SG11201609890VA - Imprint apparatus and method of manufacturing article - Google Patents

Imprint apparatus and method of manufacturing article

Info

Publication number
SG11201609890VA
SG11201609890VA SG11201609890VA SG11201609890VA SG11201609890VA SG 11201609890V A SG11201609890V A SG 11201609890VA SG 11201609890V A SG11201609890V A SG 11201609890VA SG 11201609890V A SG11201609890V A SG 11201609890VA SG 11201609890V A SG11201609890V A SG 11201609890VA
Authority
SG
Singapore
Prior art keywords
imprint apparatus
manufacturing article
article
manufacturing
imprint
Prior art date
Application number
SG11201609890VA
Inventor
Hiroshi Sato
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG11201609890VA publication Critical patent/SG11201609890VA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
SG11201609890VA 2014-06-09 2015-05-15 Imprint apparatus and method of manufacturing article SG11201609890VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014119110A JP6415120B2 (en) 2014-06-09 2014-06-09 Imprint apparatus and article manufacturing method
PCT/JP2015/064668 WO2015190259A1 (en) 2014-06-09 2015-05-15 Imprint apparatus and method of manufacturing article

Publications (1)

Publication Number Publication Date
SG11201609890VA true SG11201609890VA (en) 2016-12-29

Family

ID=54833364

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201609890VA SG11201609890VA (en) 2014-06-09 2015-05-15 Imprint apparatus and method of manufacturing article

Country Status (7)

Country Link
US (1) US10228616B2 (en)
JP (1) JP6415120B2 (en)
KR (1) KR101937009B1 (en)
CN (1) CN106415787B (en)
SG (1) SG11201609890VA (en)
TW (1) TWI625761B (en)
WO (1) WO2015190259A1 (en)

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NL2005975A (en) * 2010-03-03 2011-09-06 Asml Netherlands Bv Imprint lithography.
JP6799397B2 (en) * 2015-08-10 2020-12-16 キヤノン株式会社 Imprinting equipment and manufacturing method of articles
JP6679328B2 (en) * 2016-02-01 2020-04-15 キヤノン株式会社 Imprint apparatus, control method, and article manufacturing method
WO2019078060A1 (en) * 2017-10-17 2019-04-25 キヤノン株式会社 Imprint device and article manufacturing method
CN111247623B (en) * 2017-10-17 2024-03-08 佳能株式会社 Imprint apparatus and article manufacturing method
JP7116552B2 (en) * 2018-02-13 2022-08-10 キヤノン株式会社 IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD
CN112584996A (en) * 2018-07-03 2021-03-30 泰克瑞典公司 Method and mould for embossing
US10976657B2 (en) * 2018-08-31 2021-04-13 Canon Kabushiki Kaisha System and method for illuminating edges of an imprint field with a gradient dosage
JP7121653B2 (en) * 2018-12-28 2022-08-18 キヤノン株式会社 Film forming apparatus and article manufacturing method
JP7327973B2 (en) * 2019-03-29 2023-08-16 キヤノン株式会社 IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD
JP7337670B2 (en) * 2019-11-15 2023-09-04 キヤノン株式会社 IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD
KR102227885B1 (en) * 2020-06-02 2021-03-15 주식회사 기가레인 Transfer apparatus capable of pattern alignment
KR102586152B1 (en) * 2020-11-04 2023-10-06 한국기계연구원 Manufacturing apparatus and method of polarization filter

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US6955767B2 (en) * 2001-03-22 2005-10-18 Hewlett-Packard Development Company, Lp. Scanning probe based lithographic alignment
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US20080160129A1 (en) 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
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WO2006118284A1 (en) * 2005-04-27 2006-11-09 Semiconductor Energy Laboratory Co., Ltd. Pll circuit and semiconductor device having the same
US7803308B2 (en) * 2005-12-01 2010-09-28 Molecular Imprints, Inc. Technique for separating a mold from solidified imprinting material
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Also Published As

Publication number Publication date
KR20170010001A (en) 2017-01-25
CN106415787B (en) 2019-06-18
JP2015233071A (en) 2015-12-24
US10228616B2 (en) 2019-03-12
TWI625761B (en) 2018-06-01
US20170023857A1 (en) 2017-01-26
CN106415787A (en) 2017-02-15
WO2015190259A1 (en) 2015-12-17
JP6415120B2 (en) 2018-10-31
KR101937009B1 (en) 2019-01-09
TW201601197A (en) 2016-01-01

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