SG10201404766WA - Semiconductor device and method of balancing surfaces of an embedded pcb unit with a dummy copper pattern - Google Patents
Semiconductor device and method of balancing surfaces of an embedded pcb unit with a dummy copper patternInfo
- Publication number
- SG10201404766WA SG10201404766WA SG10201404766WA SG10201404766WA SG10201404766WA SG 10201404766W A SG10201404766W A SG 10201404766WA SG 10201404766W A SG10201404766W A SG 10201404766WA SG 10201404766W A SG10201404766W A SG 10201404766WA SG 10201404766W A SG10201404766W A SG 10201404766WA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- copper pattern
- pcb unit
- embedded pcb
- dummy copper
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201361897176P | 2013-10-29 | 2013-10-29 | |
US14/329,464 US9449943B2 (en) | 2013-10-29 | 2014-07-11 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern |
Publications (1)
Publication Number | Publication Date |
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SG10201404766WA true SG10201404766WA (en) | 2015-05-28 |
Family
ID=52994482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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SG10201404766WA SG10201404766WA (en) | 2013-10-29 | 2014-08-08 | Semiconductor device and method of balancing surfaces of an embedded pcb unit with a dummy copper pattern |
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US (3) | US9449943B2 (zh) |
KR (1) | KR101798702B1 (zh) |
CN (3) | CN104576517B (zh) |
SG (1) | SG10201404766WA (zh) |
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2014
- 2014-07-11 US US14/329,464 patent/US9449943B2/en active Active
- 2014-08-06 TW TW103126865A patent/TWI608578B/zh active
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- 2014-08-18 KR KR1020140106691A patent/KR101798702B1/ko active IP Right Grant
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US10790158B2 (en) | 2020-09-29 |
CN109411410B (zh) | 2023-09-26 |
US20160351419A1 (en) | 2016-12-01 |
US20190109015A1 (en) | 2019-04-11 |
US9449943B2 (en) | 2016-09-20 |
CN104576517A (zh) | 2015-04-29 |
US20150115465A1 (en) | 2015-04-30 |
CN104576517B (zh) | 2018-10-16 |
CN117080161A (zh) | 2023-11-17 |
TWI608578B (zh) | 2017-12-11 |
US10177010B2 (en) | 2019-01-08 |
TW201517218A (zh) | 2015-05-01 |
KR20150051304A (ko) | 2015-05-12 |
CN109411410A (zh) | 2019-03-01 |
KR101798702B1 (ko) | 2017-11-16 |
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