SG10201606137YA - Current forming of resistive random access memory (rram) cell filament - Google Patents

Current forming of resistive random access memory (rram) cell filament

Info

Publication number
SG10201606137YA
SG10201606137YA SG10201606137YA SG10201606137YA SG10201606137YA SG 10201606137Y A SG10201606137Y A SG 10201606137YA SG 10201606137Y A SG10201606137Y A SG 10201606137YA SG 10201606137Y A SG10201606137Y A SG 10201606137YA SG 10201606137Y A SG10201606137Y A SG 10201606137YA
Authority
SG
Singapore
Prior art keywords
rram
random access
access memory
resistive random
current forming
Prior art date
Application number
SG10201606137YA
Other languages
English (en)
Inventor
Santosh Hariharan
Hieu Van Tran
Feng Zhou
Xian Liu
Steven Lemke
Nhan Do
Zhixian Chen
Xinpeng Wang
Original Assignee
Silicon Storage Tech Inc
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Storage Tech Inc, Agency Science Tech & Res filed Critical Silicon Storage Tech Inc
Priority to SG10201606137YA priority Critical patent/SG10201606137YA/en
Priority to KR1020197005711A priority patent/KR102155461B1/ko
Priority to JP2019503910A priority patent/JP6959325B2/ja
Priority to US15/597,709 priority patent/US10276236B2/en
Priority to EP17834901.5A priority patent/EP3491556A4/en
Priority to PCT/US2017/033170 priority patent/WO2018022174A1/en
Priority to CN201780046525.0A priority patent/CN109863489B/zh
Priority to TW106120620A priority patent/TWI643198B/zh
Publication of SG10201606137YA publication Critical patent/SG10201606137YA/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0011RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0064Verifying circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/24Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • H10N70/245Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/883Oxides or nitrides
    • H10N70/8833Binary metal oxides, e.g. TaOx
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0064Verifying circuits or methods
    • G11C2013/0066Verify correct writing whilst writing is in progress, e.g. by detecting onset or cessation of current flow in cell and using the detector output to terminate writing
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0078Write using current through the cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0083Write to perform initialising, forming process, electro forming or conditioning
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0088Write with the simultaneous writing of a plurality of cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0092Write characterized by the shape, e.g. form, length, amplitude of the write pulse
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
SG10201606137YA 2016-07-26 2016-07-26 Current forming of resistive random access memory (rram) cell filament SG10201606137YA (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SG10201606137YA SG10201606137YA (en) 2016-07-26 2016-07-26 Current forming of resistive random access memory (rram) cell filament
KR1020197005711A KR102155461B1 (ko) 2016-07-26 2017-05-17 저항성 랜덤 액세스 메모리(rram) 셀 필라멘트의 전류 형성
JP2019503910A JP6959325B2 (ja) 2016-07-26 2017-05-17 抵抗変化型メモリ(rram)セルフィラメントの電流形成
US15/597,709 US10276236B2 (en) 2016-07-26 2017-05-17 Resistive random access memory (RRAM) cell filament formation using current waveforms
EP17834901.5A EP3491556A4 (en) 2016-07-26 2017-05-17 PRODUCTION OF A CELL FILM OF A RESISTIVE DIRECT ACCESS MEMORY (RRAM) BY MEANS OF POWER
PCT/US2017/033170 WO2018022174A1 (en) 2016-07-26 2017-05-17 Current forming of resistive random access memory (rram) cell filament
CN201780046525.0A CN109863489B (zh) 2016-07-26 2017-05-17 电阻式随机存取存储器(rram)单元细丝的电流形成
TW106120620A TWI643198B (zh) 2016-07-26 2017-06-20 電阻式隨機存取記憶體(rram)單元細絲的電流形成

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201606137YA SG10201606137YA (en) 2016-07-26 2016-07-26 Current forming of resistive random access memory (rram) cell filament

Publications (1)

Publication Number Publication Date
SG10201606137YA true SG10201606137YA (en) 2018-02-27

Family

ID=61009967

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201606137YA SG10201606137YA (en) 2016-07-26 2016-07-26 Current forming of resistive random access memory (rram) cell filament

Country Status (8)

Country Link
US (1) US10276236B2 (zh)
EP (1) EP3491556A4 (zh)
JP (1) JP6959325B2 (zh)
KR (1) KR102155461B1 (zh)
CN (1) CN109863489B (zh)
SG (1) SG10201606137YA (zh)
TW (1) TWI643198B (zh)
WO (1) WO2018022174A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220277791A1 (en) * 2019-08-02 2022-09-01 Peking University Resistive random access memory operation circuit and operation method
US11049559B1 (en) * 2020-06-11 2021-06-29 Sandisk Technologies Llc Subthreshold voltage forming of selectors in a crosspoint memory array
CN114267393B (zh) * 2021-06-02 2023-12-26 青岛昇瑞光电科技有限公司 非易失性存储器及其导电细丝产生方法、设定/重置方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187228B1 (en) * 2001-06-22 2007-03-06 Quicklogic Corporation Method of programming an antifuse
TWI355661B (en) * 2003-12-18 2012-01-01 Panasonic Corp Method for using a variable-resistance material as
DE102005041648A1 (de) * 2004-09-08 2006-07-27 Schimmel, Thomas, Prof. Dr. Gate-kontrollierter atomarer Schalter
KR100699837B1 (ko) 2005-04-04 2007-03-27 삼성전자주식회사 반도체 메모리 장치 및 반도체 메모리 장치의 프로그래밍방법
US7372725B2 (en) 2005-08-15 2008-05-13 Infineon Technologies Ag Integrated circuit having resistive memory
KR100809339B1 (ko) 2006-12-20 2008-03-05 삼성전자주식회사 저항체를 이용한 비휘발성 메모리 장치 및 그 구동 방법
US7898847B2 (en) 2007-03-08 2011-03-01 Qimonda Ag Method to prevent overreset
US8305793B2 (en) * 2008-05-16 2012-11-06 Qimonda Ag Integrated circuit with an array of resistance changing memory cells
JP5132703B2 (ja) * 2010-03-23 2013-01-30 株式会社東芝 不揮発性半導体記憶装置
US8625337B2 (en) * 2010-05-06 2014-01-07 Qualcomm Incorporated Method and apparatus of probabilistic programming multi-level memory in cluster states of bi-stable elements
US9437297B2 (en) * 2010-06-14 2016-09-06 Crossbar, Inc. Write and erase scheme for resistive memory device
JP5300798B2 (ja) * 2010-07-28 2013-09-25 株式会社東芝 半導体記憶装置
TWI446352B (zh) * 2010-09-23 2014-07-21 Ind Tech Res Inst 電阻式記憶體及其驗證方法
JP5619296B2 (ja) * 2010-11-19 2014-11-05 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. メムリスティブデバイスを切り替えるための方法及び回路
US8930174B2 (en) * 2010-12-28 2015-01-06 Crossbar, Inc. Modeling technique for resistive random access memory (RRAM) cells
JP2012174766A (ja) * 2011-02-18 2012-09-10 Toshiba Corp 不揮発性抵抗変化素子
JP5222380B2 (ja) * 2011-05-24 2013-06-26 シャープ株式会社 可変抵抗素子のフォーミング処理方法および不揮発性半導体記憶装置
US9792985B2 (en) * 2011-07-22 2017-10-17 Virginia Tech Intellectual Properties, Inc. Resistive volatile/non-volatile floating electrode logic/memory cell
US8730708B2 (en) 2011-11-01 2014-05-20 Micron Technology, Inc. Performing forming processes on resistive memory
US8817530B2 (en) * 2011-11-17 2014-08-26 Everspin Technologies, Inc. Data-masked analog and digital read for resistive memories
US20130187116A1 (en) * 2012-01-19 2013-07-25 Globalfoundries Singapore Pte Ltd RRAM Device With Free-Forming Conductive Filament(s), and Methods of Making Same
US8976568B1 (en) * 2012-01-20 2015-03-10 Adesto Technologies Corporation Circuits and methods for programming variable impedance elements
KR101996020B1 (ko) * 2012-02-08 2019-07-04 삼성전자주식회사 가변 저항 메모리 장치 및 그것의 쓰기 방법
JP5655173B2 (ja) * 2012-03-29 2015-01-14 パナソニックIpマネジメント株式会社 クロスポイント型不揮発性記憶装置とその駆動方法
US9165644B2 (en) * 2012-05-11 2015-10-20 Axon Technologies Corporation Method of operating a resistive memory device with a ramp-up/ramp-down program/erase pulse
JP5911814B2 (ja) * 2012-09-12 2016-04-27 株式会社東芝 抵抗変化メモリ
KR102060488B1 (ko) * 2012-12-27 2019-12-30 삼성전자주식회사 불휘발성 랜덤 액세스 메모리 장치 및 그것의 데이터 읽기 방법
US9336876B1 (en) * 2013-03-15 2016-05-10 Crossbar, Inc. Soak time programming for two-terminal memory
US9269902B2 (en) 2013-12-26 2016-02-23 Intermolecular, Inc. Embedded resistors for resistive random access memory cells
JP5774154B1 (ja) * 2014-03-25 2015-09-02 ウィンボンド エレクトロニクス コーポレーション 抵抗変化型メモリ
JP6425137B2 (ja) * 2014-06-12 2018-11-21 パナソニックIpマネジメント株式会社 データ記録方法および不揮発性記憶装置
KR102140786B1 (ko) * 2014-06-27 2020-08-03 삼성전자주식회사 저항성 메모리 장치 및 상기 저항성 메모리 장치의 동작 방법
KR102230195B1 (ko) * 2014-07-28 2021-03-19 삼성전자주식회사 메모리 장치 및 상기 메모리 장치의 동작 방법
KR20160016386A (ko) 2014-08-05 2016-02-15 에스케이하이닉스 주식회사 라이트 드라이버, 이를 포함하는 저항변화 메모리 장치 및 동작 방법
US9646691B2 (en) * 2014-10-24 2017-05-09 Sandisk Technologies Llc Monolithic three dimensional memory arrays with staggered vertical bit lines and dual-gate bit line select transistors
US9437318B2 (en) 2014-10-24 2016-09-06 Sandisk Technologies Llc Adaptive program pulse duration based on temperature
EP3029682A1 (en) * 2014-12-02 2016-06-08 IMEC vzw A method for operating a conductive bridging memory device

Also Published As

Publication number Publication date
TWI643198B (zh) 2018-12-01
EP3491556A4 (en) 2020-04-01
US20180033482A1 (en) 2018-02-01
TW201804475A (zh) 2018-02-01
KR20190044068A (ko) 2019-04-29
JP2019527910A (ja) 2019-10-03
US10276236B2 (en) 2019-04-30
EP3491556A1 (en) 2019-06-05
KR102155461B1 (ko) 2020-09-14
JP6959325B2 (ja) 2021-11-02
WO2018022174A1 (en) 2018-02-01
CN109863489A (zh) 2019-06-07
CN109863489B (zh) 2024-01-05

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