SG10201407353UA - Substrate holder, polishing apparatus, polishing method, and retaining ring - Google Patents

Substrate holder, polishing apparatus, polishing method, and retaining ring

Info

Publication number
SG10201407353UA
SG10201407353UA SG10201407353UA SG10201407353UA SG10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA SG 10201407353U A SG10201407353U A SG 10201407353UA
Authority
SG
Singapore
Prior art keywords
polishing
retaining ring
substrate holder
polishing apparatus
polishing method
Prior art date
Application number
SG10201407353UA
Other languages
English (en)
Inventor
Satoru Yamaki
Hozumi Yasuda
Keisuke Namiki
Osamu Nabeya
Makoto Fukushima
Shingo Togashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201407353UA publication Critical patent/SG10201407353UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201407353UA 2013-11-13 2014-11-07 Substrate holder, polishing apparatus, polishing method, and retaining ring SG10201407353UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013235210 2013-11-13
JP2014093840A JP6403981B2 (ja) 2013-11-13 2014-04-30 基板保持装置、研磨装置、研磨方法、およびリテーナリング

Publications (1)

Publication Number Publication Date
SG10201407353UA true SG10201407353UA (en) 2015-06-29

Family

ID=53044185

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407353UA SG10201407353UA (en) 2013-11-13 2014-11-07 Substrate holder, polishing apparatus, polishing method, and retaining ring

Country Status (6)

Country Link
US (1) US9815171B2 (enrdf_load_stackoverflow)
JP (1) JP6403981B2 (enrdf_load_stackoverflow)
KR (2) KR20150055566A (enrdf_load_stackoverflow)
CN (1) CN104625948B (enrdf_load_stackoverflow)
SG (1) SG10201407353UA (enrdf_load_stackoverflow)
TW (1) TWI614091B (enrdf_load_stackoverflow)

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JP2016155188A (ja) * 2015-02-24 2016-09-01 株式会社荏原製作所 リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法
US10293454B2 (en) * 2015-06-11 2019-05-21 Toshiba Memory Corporation Polishing head, polishing apparatus and polishing method
TWD179095S (zh) 2015-08-25 2016-10-21 荏原製作所股份有限公司 基板保持環
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
KR102561746B1 (ko) * 2016-07-25 2023-07-28 어플라이드 머티어리얼스, 인코포레이티드 Cmp를 위한 리테이닝 링
WO2019177841A1 (en) 2018-03-13 2019-09-19 Applied Materials, Inc. Consumable part monitoring in chemical mechanical polisher
TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
JP7287761B2 (ja) 2018-07-31 2023-06-06 株式会社荏原製作所 球面軸受の軸受半径決定方法
JP6446590B1 (ja) * 2018-08-09 2018-12-26 国立大学法人 東京大学 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置
KR102725357B1 (ko) * 2020-10-20 2024-11-06 주식회사 케이씨텍 리테이너링 및 이를 포함하는 기판 연마 장치
JP6927617B1 (ja) * 2020-11-19 2021-09-01 不二越機械工業株式会社 ワーク研磨装置およびトップリング用樹脂マット体
TWI826051B (zh) * 2022-10-19 2023-12-11 力晶積成電子製造股份有限公司 化學機械研磨裝置及研磨方法

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US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6077385A (en) 1997-04-08 2000-06-20 Ebara Corporation Polishing apparatus
JP3724911B2 (ja) 1997-04-08 2005-12-07 株式会社荏原製作所 ポリッシング装置
US5885135A (en) * 1997-04-23 1999-03-23 International Business Machines Corporation CMP wafer carrier for preferential polishing of a wafer
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
TW434095B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
JP3966908B2 (ja) * 1998-04-06 2007-08-29 株式会社荏原製作所 ポリッシング装置
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
JP2000233363A (ja) * 1999-02-16 2000-08-29 Ebara Corp ポリッシング装置及び方法
TW399007B (en) * 1999-03-04 2000-07-21 Vanguard Int Semiconduct Corp Floating ring of the chemical mechanical polishing head
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
JP3068086B1 (ja) * 1999-05-07 2000-07-24 株式会社東京精密 ウェ―ハ研磨装置
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JP4814677B2 (ja) 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
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JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
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JP5199691B2 (ja) 2008-02-13 2013-05-15 株式会社荏原製作所 研磨装置
US20100120335A1 (en) * 2008-11-07 2010-05-13 Novellus Systems, Inc. Partial Contact Wafer Retaining Ring Apparatus
TWI574785B (zh) * 2010-08-06 2017-03-21 應用材料股份有限公司 內扣環及外扣環
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JP5922965B2 (ja) * 2012-03-29 2016-05-24 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法

Also Published As

Publication number Publication date
CN104625948A (zh) 2015-05-20
US9815171B2 (en) 2017-11-14
TW201524679A (zh) 2015-07-01
JP6403981B2 (ja) 2018-10-10
KR20180101303A (ko) 2018-09-12
CN104625948B (zh) 2019-04-09
TWI614091B (zh) 2018-02-11
KR102208160B1 (ko) 2021-01-27
JP2015116656A (ja) 2015-06-25
US20150133038A1 (en) 2015-05-14
KR20150055566A (ko) 2015-05-21

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