, it is supplied on the substrate 9 in a film form. When the supply unit 40 is a liquid ejecting head, it may be supplied onto the substrate 9 in the form of droplets or an island or film formed by connecting a plurality of droplets. The imprint material has a viscosity (viscosity at 25 ° C.) of, for example, 1 mPa · s or more and 100 mPa · s or less.

  The substrate 9 is made of glass, ceramics, metal, semiconductor, resin, or the like, and a member made of a material different from the substrate may be formed on the surface as necessary. Specific examples of the substrate include a silicon wafer, a compound semiconductor wafer, and quartz glass.

  In the present embodiment, a case where an imprint material 30 that is cured by light (second light) 1a emitted from the irradiation unit 1 is used will be described.

  The mold 6 has a rectangular outer periphery when viewed from the + Z direction, and a three-dimensional pattern (for example, an uneven shape such as a circuit pattern) 6b to be transferred to the imprint material 30 is formed on the side facing the substrate 9. The patterned portion 6c is provided. The pattern portion 6c is provided with a plurality of mold side marks 6a. A recess 6d is provided on the side opposite to the pattern portion 6c.

  The recess 6d may have a cylindrical shape or a prismatic shape. The imprint apparatus 100 supplies gas to the concave portion 6d to bring the pattern portion 6c into a convex curve downward and bring it into contact with the imprint material 30 so that bubbles are generated between the imprint material 30 and the mold 6 at the time of contact. Suppresses entering.

  As the material of the mold 6, a material capable of transmitting the light 1 a and the detection light 2 d detected by the detection system 2 is used.

  The detection system (image detection means) 2 includes an imaging element 2b that receives detection light 2d from at least one of the mold side mark 6a and the substrate side mark 9a provided on the substrate 9, and the detection light 2d to the imaging element 2b. A scope 2a having a detection optical system 2c leading to Thereby, an image formed by light from the detection target mark is detected. That is, an image formed by light reflected or diffracted from the mark to be detected is detected. In order to detect an image formed by light from a plurality of marks simultaneously, it is preferable to have a plurality of scopes 2a.

  The light that illuminates the detection target mark may be light emitted from the detection system 2 or light emitted from another optical system. A part of the light illuminated on the detection target mark becomes the detection light 2d.

  The detection light 2d includes two optical elements 3a and other optical elements (not shown), and a detection system via a relay optical system 3 that forms an intermediate image of an image formed by light from a mark to be detected. 2 is incident. The drive mechanism 3b moves the optical element in the optical path of the detection light (first light) 2d along the optical path of the detection light 2d.

  The wavelength of the detection light 2d may be any wavelength band as long as the light does not cure the imprint material 30. In particular, it is preferable to include light in a wide wavelength band in λ = 450 to 1200 nm. The light having a wide wavelength band may be light having a continuous wavelength band or light including light having a plurality of discrete wavelengths. As a result, even if the substrate side mark 9a has a lower detection accuracy for light of a specific wavelength depending on the process of the base pattern previously formed on the substrate 9, the substrate side mark 9a is detected with high accuracy. be able to.

  The drive mechanism 4 drives the mold 6 along the Z-axis direction in the contact operation and the separation operation between the imprint material 30 and the mold 6. The drive mechanism 4 may include a drive mechanism that drives the mold 6 in the X-axis direction, the Y-axis direction, and the rotational directions around the XYZ axes. The holding part 5 holds the mold 6 by vacuum suction force or electrostatic force. The holding unit 8 holds the substrate 9 by a vacuum suction force or an electrostatic force. A space 70 is formed in the central portion of the holding unit 5 and the drive mechanism 4.

  The stage 7 on which the holding unit 8 is placed moves the substrate 9 together with the holding unit 8 along the X-axis direction and the Y-axis direction. The stage 7 moves the substrate 9 based on the detection result of the detection system 2, and aligns the mold 6 and the substrate 9. The position of the stage 7 is measured by measuring means (not shown) such as an interferometer or an encoder. The stage 7 may move the substrate 9 in the Z-axis direction or the rotation direction around each axis of XYZ. The contact operation and the separation operation between the imprint material 30 and the mold 6 may be performed by moving only the stage 7 or both the stage 7 and the drive mechanism 4 along the Z-axis direction.

  The control unit 60 is connected to the illumination unit 1, the drive mechanism 4, the holding unit 5, the holding unit 8, the drive mechanism 3 b, and the supply unit 40 by wire or wirelessly and forms a pattern by imprint processing, which will be described later. These are controlled during the imprint process. The control unit 60 includes a CPU and a storage unit (not shown).

(About mark detection)
One mold-side mark 6a and substrate-side mark 9a are configured by a concavo-convex structure exhibiting, for example, a rectangle, a line and space with a predetermined pitch, a square shape, a cross shape, and the like.

  The substrate-side mark 9a is provided in each of a plurality of shot areas (processed areas) on the substrate 9. The shot area is a unit area of the base layer on which the pattern has already been formed, and one shot area has a size of about 26 mm × 33 mm, for example. One shot area is formed with one or a plurality of patterns having a chip size desired by the user, and is divided by a scribe line (not shown) in which the substrate side mark 9a is formed.

  FIG. 1 shows a state in which the detection system 2 detects moire fringes (an image formed by light from the mark) caused by light diffracted in turn by the substrate side mark 9a and the mold side mark 6a. Moire fringes can be formed by adopting line and space having different pitches as the mold side mark 6a and the substrate side mark 9a. Based on the detection result, the positional deviation amount (relative position) between the mold 6 and the substrate 9 is acquired. The stage 7 moves the substrate 9 so that the acquired positional deviation amount is reduced.

  The detection system 2 may detect an image of the mold side mark 6a that is different from the above-described mark that causes moire fringes. Based on the amount of positional deviation between the reference mark 7a and the mold side mark 6a obtained from the image detection result of the reference mark 7a on the stage 7 and the mold side mark 6a, the control unit 60 determines the position of the mold 6 with respect to the holding unit 5. You may get it.

  The detection system 2 may detect the substrate-side mark 9a and the reference mark 7a that are different from the above-described mark that causes moire fringes. Based on the positional deviation between the reference mark 7a and the substrate side mark 9a obtained from the detection result, the control unit 60 may calculate the arrangement of the shot areas.

  The detection system 2 may acquire a shape difference between the mold 6 and the shot area on the substrate 9 based on detection results from the plurality of scopes 2a. The control unit 60 may deform the mold 6 using the shape difference information to improve the overlay accuracy.

  In the following description, a case where moire fringes are detected will be described.

(Adjusting the focus state)
In FIG. 2A to FIG. 2D, when the mold 6 is duplicated as in Patent Document 1, a duplicate mold 6 (master mold) and a blank mold 13 as an object on which a pattern is formed, 14 is exemplified. 2A to 2D, the illumination unit 1, the detection system 2, the relay optical system 3, the drive mechanism 3b, the optical member 10, the supply unit 40, and the control unit 60 are not shown.

  The blank molds 13 and 14 have substantially the same outer shape as the mold 6 and are not formed with the uneven pattern 6b. The blank mold 13 has a recess 13d, and the blank mold 14 has no recess. FIGS. 2A and 2B show how a pattern is formed using a mold 6 (second mold) having a recess 6d. FIGS. 2C and 2D show a state in which a pattern is formed using a mold 6 (a first mold, a mold having a uniform thickness) having no recess.

  The detection light 2d passes through the mold 6 and travels toward the scope 2a. However, when the mold 6 having the recess 6d and the mold 6 without the recess 6d are used in the same imprint apparatus 100, the optical path length of the detection light 2d changes by the amount of the recess 6d depending on the presence or absence of the recess 6d in the mold 6.

  For example, when the thickness H2 of the mold 6 is about 10 mm and the thickness H1 of the recess 6d is about 8 to 9 mm, the change in the optical path length is 2.5 mm. Since the depth of focus in the scope 2a with an NA of 0.1 is about 30 μm, the mark to be detected can be detected when the mold 6 having the recess 6d is simply changed to the mold 6 without the recess 6d (or vice versa). It disappears or the detection accuracy decreases.

  In order to compensate for the difference in detection accuracy, the imprint apparatus 100 includes an adjustment unit that adjusts a focus state of an image formed by light from a mark to be detected in the image sensor 2a. In this embodiment, it has the drive mechanism 3b.

  The control unit 50 confirms the type of mold in advance. That is, information indicating the presence or absence of the recess 6d of the mold 6 is acquired before the start of the alignment operation. The information is information input to the imprint apparatus 100 by the user via the interface.

  Next, according to an instruction from the control unit 50, the driving mechanism 3b moves the optical element in the relay optical system 3 along the optical path of the detection light 2d. As a result, the drive mechanism 3b can place the detection target mark at the focal depth of the scope 2a. Note that the optical element is preferably a zoom optical system capable of enlarging or reducing an image of the incident detection light 2d by moving along the optical path. The drive mechanism 3b may move a plurality of optical elements included in the relay optical system 3 along the optical path of the detection light 2d as a whole.

  In this way, the drive mechanism 3b adjusts the focus state of the image from the detection target mark in the image sensor 2b based on the information indicating the presence or absence of the recess 6d, that is, according to the type of the mold 6. Thereby, the change in the focus state due to the change in the type of the mold 6 is reduced, and the detection system 2 can detect the moire fringes with high accuracy.

  If the positional deviation between the substrate 9 and the mold 6 can be accurately detected, a pattern can be formed on the substrate 9 with the stage 7 reducing the positional deviation. As a result, the overlay accuracy between the underlying pattern and the newly formed pattern can be improved.

  When the detection system 2 detects the moire fringes without using the relay optical system 3, the detection optical system 2c may be moved in advance along the optical path of the detection light 2d according to the type of the mold 6. Alternatively, the drive mechanism 3b may move the position of the imaging element 2b instead of the optical element along the optical path of the detection light 2d.

[Second Embodiment]
An imprint apparatus 200 according to the second embodiment will be described with reference to FIGS. 3 to 4, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The imprint apparatus 200 includes an optical member 80 and a drive mechanism (control means) 81 as adjustment means for adjusting the focus state of an image in the image sensor 2b that receives the detection light 2d. In the present embodiment, using the optical member 80 and the drive mechanism 81, imaging is performed from the detection target mark so that the optical path of the detection light 2d is an optical path according to the type of the mold 6 and the position of the optical member 80. The optical path length to the element 2a is adjusted.

  The two optical members 80 are fixedly arranged, and each has a shape extending in the Y-axis direction. As shown in FIG. 4, the optical member 80 is disposed outside the optical path of the light 1a.

  As the material of the optical member 80, a material capable of transmitting the detection light 2d is used. For example, glass such as quartz glass, silicate glass, calcium fluoride, magnesium fluoride, and acrylic glass may be used. The material of the mold may be a resin such as sapphire, gallium nitride, polycarbonate, polystyrene, acrylic, or polypropylene. Or these laminated materials may be sufficient. When the material of the optical member 80 and the material of the mold 6 are the same, the optical member 80 preferably has a thickness equal to the thickness of the recess 6d (distance in the Z direction).

  The optical member 80 can be arranged freely as long as it is on the recess 6 d side with respect to the mold 6. Since the detection light 2b from the mark 6a spreads in the space according to the NA, a larger optical member 80 is required when the optical member 80 is disposed at a position away from the mold 6, as shown in FIG. It is preferable to be fixed to the holding part 5.

  The drive mechanism 81 controls the detection system 2. Specifically, only the detection optical system 2c or the scope 2a is moved within a plane (XY plane) intersecting the optical axis of the detection light 2d. The drive mechanism 81 is connected to the control unit 60 (not shown).

  Furthermore, a partition wall 31 is provided to separate a space (first space) in which the detection system 2 is arranged and a space (second space) where a pattern is formed.

The storage unit of the control unit 60 stores a program shown in the flowchart of FIG.
While the CPU of the control unit 60 reads the program, the control unit 60 controls each component connected to the control unit 60.

  The imprint apparatus 200 carries in the mold 6 and the substrate 9 on which detection target marks are formed at different positions in order to make the optical path of the detection light 2d different depending on the presence or absence of the recess 6d. In the present embodiment, the fact that the position of the mark to be detected is different is used.

  Next, the flowchart of FIG. 5 will be described. First, in S11, the control unit 60 confirms information regarding the type of mold. That is, information indicating the presence / absence of the recess 6 d of the mold 6 is acquired before the alignment operation between the substrate 9 and the mold 6 is started. The information is information input to the imprint apparatus 100 by the user via the interface. In S12, the control unit 60 determines whether or not there is a recess 6d.

  A case where Yes is determined in S12 will be described. 4A and 4B are views of the optical member 80 and the mold 6 viewed from the + Z direction. FIG. 4 (a) corresponds to FIG. 3 (a) and shows a state in which moire fringes formed by the mold side mark 6a and the substrate side mark 9a of the mold 6 having the recess 6d are detected. In the mold 6 having the recess 6d, the mold side mark 6a is disposed along the short side (side along the Y-axis direction) of the pattern portion 6c. The control unit 12 notifies the drive mechanism 81 of the approximate positions of the mold side mark 6a and the substrate side mark 9a.

  In S13, the drive mechanism 81 moves the plurality of scopes 2a within the XY plane, and the scope 2a is disposed at a position where the detection light 2d from the mold side mark 6a and the substrate side mark 9a passes through the optical member 80.

  The case where it is determined No in S12 will be described. FIG. 4B corresponds to FIG. 3B and shows a state where the mold side mark 6a of the mold 6 without the recess 6d is detected. In the mold 6 without the recess 6d, the mold side mark 6a is disposed along the long side (side along the X-axis direction) of the pattern portion 6c.

  In S <b> 14, the drive mechanism 81 moves each of the plurality of scopes 2 a according to an instruction from the control unit 60, and moves the scope 2 a to a position where the detection light 2 d does not pass through the optical member 80.

  After the scope 2a is moved or in parallel with the movement of the scope 2a, the imprint material 30 is supplied, the contact operation between the mold 6 and the imprint material, the imprint material 30 is cured, and the mold 6 and the imprint material. Imprint processing including separation from 30 is performed.

  Before or during the contact between the mold 6 and the imprint material 30, in S15, the detection system 2 detects the mold side mark 6a and the substrate side mark 9a, and based on the detection result, the mold 6 and The relative position with respect to the substrate 9 is calculated. The description of the flowchart is completed when the positioning of the mold 6 and the substrate 9 in the XY plane is performed using the drive mechanism 4 and the stage 7 based on the obtained relative position information.

  In the imprint apparatus 200, the optical path length of the detection light 2b that is shortened by the formation of the concave portion 6d is complemented by transmitting the optical member 80 through the detection light 2d. That is, the optical path length of the detection light 2b when the mold 6 without the recess 6d is used is made closer to the optical path length of the detection light 2b when the mold 6 having the recess 6d is used. Specifically, the drive mechanism 81 drives the scope 2a so that the optical path of the detection light 2d becomes an optical path according to the type of the mold 6 and the position of the optical member 80.

  By adjusting the optical path length in this manner, the optical path length difference due to the presence or absence of the recess 6d can be reduced, and the moire fringes can be detected with substantially the same accuracy regardless of the presence or absence of the recess 6d. That is, this reduces the change in the focus state due to the change in the type of the mold 6, and the detection system 2 can detect the moire fringes with high accuracy.

  If the positional deviation between the substrate 9 and the mold 6 can be accurately detected, a pattern can be formed on the substrate 9 with the stage 7 reducing the positional deviation. As a result, the overlay accuracy between the underlying pattern and the newly formed pattern can be improved.

  Compared to the case where the optical element is moved along the optical path length, the imprint apparatus 200 can be configured more compactly than the imprint apparatus 100.

  Further, by having the partition wall 31, the particles that are likely to be generated as the scope 2 a moves are prevented from entering the space in which the pattern is formed. Thereby, when the mold 6 and the imprint material 30 are brought into contact with each other, it is possible to reduce damage to the mold 6 and poor pattern formation due to particles being caught in the recesses of the pattern 6b.

  Note that the information indicating the type of the mold 6 input by the user to the imprint apparatus 100 may be information indicating the position of the mold side mark 6a formed on the mold 6 carried into the imprint apparatus 200. In this case, the drive mechanism 81 moves the scope 2a based on the information without determination in S12. After confirming that the position of the mold side mark 6a corresponds to transmission / non-transmission of the optical member 80, detection of moire fringes may be started.

  When there is a possibility that the optical member 80 may enter the optical path of the light 1a, the scope 2a is configured such that the detection light 2d passes through the oblique mold 6 with respect to the optical axis of the light 1a as shown in FIG. It is good to arrange. Compared with the above-described embodiment, the optical member 80 can be arranged on the left and right sides in the X-axis direction, and the occurrence of exposure unevenness of the light 1a can be suppressed.

  Furthermore, as shown in FIG. 6B, it is still more preferable that the optical member 80 is disposed obliquely so that the detection light 2d is incident on the optical member 80 perpendicularly. Thereby, it is possible to suppress a decrease in the detection accuracy (decrease in resolution) of the moire fringes due to the inclination of the optical axis of the detection light 2d.

[Third Embodiment]
The entire optical member 80 used in the second embodiment constitutes a portion in which the optical path length corresponding to the transmission of the detection light 2d through the optical member 80 is an optical path length that complements the optical path length difference depending on the presence or absence of the recess 6d. Was.

  The imprint apparatus 300 according to the third embodiment is different from the imprint apparatus 200 in that the optical member 80 includes a part 80a and a part 80b having different optical path lengths for the transmission of the detection light 2d. The optical path length may be different by changing the thickness between the portion 80a and the portion 80b, or the optical path length may be different by using different materials.

  If such an optical member 80 is used, three types of molds 6 having different optical path lengths corresponding to the transmission of the detection light 2d can be used in one imprint apparatus 300.

  For example, when the materials of the three types of molds 6 are the same and the detection light 2d is transmitted through the mold along the Z-axis direction, the three types of molds 6 having different thicknesses of the portions through which the detection light 2d is transmitted are used. Can be used. For example, two molds 6 having recesses 6d with different depths and a mold 6 without recesses 6d.

  For the three types of molds 6, mold side marks 6 a are provided at different positions. This makes it possible to select three optical paths: an optical path that does not allow the detection light 2d to pass through the optical member 80, an optical path that allows the detection light 2d to pass through the portion 80a, and an optical path that allows the detection light 2d to pass through the portion 80b.

  7A to 7C are views of the optical member 80 and the mold 6 viewed from the + Z direction. FIG. 7 illustrates a case where the mold side mark 6a is arranged at a position outside the pattern portion 6c. In FIG. 7, the same members as those in the above-described drawings are denoted by the same reference numerals, and detailed description thereof is omitted.

  The control unit 60 acquires information indicating the thickness of the mold 6 at a portion through which the detection light 2d is transmitted as information indicating the type of the mold 6, and moves the scope 2a based on the information indicating the thickness.

  For example, when the mold 6 having a thickness A is used, the scope 2a is moved to a position where the mold side mark 6a below the portion 80a of the optical member 80 can be detected as shown in FIG. When using the mold 6 having the thickness B, the scope 2a is moved to a position where the mold side mark 6a below the portion 80a of the optical member 80 can be detected. When the mold 6 having the thickness C is used, the scope 2a is moved to a position where the detection light 2d does not pass through the optical member 80.

  However, thickness A <thickness B <thickness C, and optical path length in the portion 80a> optical path length in the portion 80c.

  In particular, it is preferable to detect at least two mold-side marks 6a arranged so as to be shifted in the X-axis direction (first direction) and the Y-axis direction (second direction). Thereby, the positional deviation of the mold 6 and the substrate 9 in the X-axis direction and the Y-axis direction and the positional deviation in the rotation direction can be measured.

  According to this embodiment, the same effect as the imprint apparatus 200 is obtained. Furthermore, more types of molds 6 than the imprint apparatus 200 can be used.

  The number of regions having different optical path lengths may be changed as appropriate. As shown in FIG. 8, an optical member 80 provided with four portions 80c, 80d, 80e, and 80f having different optical path lengths may be disposed along each side of the pattern portion 6c. By detecting the mold side mark 6a and the substrate side mark 9a four by four with the detection light 2d transmitted through the region having the same optical path length, the thicknesses of the four types of molds 6 can be handled.

[Fourth Embodiment]
The imprint apparatus 400 according to the fourth embodiment uses a rhomboid prism as the optical member 80 fixedly arranged as shown in FIG. In FIG. 9, the same members as those in FIG. 3 are denoted by the same reference numerals, and detailed description thereof is omitted. The supply unit 40 and the control unit 60 are not shown.

  The rhomboid prism is an optical member that emits light toward the scope 2a after the vertically incident detection light 2d is reflected twice by the inner surface. Instead of the rhomboid prism, two reflecting mirrors may be disposed obliquely with respect to the Z-axis direction per one light beam of the detection light 2d.

  In the present embodiment, the drive mechanism 81 drives the scope 2a so that the optical path according to the type of the mold 6 and the position of the optical member 80 is obtained. This has the same effect as the second embodiment.

  Further, by bending the optical path of the detection light 2d in the horizontal direction by using the rhomboid prism, the optical path length corresponding to the thickness of the optical member 80 can be increased. As a result, even when the change in the optical path length in the mold 6 due to the presence or absence of the recess 6d is large, or even when there is not enough space for arranging the thick optical member 80 in the optical axis direction of the detection light 2d, the moiré fringes are accurate. It can be detected well.

[Fifth Embodiment]
FIG. 10 is a diagram illustrating a configuration of an imprint apparatus 500 according to the fifth embodiment. The imprint apparatus 500 includes an optical member 10 and a drive mechanism (arrangement means) 11 as adjustment means for adjusting the focus state of an image in the image sensor 2b that receives the detection light 2d. The position of the optical member 10 is variable, and the driving mechanism 11 adjusts the optical path length from the detection target mark to the image sensor 2 a by arranging the optical member 10 at a position corresponding to the type of the mold 6. For example, the optical member 10 is arranged in the optical path of the detection light 2d or outside the optical path.

  The storage unit of the control unit 60 stores a program shown in a flowchart of FIG. In addition, the same code | symbol is attached | subjected to the member same as FIG. 1, and detailed description is abbreviate | omitted.

  As the material of the optical member 10, a material capable of transmitting the light 1a and the detection light 2d is used. For example, any one or a combination of the materials exemplified for the optical member 80 may be used. When the material of the optical member 10 and the material of the mold 6 are equal, the optical member 10 preferably has a thickness equal to the thickness of the recess 6d (distance in the Z direction).

  The configuration of the adjusting means including the optical member 10 and the drive mechanism 11 is illustrated in FIGS. The drive mechanism 11 shown in FIG. 11A includes a shaft portion 16a and a drive portion 17 that rotates the shaft portion 16a around the Z axis. The support portion 10a is a member that supports the optical member 10, and is connected to the support portion 10b connected to the shaft portion 16a. The drive mechanism 11 arranges the optical member 10 inside or outside the optical path of the detection light 2d by rotating the shaft portion 16a.

  In the drive mechanism 11 shown in FIG. 11B, the drive unit 17b rotates the shaft portion 16b around the Y axis, thereby arranging the optical member 10 in or out of the optical path of the detection light 2d.

  The drive mechanism 11 shown in FIG. 11C moves the optical member 10 in one axial direction along the guide 20 by a drive mechanism such as a ball screw or a linear motor. By moving the optical member 10, the optical member 10a is arranged in or out of the optical path of the detection light 2d. The configuration of the drive mechanism 11 is not limited to these examples as long as the optical member 10 can be disposed in or out of the optical path of the detection light 2d.

  Next, the process of adjusting the optical path length of the detection light 2d will be described with reference to the flowchart shown in FIG. 12 and the diagram illustrating the movement of the drive mechanism 11 shown in FIG. 13A and 13B, the illumination unit 1, the detection system 2, the relay optical system 3, the supply unit 40, and the control unit 60 are not shown.

  The CPU of the control unit 60 reads the program shown in the flowchart of FIG. 12 from the storage unit and executes the program.

  In S21, the control unit 60 confirms information regarding the type of mold. That is, information indicating the presence / absence of the recess 6 d of the mold 6 is acquired before the alignment operation between the substrate 9 and the mold 6 is started. The information is information input by the user through the interface. In S12, the control unit 60 determines whether or not there is a recess 6d.

  In S <b> 22, the control unit 50 determines whether the mold 6 has the recess 6 d. When the controller 60 determines that the recess 6d is present, the drive mechanism 11 is controlled to place the optical member 10 in the optical path of the detection light 2d as shown in FIG. 13A (S23). When the controller 60 determines that there is no recess 6, the drive mechanism 11 is controlled to place the optical member 10 outside the optical path of the detection light 2d as shown in FIG. 13B (S24).

  A preferable thickness of the optical member 10 will be described. In order to simplify the explanation, the material of the mold 6 having no recess 6d, the mold 6 having the recess 6d, and the optical member 10 are the same in refractive index. In FIG. 13, the thickness of the mold 6 having recesses is H1, the thickness of the mold without the recesses 6d is H2, the thickness of the recesses 6d of the mold 6 is H3, and the thickness of the optical member 10 is H.

  In this case, it is preferable to make the optical path length of the detection light 2 d constant regardless of the thickness of the mold 6. That is, the sum of the thickness H2 of the part 6 through which the detection light 2d of the mold 6 having the recess 6d transmits and the thickness H of the optical member 10, and the thickness H2 of the part through which the detection light 2d of the mold 6 without the recess transmits. Are preferably equal. That is, it is preferable that the relational expression of H1 + H4 = H2 is established. Therefore, it is preferable that the thickness H4 of the optical member 10 is equal to the thickness H3 of the recess 6d.

  In addition, when the refractive index characteristic of the optical member 10 is different from that of the mold 6, it is preferable that the thickness of the optical member 10 is determined regardless of the relational expression described above. For example, the sum of the optical path length through which the detection light 2d passes through the optical member 10 and the optical path length through which the detection light 2d passes through the mold 6 having the recess 6d is equal to the optical path length of the portion that passes through the mold 6 without the recess 6d. It is preferable.

  The imprint process is performed after the optical member 10 is arranged in or out of the optical path of the detection light 2d, or in parallel with the movement of the optical member 10. The imprint process includes supply of the imprint material 30, contact operation between the mold 6 and the imprint material, curing of the imprint material 30, and separation of the mold 6 and the imprint material 30.

  Before or during contact between the mold 6 and the imprint material 30, in S25, the detection system 2 detects the mold side mark 6a and the substrate side mark 9a, and the mold 6 and The relative position with respect to the substrate 9 is calculated. Based on the obtained relative position information, the drive mechanism 4 and the stage 7 are used to align the mold 6 and the substrate 9 in the XY plane. The imprint apparatus 500 hardens the imprint material 30 using the irradiation unit 10 after the alignment.

  In the imprint apparatus 500, the optical path length that is shortened by the formation of the recess 6d is supplemented by transmitting the optical member 10 through the detection light 2d. That is, the optical path length of the detection light 2b when the mold 6 without the recess 6d is used is made closer to the optical path length of the detection light 2b when the mold 6 having the recess 6d is used. Specifically, when the drive mechanism 11 is the mold 6 having the recess 6d, the optical member 10 is disposed in the optical path of the detection light 2d, and when the drive mechanism 11 is the mold 6 without the recess 6d, the optical member 10 is placed in the optical path of the detection light 2d. Place outside.

  By adjusting the optical path length in this manner, the optical path length difference due to the presence or absence of the recess 6d can be reduced, and the moire fringes can be detected with substantially the same accuracy regardless of the presence or absence of the recess 6d. Thereby, the change in the focus state due to the change in the type of the mold 6 is reduced, and the detection system 2 can detect the moire fringes with high accuracy.

  If the positional deviation between the substrate 9 and the mold 6 can be accurately detected, a pattern can be formed on the substrate 9 with the stage 7 reducing the positional deviation. As a result, the overlay accuracy between the underlying pattern and the newly formed pattern can be improved.

  Further, in the imprint apparatus 500, when the optical member 10 is disposed in the optical path of the detection light 2d, the optical member 10 is also disposed in the optical path of the illumination light 1a. Thereby, since the change of the optical path length of the illumination light 1a accompanying the change of the kind of mold 6 can also be compensated, the exposure nonuniformity with respect to the board | substrate 9 can be reduced.

[Sixth Embodiment]
As in the imprint apparatus 500, the optical member 10 is closer to the mold 6 than the pupil plane in the optical path of the relay optical system 3 in the optical path of the detection light 2d from the viewpoint of the detection accuracy of the substrate side mark 9a and the mold side mark 6a. It is preferable that it can be arranged on the near side. The optical path length varies depending on the presence or absence of the recess 6d because it is closer to the mold 6 than the pupil plane in the optical path of the relay optical system 3. However, as long as it can be arranged in the optical path of the detection light 2d, it may be arranged at other positions.

  FIG. 14 is a diagram illustrating a configuration of an imprint apparatus 600 according to the second embodiment. 14, the same members as those in FIG. 10 are denoted by the same reference numerals, and detailed description thereof is omitted. The supply unit 40, the transport mechanism 50, and the control unit 60 are not shown.

  The optical member 10 and the driving mechanism 11 are different from the imprint apparatus 500 in that the optical member 10 and the drive mechanism 11 are provided in the detection system 2, that is, in the optical path of the detection light 2d, closer to the detection system 2 than the pupil plane of the relay optical system 3. . The optical member 10 and the drive mechanism 11 corresponding to each of the plurality of scopes 2a may be provided.

  Similar to the imprint apparatus 500, the drive mechanism 11 arranges the optical member 10 in or out of the optical path of the detection light 2d according to the type of the mold 6 conveyed to the imprint apparatus 600.

  Further, when the optical member 10 is arranged in the optical path of the detection light 2d, the drive mechanism 11d drives the optical member 10d to arrange the optical member 10d in the optical path of the light 1a.

  Thereby, the effect similar to 5th Embodiment can be acquired.

  The imprint apparatuses 500 and 600 may include a plurality of types of optical members 10 having different materials and / or thicknesses. Even in the case of using a mold 6 having different optical path lengths through which the detection light 2d is transmitted, appropriate optical members 10 are combined and arranged in the optical path according to the mold 6 to be used. Thereby, the optical path length from the mark to be detected to the image sensor 2b can be made closer to the predetermined optical path length.

[Seventh Embodiment]
FIG. 15 is a diagram illustrating a configuration of an imprint apparatus 700 according to the third embodiment. 15, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted. The supply unit 40 and the control unit 60 are not shown.

  The imprint apparatus 700 is a driving mechanism capable of placing the optical member 10 on the mold 6 according to the type of the optical member 10 and the mold 6 as adjusting means for adjusting the focus state of the image in the image sensor 2b that receives the detection light 2d. (Placing means) 55 is provided.

  The drive mechanism 55 includes a holding unit 56 that holds the optical member 10 by electrostatic force or vacuum suction force. The transport mechanism 50 transports only the mold 6 or the mold 6 on which the optical member 10 is placed to the holding unit 5.

  The steps S21 to S23 shown in FIG. 12 are similarly performed in this embodiment. When the mold held by the holding unit 5 is the mold 6 having the recess 6d, in S13, the drive mechanism 55 places the optical member 10 in the recess 6d based on an instruction from the control unit 60 (not shown). On the other hand, when the mold held by the holding unit 5 is the mold 6 without the recess 6d, the control unit 60 instructs the drive mechanism 55 to stand by in S13, and the optical member 10 is molded to the drive mechanism 55. Do not place on.

  Thereafter, the imprint apparatus 700 starts imprint processing after a process of transporting the mold 6 to the holding unit 5 using the transport mechanism 50 before S25. Thereafter, the stage 7 starts alignment of the mold 6 and the substrate 9 based on the detection result of the image formed by the light from the mark by the detection system 2.

  Thus, with respect to the mold 6 having the recess 6d, the optical path length for the detection light 2d to pass through the mold 6 with the recess 6d and the optical path length for the detection light 2d to pass through the mold 6 without the recess 6d. The optical member 10 that complements the difference is placed. By placing the optical member 10 and adjusting the optical path length from the mark to be detected to the image sensor 2a, the focus state of the image from the mark on the image sensor 2a is adjusted.

  The change in the focus state due to the change in the type of the mold 6 is reduced, and the detection system 2 can detect the moire fringes with high accuracy.

  If the positional deviation between the substrate 9 and the mold 6 can be accurately detected, a pattern can be formed on the substrate 9 with the stage 7 reducing the positional deviation. As a result, the overlay accuracy between the underlying pattern and the newly formed pattern can be improved.

  In particular, since the drive mechanism 55 is driven at a position far from the space below the holding unit 5 where the pattern is formed, particles due to the drive of the drive mechanism 55 cause damage to the mold 6 or pattern defects during imprint processing. Fear can be reduced.

  The imprint apparatus 700 may include a plurality of types of optical members 10. Regardless of the presence or absence of the recess 6d, the driving is performed in accordance with the type of the mold 6 in which the thickness of the mold 6 where the detection light 2d passes, the material of the mold 6, the thickness (depth) of the recess 6d, and the like are different. The mechanism 55 only needs to place the appropriate optical member 10.

  A modification of the third embodiment will be described with reference to FIGS. FIG. 16 is a diagram showing the configuration of the optical member 10 and the mold 6 each having means for preventing the positional deviation between the optical member 10 and the mold 6. As shown in FIG. 16A, the deviation preventing means includes a chamfered portion 21 provided on the optical member 10 and a chamfered portion 22 provided on the mold 6. The chamfered portion 21 and the chamfered portion 22 are provided such that the horizontal length d2 of the bottom of the optical member 10 is longer than the horizontal length d1 of the bottom of the recess 6d.

  The deviation prevention means shown in FIG. 16B is a convex portion 23 provided at the bottom of the optical member 10 and a local concave portion 24 provided in the concave portion 6d, and the convex portion 23 and the concave portion 24 are engaged with each other. The displacement of the member 10 is prevented.

  17 is an opening 26 opened in the mold 6 at a position facing the optical member 10 when placed in the recess 6d. The mold 6 is mounted on the hand 25 of the transport mechanism 50 that transports the mold 6 to the holding unit 5, and the mold 6 is adsorbed to the hand 25 by exhausting the opening 26 and the flow path 27.

  By these deviation preventing means, an error occurs in the optical path length of the detection light 2d due to the optical member 10 being slightly tilted with respect to the mold 6 during conveyance to the holding unit 5, and the detection accuracy is reduced. Can be suppressed.

[Eighth Embodiment]
Depending on the individual difference of the mold 6, the thickness of the mold 6 or the formation position of the mark 6a may be slightly different. Therefore, in the present embodiment, the adjusting means described in the first to seventh embodiments roughly adjusts the focus state of the image formed on the image sensor 2d by the detection light 2b, and then the optical element in the optical path of the detection light 2b. The focus state is finely adjusted by moving the lens along the optical path. As the fine adjustment, the optical element is arranged at a position where it is moved by a predetermined distance to obtain the best focus state. That is, the adjustment means adjusts the focus state according to the type of the mold 6, and the optical element performs fine adjustment to reduce a minute focus state error caused by individual differences of the mold 6.

  Thereby, in addition to the above-described effects, errors in the focus state caused by individual differences of the mold 6 can be reduced. In particular, when this embodiment is implemented in combination with the second to seventh embodiments, the optical element is compared with the case where the focus state is adjusted only by movement along the optical path of the optical element in the optical path of the detection light 2b. It is possible to reduce the time required for the movement and the space required for the movement.

[Other Embodiments]
Other embodiments applicable to the first to eighth embodiments will be described.

  When the type of the mold 6 is different, the shape of the mold (the presence or absence of the recess 6d), the thickness (depth) of the recess 6d, the material of the mold 6, the thickness of the portion through which the detection light 2d is transmitted, etc. are designed. The difference is that the optical path length of the detection light 2d that passes through the mold 6 is different.

  The adjusting means according to each embodiment includes information indicating the presence / absence of the recess 6d of the mold 6, information indicating the thickness of the part through which the detection light is transmitted (the thickness of the mold), information indicating the position of the mold side mark 6a, Alternatively, the focus state is adjusted based on information indicating the material of the mold 6. The information indicating the material of the mold 6 may be a material name or a refractive index. Of the four types of information described above, the adjustment amount of the adjustment unit may be determined based on only one piece of information, or the adjustment amount may be determined based on a plurality of pieces of information.

  The adjustment amount here is the drive amount of the drive mechanism 3b in the first embodiment. If it is 2nd-4th Embodiment, it is the drive amount of the drive mechanism 81, and if it is 5th-7th Embodiment, it is the kind of optical member 10 to be used. It is preferable that an adjustment amount corresponding to the acquired information is stored in the storage unit of the control unit 60 in advance.

  Note that the information acquired in S11 and S21 may be information acquired by identifying the type of the mold 6 using an identification unit included in the imprint apparatus. Examples of the identification unit include a mechanism for measuring the thickness of the mold 6 and a reading unit that reads an identifier such as a barcode and a predetermined mark given to the mold 6.

  The imprint apparatus according to each embodiment may form a pattern on the replica mold 13 or the replica mold 14 instead of the substrate 9. Even if the type of mold used for pattern formation changes, an image formed by light from a mark used for alignment can be detected with high accuracy.

  The material of the optical members 10 and 80 may be the same material as the mold 6 or a different material. When the detection light 2d includes light having a wide bandwidth or light having a plurality of wavelengths, the same material as that of the mold 6 is preferable. When it is easy to detect with light having a wavelength different from the light having the specific wavelength depending on the type of the substrate-side mark 9a, the optical path of the detection light 2d is different if the optical member 10 and the mold 6 have different refractive index characteristics. There may be differences in length. If the optical member 10 and the mold 6 are made of the same material, there is no such concern, and the dependence on the process and wavelength can be reduced.

  You may implement combining each above-mentioned embodiment suitably.

[Product Manufacturing Method]
The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed. Furthermore, the manufacturing method of the article may include other well-known processing steps (development, oxidation, film formation, vapor deposition, planarization, resist peeling, dicing, bonding, packaging, etc.).

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 18A, a substrate 9z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 9z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 30 is applied. Here, a state in which the imprint material 30 in the form of a plurality of droplets is applied on the substrate is shown.

  As shown in FIG. 18B, the imprint mold 6 is opposed to the imprint material 30 on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 18C, the substrate 9 provided with the imprint material 30 and the mold 6 are brought into contact with each other, and pressure is applied. The imprint material 30 is filled in the gap between the mold 6 and the workpiece 2z. When light is irradiated through the mold 6 as energy for curing in this state, the imprint material 30 is cured.

  As shown in FIG. 18D, when the imprint material 30 is cured and then the mold 6 and the substrate 9z are separated, a pattern of a cured product of the imprint material 30 is formed on the substrate 9z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the mold 6 is transferred to the imprint material 30. It will be done.

  As shown in FIG. 18 (e), when etching is performed using the pattern of the cured product as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the groove 5z and Become. As shown in FIG. 18 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1 Mold 2 Detection system 2a Image pick-up element (light receiving element)
3 Relay optical system (adjustment means of the first embodiment)
3b Drive mechanism (adjustment means of the first embodiment)
6a Mold side mark 9 Substrate (object)
13, 14 Replica mold (object)
9a Substrate side mark 10 Optical member (adjustment means of fifth and sixth embodiments)
11 Drive mechanism (adjustment means of fifth and sixth embodiments) (placement means)
30 imprint material 55 drive mechanism 55 (adjustment means of the seventh embodiment)
80 Optical member (Adjustment means of second to fourth embodiments)
81 Drive mechanism (adjustment means of the second to fourth embodiments)
100, 200, 300, 200, 500, 600, 700 Imprint apparatus

Claims (25)

An imprint apparatus that forms a pattern of an imprint material on an object using a mold,
Image detecting means comprising a light receiving element for receiving light from the mark provided on at least one of the mold and the object through the mold;
An imprint apparatus comprising: an adjusting unit that adjusts a focus state of an image formed by light from the mark on the light receiving element according to a type of the mold used for forming the pattern.   The imprint apparatus according to claim 1, wherein the adjusting unit is a unit that reduces a change in the focus state due to a change in a type of a mold used for forming the pattern.   3. The imprint apparatus according to claim 1, wherein an optical path length corresponding to transmission of the light through the mold differs according to a type of the mold.   The adjustment means is different depending on the type of the mold, the information indicating the presence or absence of the concave portion of the mold, the information indicating the thickness of the mold, the information indicating the position of the mark formed on the mold, The imprint apparatus according to any one of claims 1 to 3, wherein the focus state is adjusted based on at least one of information indicating a material of a mold. 5. The adjusting device according to claim 1, wherein the adjusting unit adjusts the focus state by driving at least one of the optical member and the light receiving element in the optical path of the light along the optical path of the light. The imprint apparatus according to any one of the above.   5. The imprint according to claim 1, wherein the adjustment unit adjusts the focus state by adjusting an optical path length of the light from the mark to the light receiving element. 6. apparatus. The mold used for forming the pattern is a first mold having an optical path length of a first distance for transmitting the light, or a second distance having an optical path length of a second distance shorter than the first distance for transmitting the light. 2 types,
The adjusting means includes an optical member including a portion where an optical path length of the light is an optical path length that complements a difference between the first distance and the second distance;
When the pattern is formed using the first mold, the light is not transmitted through the portion, and when the pattern is formed using the second mold, the light is transmitted through the portion. The imprint apparatus according to claim 6, wherein the adjusting unit adjusts the optical path length. The adjustment means further includes a control means for controlling the image detection means,
8. The control unit according to claim 7, wherein the control unit controls the image detection unit so that an optical path of the light is an optical path corresponding to a type of a mold used for forming the pattern and a position of the part. The imprint apparatus described.   The adjusting means includes an optical member including a plurality of portions having different optical path lengths for transmitting the light, and the optical path of the light includes the type of mold used for forming the pattern and the positions of the plurality of portions. The imprinting apparatus according to claim 6, further comprising: a control unit that controls the image detection unit so that an optical path corresponding to The image detection means includes a detection optical system that guides light from the mark to the light receiving element,
10. The imprint apparatus according to claim 8, wherein the control unit changes the optical path of the light by moving the detection optical system in a direction intersecting the optical axis.   The partition part which separates the 1st space where the said image detection means is arrange | positioned, and the 2nd space which communicates with the space where the said pattern formation is carried out, It is any one of Claim 6 thru | or 10 characterized by the above-mentioned. Imprint device.   12. The imprint apparatus according to claim 8, wherein, when the optical paths of the light are different, positions at which marks for generating the light forming the image are provided are different. The light is first light, and the imprint material is an imprint material that receives and cures second light having a wavelength band different from that of the first light,
The imprint apparatus according to claim 6, wherein the first light is transmitted through the mold in an oblique direction with respect to an optical axis of the second light. The imprint apparatus according to any one of claims 7 to 13, wherein the optical member is fixedly disposed on a side opposite to a side on which the object is disposed with respect to the mold.   The imprint apparatus according to claim 7, wherein the adjustment unit further includes an arrangement unit that drives the optical member to arrange the portion at a position corresponding to a type of a mold used for forming the pattern. . The light is first light, and the imprint material is an imprint material that receives and cures second light having a wavelength band different from that of the first light,
The imprint apparatus according to claim 15, wherein the optical member is also arranged in the optical path of the second light by the arrangement means arranging the portion in the optical path of the light. The light is first light, and the imprint material is an imprint material that receives and cures second light having a wavelength band different from that of the first light,
The optical member is a first optical member,
The arrangement means is a first arrangement means,
The first arrangement means arranges the first optical member in the optical path of the first light and outside the optical path of the second light, and arranges the second optical member in the optical path of the second light. The imprint apparatus according to claim 15, further comprising second arrangement means for arranging.   The imprint apparatus according to claim 6, wherein the adjusting unit is a mounting unit that can mount an optical member on the mold according to a type of the mold used for forming the pattern. The mold used for forming the pattern is a first mold having an optical path length of a first distance for transmitting the light, or a second distance having an optical path length of a second distance shorter than the first distance for transmitting the light. 2 types,
The optical member is an optical member in which an optical path length corresponding to the transmission of the light is an optical path length that complements a difference between the first distance and the second distance,
The above-mentioned placing means is
When the mold used for forming the pattern is the first mold, the optical member is not placed on the mold,
19. The imprint apparatus according to claim 18, wherein when the mold used for forming the pattern is the second mold, the optical member is disposed on the mold.   The said 2nd type | mold has a recessed part on the opposite side to the side which opposes the said object, The said mounting means mounts the said optical member in the said recessed part, The Claim 18 or 19 characterized by the above-mentioned. Imprint device.   21. The image according to any one of claims 1 to 20, wherein the image is an image formed by light from a mark provided on the substrate and a mark provided on the mold by the light receiving element. Imprint device.   2. The focus state of the image is finely adjusted by moving the optical element on the optical path of the light along the optical path after the adjustment unit roughly adjusts the focus state of the image. The imprint apparatus according to any one of 21. An imprint apparatus that forms a pattern of an imprint material on an object using a mold,
Image detecting means comprising a light receiving element for receiving light from the mark provided on at least one of the mold and the object through the mold;
In the case where the mold is a first mold having a first optical path length through which the light is transmitted or a second mold having a second distance shorter than the first distance through which the light is transmitted. An optical member including a portion where the optical path length of the light is an optical path length that complements the difference between the first distance and the second distance;
When the pattern is formed using the first mold, the optical path of the light is a first optical path toward the image detecting unit without passing through the portion from the mark provided at the first position. Controlling the image detection means;
When the pattern is formed using the second mold, the light path of the light passes through the portion from a mark provided at a second position different from the first position, and travels toward the image detection means. Control means for controlling the image detection means so as to be an optical path of the imprint apparatus. An imprint method for forming a pattern of an imprint material on an object using a mold,
Obtaining information indicating the type of mold used to form the pattern;
Adjusting the focus state of an image formed on the light receiving element by the light from the mark provided on at least one of the mold and the object based on the acquired information;
And a step of detecting the image in a state in which the focus state is adjusted. Forming a pattern on the object using the imprint apparatus according to any one of claims 1 to 23;
And a step of processing the object on which the pattern is formed in the step.

Images