SG11201508356SA - Testing head of electronic devices - Google Patents

Testing head of electronic devices

Info

Publication number
SG11201508356SA
SG11201508356SA SG11201508356SA SG11201508356SA SG11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA
Authority
SG
Singapore
Prior art keywords
electronic devices
testing head
testing
head
electronic
Prior art date
Application number
SG11201508356SA
Inventor
Stefano Felici
Raffaele Vallauri
Roberto Crippa
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201508356SA publication Critical patent/SG11201508356SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
SG11201508356SA 2013-04-09 2014-04-08 Testing head of electronic devices SG11201508356SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000561A ITMI20130561A1 (en) 2013-04-09 2013-04-09 HEAD OF MEASUREMENT OF ELECTRONIC DEVICES
PCT/IB2014/000528 WO2014167410A2 (en) 2013-04-09 2014-04-08 Testing head of electronic devices

Publications (1)

Publication Number Publication Date
SG11201508356SA true SG11201508356SA (en) 2015-11-27

Family

ID=48579233

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508356SA SG11201508356SA (en) 2013-04-09 2014-04-08 Testing head of electronic devices

Country Status (11)

Country Link
US (1) US9829508B2 (en)
EP (1) EP2984492B1 (en)
JP (1) JP6416205B2 (en)
KR (1) KR102146512B1 (en)
CN (1) CN105102990A (en)
IT (1) ITMI20130561A1 (en)
MY (1) MY177726A (en)
PH (1) PH12015502354B1 (en)
SG (1) SG11201508356SA (en)
TW (1) TWI636259B (en)
WO (1) WO2014167410A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6245876B2 (en) * 2013-07-26 2017-12-13 株式会社日本マイクロニクス Probe card
WO2016087369A2 (en) * 2014-12-04 2016-06-09 Technoprobe S.P.A. Testing head comprising vertical probes
CN116183986A (en) * 2014-12-30 2023-05-30 泰克诺探头公司 Method for manufacturing contact probes for test heads
US10151774B2 (en) * 2015-06-10 2018-12-11 Asm Technology Singapore Pte Ltd Electrical contact having electrical isolated members for contacting an electrical component
CN105353260B (en) * 2015-12-25 2019-01-08 东莞市海轮电子科技有限公司 A kind of test device and test method of connection terminal
IT201600079679A1 (en) * 2016-07-28 2018-01-28 Technoprobe Spa Measurement board for electronic devices
IT201600079694A1 (en) * 2016-07-28 2018-01-28 Technoprobe Spa Measuring head of electronic devices and relative measurement card
IT201600084921A1 (en) * 2016-08-11 2018-02-11 Technoprobe Spa Contact probe and relative measuring head of a test device for electronic devices
EP3607332A4 (en) * 2017-04-03 2021-01-06 Kes Systems & Service (1993) Pte Ltd. Electrical test apparatus having adjustable contact pressure
IT201700046645A1 (en) 2017-04-28 2018-10-28 Technoprobe Spa Measurement board for a test device of electronic devices
TWI663407B (en) * 2018-06-06 2019-06-21 中華精測科技股份有限公司 Probe card device and three-dimensional signal transfer structure
IT201900014208A1 (en) 2019-08-07 2021-02-07 Technoprobe Spa Measuring head of electronic devices and relative measuring card
CN111122927A (en) * 2019-12-24 2020-05-08 杭州易正科技有限公司 Integrated circuit test probe seat
KR102174269B1 (en) * 2020-09-22 2020-11-04 주식회사 새한마이크로텍 Probe assembly for inspection of chip parts
JP2022108835A (en) * 2021-01-14 2022-07-27 株式会社日本マイクロニクス Electrical connection device and manufacturing method for electrical connection device
IT202100022508A1 (en) * 2021-08-30 2023-03-02 Dmi S R L TAPERED DIAMETERS MEASURING HEAD WITH DOUBLE PARALLELOGRAM
KR20230152313A (en) * 2022-04-27 2023-11-03 (주)티에스이 Probe head with adjustable protrusion length of probe
KR20230152314A (en) * 2022-04-27 2023-11-03 (주)티에스이 Probe head with adjustable protrusion length of probe

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
US5175496A (en) * 1990-08-31 1992-12-29 Cray Research, Inc. Dual contact beam assembly for an IC test fixture
JPH04115167A (en) * 1990-09-06 1992-04-16 Nec Corp Pin head for wiring inspection machine
US5376889A (en) * 1991-10-10 1994-12-27 Hughes Aircraft Company System and method for detecting and locating flaws on or beneath a surface
JPH05340966A (en) * 1992-06-05 1993-12-24 Fujitsu Ltd Probe card
JP2799973B2 (en) * 1995-07-06 1998-09-21 日本電子材料株式会社 Vertically actuated probe card
KR0150334B1 (en) * 1995-08-17 1998-12-01 남재우 Probe card having vertical needle
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
JPH1138044A (en) * 1997-07-17 1999-02-12 Mitsubishi Electric Corp Perpendicular type probe card device
US6927586B2 (en) * 2000-03-06 2005-08-09 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
JP3486841B2 (en) * 2000-08-09 2004-01-13 日本電子材料株式会社 Vertical probe card
US20040135594A1 (en) * 2003-01-14 2004-07-15 Beaman Brian Samuel Compliant interposer assembly for wafer test and "burn-in" operations
WO2005050706A2 (en) * 2003-11-14 2005-06-02 Wentworth Laboratories, Inc. Die design with integrated assembly aid
CN101019473A (en) * 2004-05-20 2007-08-15 纳米纳克斯公司 High density interconnect system having rapid fabrication cycle
US20060066328A1 (en) * 2004-09-30 2006-03-30 Probelogic, Inc. Buckling beam probe test assembly
JP4860242B2 (en) * 2005-11-11 2012-01-25 東京エレクトロン株式会社 Probe device
US7345492B2 (en) * 2005-12-14 2008-03-18 Microprobe, Inc. Probe cards employing probes having retaining portions for potting in a retention arrangement
US7365553B2 (en) 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
DE202007016398U1 (en) * 2006-11-27 2008-02-21 Feinmetall Gmbh Contacting device for contacting an electrical DUT to be tested
US7554348B2 (en) * 2007-06-29 2009-06-30 Wentworth Laboratories, Inc. Multi-offset die head
KR101108726B1 (en) 2010-01-26 2012-02-29 삼성전기주식회사 Member for adjusting horizontality
KR101120405B1 (en) * 2010-02-12 2012-03-20 리노공업주식회사 Probe block assembly
JP2012103125A (en) 2010-11-10 2012-05-31 Micronics Japan Co Ltd Probe card

Also Published As

Publication number Publication date
CN105102990A (en) 2015-11-25
ITMI20130561A1 (en) 2014-10-10
JP2016520816A (en) 2016-07-14
EP2984492A2 (en) 2016-02-17
PH12015502354A1 (en) 2016-02-22
US9829508B2 (en) 2017-11-28
WO2014167410A3 (en) 2015-04-30
PH12015502354B1 (en) 2016-02-22
US20150309076A1 (en) 2015-10-29
KR20150140774A (en) 2015-12-16
TWI636259B (en) 2018-09-21
EP2984492B1 (en) 2017-01-04
KR102146512B1 (en) 2020-08-24
MY177726A (en) 2020-09-23
TW201500740A (en) 2015-01-01
WO2014167410A2 (en) 2014-10-16
JP6416205B2 (en) 2018-10-31

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