JPH1138044A - Perpendicular type probe card device - Google Patents
Perpendicular type probe card deviceInfo
- Publication number
- JPH1138044A JPH1138044A JP19264697A JP19264697A JPH1138044A JP H1138044 A JPH1138044 A JP H1138044A JP 19264697 A JP19264697 A JP 19264697A JP 19264697 A JP19264697 A JP 19264697A JP H1138044 A JPH1138044 A JP H1138044A
- Authority
- JP
- Japan
- Prior art keywords
- guide plate
- guide
- card device
- probe card
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は半導体ＩＣのウエ
ハテストに使用する垂直型プローブカード装置に係り、
特にそのプローブ針をガイドするガイド板の保持構造に
関するものである。The present invention relates to a vertical probe card device used for a semiconductor IC wafer test.
In particular, the present invention relates to a structure for holding a guide plate for guiding the probe needle.
【０００２】[0002]
【従来の技術】垂直型プローブカードでは、ＩＢＭ社の
開発した「コブラプローブカード」がよく知られてい
る。その概要については、メーカのカタログ、そして雑
誌日経マイクロデバイス１９９６年９月号のページ１０
１ないし１０６で知ることができる。その構造について
の詳しい内容の紹介はないが、前述の雑誌のページ１０
６の図８（ａ）にその概要が開示されている。図３は前
述した従来の垂直型プローブカード装置におけるプロー
ブ針とガイド板の構成を示す概略図である。図におい
て、１は湾曲部１ａを有するピン形状で先端１ｂが被検
査基板であるウエハの電極（図示せず）に電気的に接触
するプローブ針、２は複数のプローブ針１を垂下して固
定する上側ガイド板、３は上側ガイド板２の下方に対向
して所定の間隔をあけて平行に配置され、プローブ針１
の先端１ｂに対応する位置にプローブ針１が貫通するガ
イド孔３ａを有する下側ガイド板、４は両ガイド板２、
３間に配置されプローブ針１の先端が所定の長さ（通常
１ｍｍ以下）突出する状態となるよう両ガイド板２、３
間を所定の間隔に設定する複数の間隔部材である。2. Description of the Related Art As a vertical probe card, "Cobra Probe Card" developed by IBM Corporation is well known. For an overview, see the manufacturer's catalog and page 10 of the September 1996 issue of Nikkei Microdevices Magazine.
1 to 106. There is no detailed description of its structure, but page 10 of the aforementioned magazine
FIG. 8A of FIG. 6 discloses the outline. FIG. 3 is a schematic view showing the configuration of a probe needle and a guide plate in the conventional vertical probe card device described above. In the drawing, reference numeral 1 denotes a pin having a curved portion 1a, a probe needle 1b having a tip 1b electrically contacting an electrode (not shown) of a wafer as a substrate to be inspected, and 2 a plurality of probe needles 1 hanging down and fixed. The upper guide plate 3 is disposed in parallel with a predetermined interval facing the lower side of the upper guide plate 2 so that the probe needle 1
The lower guide plate 4 having a guide hole 3a through which the probe needle 1 penetrates at a position corresponding to the tip 1b of the
The two guide plates 2, 3 are arranged between the guide plates 2 and 3 so that the tip of the probe needle 1 projects a predetermined length (usually 1 mm or less).
There are a plurality of spacing members for setting the spacing to a predetermined spacing.
【０００３】次に動作について説明する。ウエハテスト
時には所定の長さδ1（先端がふらつかない程度）プロ
ーブ針１の先端１ｂが下側ガイド板３から突出し被検査
基板であるウエハの電極と電気的に接触するようコンタ
クトされ試験信号の送受信をさせる。この時ウエハに接
触するプローブ針１は、湾曲部１ａによって垂直方向に
可撓性を有しその先端１ｂが所定圧でウエハを押圧した
状態でウエハの電極と電気的に導通する。Next, the operation will be described. At the time of wafer test, a predetermined length δ 1 (to the extent that the tip does not fluctuate), the tip 1b of the probe needle 1 protrudes from the lower guide plate 3 and is brought into contact with the electrode of the wafer, which is the substrate to be inspected, so that the test signal Send and receive. At this time, the probe needle 1 which comes into contact with the wafer has flexibility in the vertical direction due to the curved portion 1a, and is electrically connected to the electrode of the wafer with its tip 1b pressing the wafer at a predetermined pressure.
【０００４】なお、このようなウエハテストにおいて、
プローブ針１とウエハが何回もコンタクトすれば、酸化
アルミなどの異物がプローブ針１の先端１ｂに付着す
る。一般的にプローブ針１は酸化アルミに比べて硬度が
低い、即ち、軟らかいためにプローブ針１の先端１ｂに
異物が付着しやすい。酸化アルミは電気伝導度が低いた
めに接触抵抗が高くなり、最終的にはコンタクト不良と
なり半導体ＩＣの良、不良に関係なく不良品の判定をし
歩留りの低下を招くことになる。このため、プローブ針
１の先端１ｂを研磨ないし洗浄して付着した異物を除去
し、先端１ｂを清浄な初期状態にして良好なコンタクト
を得る必要がある。In such a wafer test,
If the probe needle 1 comes into contact with the wafer many times, foreign substances such as aluminum oxide adhere to the tip 1b of the probe needle 1. Generally, the probe needle 1 has a lower hardness than aluminum oxide, that is, because it is soft, foreign matter easily adheres to the tip 1b of the probe needle 1. Aluminum oxide has a low electrical conductivity, and therefore has a high contact resistance. Eventually, a contact failure occurs, and a defective product is determined regardless of whether the semiconductor IC is good or defective, and the yield is reduced. For this reason, it is necessary to polish or wash the tip 1b of the probe needle 1 to remove the adhered foreign matter, and to make the tip 1b a clean initial state to obtain a good contact.
【０００５】[0005]
【発明が解決しようとする課題】従来の垂直型プローブ
カード装置は以上のように構成され、プローブ針１が貫
通する下側ガイド板３は上側ガイド板２との間隔を間隔
部材４によって固定されプローブ針１の突出する先端長
さδ1をあまり長くできないためプローブ針１の下部先
端１ｂを研磨または洗浄するのが困難であるという問題
点があった。The conventional vertical probe card device is constructed as described above, and the lower guide plate 3 through which the probe needle 1 penetrates is fixed to the upper guide plate 2 by the spacing member 4. there is a problem that it is difficult to polish or clean the lower tip 1b of the probe 1 for the tip length [delta] 1 which projects the probe needle 1 can not be very long.
【０００６】この発明は上記のような問題点を解消する
ためになされたもので、プローブ針先端の研磨、洗浄が
容易にできる垂直型プローブカード装置を得ることを目
的とする。The present invention has been made to solve the above problems, and has as its object to provide a vertical probe card device capable of easily polishing and cleaning the tip of a probe needle.
【０００７】[0007]
【課題を解決するための手段】この発明の請求項１に係
る垂直型プローブカード装置は、上側ガイド板と、該上
側ガイド板に間隔をあけて対向し所定の位置に複数のガ
イド孔が形成された下側ガイド板と、上端が上記上側ガ
イド板に固着され下端が上記下側ガイド板の上記ガイド
孔を貫通して所定の長さ突出する複数のプローブ針と、
上記両ガイド板間に介在し上記間隔を所定の値に設定で
きるよう形成されたガイド板位置調整手段とで構成した
ものである。According to a first aspect of the present invention, there is provided a vertical probe card device, wherein an upper guide plate and a plurality of guide holes are formed at predetermined positions to face the upper guide plate at intervals. Lower guide plate, and a plurality of probe needles whose upper end is fixed to the upper guide plate and whose lower end projects through a predetermined length through the guide hole of the lower guide plate,
A guide plate position adjusting means interposed between the two guide plates and formed so as to be able to set the interval to a predetermined value.
【０００８】また、この発明の請求項２に係る垂直型プ
ローブカード装置は、請求項１において、ガイド板位置
調整手段は、一端がいずれか一方のガイド板に形成され
た貫通孔に回転可能に貫通しかつ軸方向に拘束され他端
が他方のガイド板の上記一方のガイド板の貫通孔に対応
する位置に形成されたねじ孔に螺合する複数の位置調整
棒で構成したものである。According to a second aspect of the present invention, there is provided a vertical probe card device according to the first aspect, wherein the guide plate position adjusting means is rotatable at one end into a through hole formed in one of the guide plates. It is constituted by a plurality of position adjusting rods which penetrate and are constrained in the axial direction, and the other ends of which are screwed into screw holes formed at positions corresponding to the through holes of the one guide plate of the other guide plate.
【０００９】また、この発明の請求項３に係る垂直型プ
ローブカード装置は、請求項１において、ガイド板位置
調整手段は、両ガイド板の対応する位置にそれぞれ形成
された複数対の貫通孔に両端がそれぞれ摺動可能に貫通
し両ガイド板間の広がる方向の間隔を規制する支柱と、
上記支柱をガイドとして上記両ガイド板間に介在し上記
両ガイド板を上記広がる方向に付勢するばね部材とで構
成したものである。According to a third aspect of the present invention, there is provided a vertical probe card device according to the first aspect, wherein the guide plate position adjusting means includes a plurality of pairs of through holes formed at corresponding positions of the two guide plates. A pillar that penetrates both ends slidably and regulates a gap in a spreading direction between both guide plates,
A spring member is interposed between the two guide plates using the support as a guide and biases the two guide plates in the expanding direction.
【００１０】[0010]
実施の形態１．以下、この発明の実施の形態１を図につ
いて説明する。図１はこの発明の実施の形態１による垂
直型プローブカード装置におけるプローブ針とガイド板
の構成を示す概略図であり、（Ａ）に通常のウエハテス
トする時の状態を示し、（Ｂ）にプローブ針を洗浄する
時の状態を示している。図において、５は湾曲部５ａを
有するピン形状で先端５ｂが被検査基板であるウエハ
（図示せず）の電極に電気的に接触するプローブ針、６
は複数のプローブ針５を所定位置に垂下して固定すると
ともにプローブ針１をさけた位置に複数の貫通孔６ａが
形成された上側ガイド板、上側ガイド板６と対向して所
定の間隔をあけて平行に配置され、プローブ針５の先端
５ｂに対応する位置にプローブ針５が貫通するガイド孔
７ａを有しかつ貫通孔６ａに対応する位置にねじ穴７ｂ
が形成された下側ガイド板、８は棒状で両ガイド板６、
７間に介在して設けられ上側ガイド板６の貫通孔６ａと
軸方向に拘束され回転可能に嵌合する一端部８ａと、下
側ガイド板７のねじ穴７ｂと螺合するねじが形成された
他端部８ｂを有し、両ガイド板６、７間を所定の間隔に
設定するガイド板位置調整手段としての位置調整棒であ
る。Embodiment 1 FIG. Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing the configuration of a probe needle and a guide plate in a vertical probe card device according to Embodiment 1 of the present invention. FIG. 1 (A) shows a state during a normal wafer test, and FIG. The state at the time of cleaning a probe needle is shown. In the figure, reference numeral 5 denotes a pin having a curved portion 5a, and a probe tip 5b whose tip 5b electrically contacts an electrode of a wafer (not shown) which is a substrate to be inspected.
Is an upper guide plate having a plurality of probe needles 5 hanging down at predetermined positions and having a plurality of through holes 6a formed at positions avoiding the probe needles 1 and facing the upper guide plate 6 at predetermined intervals. The probe needle 5 has a guide hole 7a at a position corresponding to the tip 5b of the probe needle 5 and a screw hole 7b at a position corresponding to the through hole 6a.
Are formed on the lower guide plate, and 8 is a rod-like
One end 8a is provided interposed between the upper guide plate 7 and is rotatably fitted in the through hole 6a of the upper guide plate 6 in the axial direction and is screwed into the screw hole 7b of the lower guide plate 7. And a position adjusting rod as guide plate position adjusting means for setting a predetermined interval between the two guide plates 6 and 7.
【００１１】次に動作について説明する。ウエハテスト
時には下側ガイド板７より所定長さδ1（通常１ｍｍ以
下）突出した図１−（Ａ）の状態のプローブ針５の先端
５ｂが湾曲部５ａの屈曲による所定圧で被検査基板であ
るウエハの電極（図示せず）と電気的に接触するようコ
ンタクトされ試験信号の送受信をさせる。また、プロー
ブ針５の先端５ｂを研磨または洗浄する場合は、支柱８
を他端部８ｂのねじが進む方向にそれぞれ均等に回転さ
せ両ガイド板６、７の間隔を狭めることによって図１−
（Ｂ）のようにプローブ針５の先端５ｂを図１−（Ａ）
に示す状態より長い長さδ2（通常数ｍｍ以上）突出さ
せた後、研磨または洗浄を実施する。Next, the operation will be described. In the wafer test, the tip 5b of the probe needle 5 in the state of FIG. 1A protruding from the lower guide plate 7 by a predetermined length δ 1 (usually 1 mm or less) is pressed against the substrate to be inspected by a predetermined pressure due to the bending of the curved portion 5a. A contact is made so as to make electrical contact with an electrode (not shown) of a certain wafer to transmit and receive a test signal. When the tip 5b of the probe needle 5 is polished or washed,
1 is evenly rotated in the direction in which the screw of the other end 8b advances, thereby narrowing the interval between the two guide plates 6 and 7.
FIG. 1- (A)
After projecting a length δ 2 (usually several mm or more) longer than the state shown in, polishing or cleaning is performed.
【００１２】このようにプローブ針５の先端５ｂの突出
した長さを支柱８を回転させるという簡単な操作で調整
できるようにしたので、プローブ針５の先端５ｂの研磨
または洗浄を容易にすることができる。また、プローブ
針５の突出を長くできることはプローブ針５の先端の状
態を容易に把握することができメンテナンスがよくな
る。さらに、研磨または洗浄の作業時に発生するごみな
どの異物が下側ガイド板７のガイド穴７ａに進入しても
ガイド孔７ａとプローブ針５の相対位置が変わることに
よって、異物の除去を容易とする。As described above, the protruding length of the tip 5b of the probe needle 5 can be adjusted by a simple operation of rotating the column 8, so that the polishing or cleaning of the tip 5b of the probe needle 5 is facilitated. Can be. In addition, the fact that the protruding length of the probe needle 5 can be increased allows the state of the tip of the probe needle 5 to be easily grasped, thereby improving maintenance. Further, even if foreign matter such as dust generated during the polishing or cleaning operation enters the guide hole 7a of the lower guide plate 7, the relative position between the guide hole 7a and the probe needle 5 changes, so that the foreign matter can be easily removed. I do.
【００１３】なお、上記実施の形態１の説明では、支柱
８の一端部８ａが上側ガイド板６に軸方向に拘束して嵌
合し他端部８ｂが下側ガイド板７と螺合するように構成
したものを示したが、支柱８の取付けを上下逆にして、
一端部８ａが下側ガイド板７に軸方向に拘束して嵌合さ
せ他端部８ｂが上側ガイド板６と螺合するよう構成して
も同様の効果を得ることはいうまでもない。In the description of the first embodiment, one end 8a of the column 8 is axially restrained and fitted to the upper guide plate 6, and the other end 8b is screwed with the lower guide plate 7. Is shown, but the mounting of the column 8 is turned upside down,
It is needless to say that the same effect can be obtained even if one end 8a is axially restrained and fitted to the lower guide plate 7 and the other end 8b is screwed to the upper guide plate 6.
【００１４】実施の形態２．図２はこの発明の実施の形
態２による垂直型プローブカード装置におけるプローブ
針とガイド板の構成を示す概略図であり、（Ａ）に通常
のウエハテスト時の状態を示し、（Ｂ）にプローブ針を
洗浄する時の状態を示している。図において、上記実施
の形態１におけると同様な部分は同一符号を付して説明
を省略する。９は上側ガイド板６と対向して所定の間隔
に配置され、プローブ針５の先端５ｂに対応する位置に
プローブ針５が貫通するガイド孔９ａが、また、貫通孔
６ａに対応する位置に貫通孔９ｂがそれぞれ形成された
下側ガイド板、１０は棒状で一端側は上側ガイド板６の
貫通孔６ａと他端側は下側ガイド板９の貫通孔９ｂにそ
れぞれ軸方向に摺動可能で、かつ両端にそれぞれ両ガイ
ド板６、９の間隔の広がりを規制する頭部１０ａ、１０
ｂが形成された複数の支柱、１１は支柱１０に嵌合する
ようにして両ガイド板６、９に介在し両ガイド板６、９
の間隔を広げる方向に付勢されたコイル状のばね部材、
１２は両ガイド板６、９の外縁を挟持し両ガイド板６、
９の間隔を狭める方向に押圧するガイド板ストッパで、
これら１０ないし１２でガイド板位置調整手段をなして
いる。Embodiment 2 FIG. 2A and 2B are schematic diagrams showing the configuration of a probe needle and a guide plate in a vertical probe card device according to Embodiment 2 of the present invention, wherein FIG. 2A shows a state during a normal wafer test, and FIG. The state at the time of washing a needle is shown. In the figure, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 9 denotes a guide hole 9a which is disposed at a predetermined interval facing the upper guide plate 6, and a guide hole 9a through which the probe needle 5 penetrates corresponds to the tip 5b of the probe needle 5 and a position which corresponds to the through hole 6a. The lower guide plate 10 in which the holes 9b are respectively formed is rod-shaped, one end of which is slidable in the axial direction with the through hole 6a of the upper guide plate 6 and the other end of which is slidable in the through hole 9b of the lower guide plate 9. And heads 10a, 10a at both ends for restricting the spread of the interval between the two guide plates 6, 9, respectively.
The plurality of struts 11 formed with b are interposed between the two guide plates 6 and 9 so as to be fitted to the struts 10 and the two guide plates 6 and 9
A coil-shaped spring member urged in a direction to widen the interval of
Reference numeral 12 sandwiches the outer edges of both guide plates 6 and 9 and
A guide plate stopper that presses in the direction to narrow the interval of 9,
These 10 to 12 constitute guide plate position adjusting means.
【００１５】次に動作について説明する。ウエハテスト
時は両ガイド板６、９の間隔は支柱１０の頭部１０ａ、
１０ｂで規制された図２−（Ａ）の状態、即ち下側ガイ
ド板９より所定長さ（通常１ｍｍ以下）突出したプロー
ブ針５先端５ｂが湾曲部５ａの屈曲による所定圧で被検
査基板であるウエハの電極（図示せず）と電気的に接触
するようコンタクトされ試験信号の送受信をさせる。ま
た、プローブ針５の先端５ｂを研磨または洗浄する場合
は、ガイド板ストッパ１２を動作させ両ガイド板６、９
の外縁を挟持して押圧し両ガイド板６、９の間隔を均等
に狭めることによって、図２−（Ｂ）のようにプローブ
針５の先端５ｂを長く（通常数ｍｍ以上）突出させた
後、研磨または洗浄を実施する。Next, the operation will be described. During the wafer test, the interval between the two guide plates 6 and 9 is the head 10 a of the support 10,
The state shown in FIG. 2A regulated by 10b, that is, the tip 5b of the probe needle 5 protruding from the lower guide plate 9 by a predetermined length (usually 1 mm or less) at the predetermined pressure due to the bending of the curved portion 5a, A contact is made so as to make electrical contact with an electrode (not shown) of a certain wafer to transmit and receive a test signal. When the tip 5b of the probe needle 5 is polished or cleaned, the guide plate stopper 12 is operated to operate the two guide plates 6, 9 respectively.
After the tip 5b of the probe needle 5 is protruded long (typically several mm or more) as shown in FIG. , Polishing or cleaning.
【００１６】このようにプローブ針５の突出した先端長
さを両ガイド板間のばね部材と両ガイド板を挟持するガ
イド板ストッパ１２の動作によって簡単な操作で調整で
きるようにしたので、プローブ針５先端５ｂの研磨また
は洗浄を作業性良く容易にすることができる。As described above, the length of the protruding tip of the probe needle 5 can be adjusted by a simple operation by the operation of the spring member between the two guide plates and the guide plate stopper 12 for sandwiching the two guide plates. Polishing or cleaning of the tip 5b can be facilitated with good workability.
【００１７】なお、上記実施の形態２の説明では支柱１
０の両端が両ガイド板６、９の嵌合孔６ａ、９ａとそれ
ぞれ軸方向に摺動可能のものを示したが、いずれか一方
は固定し他方のみ摺動可能にしても同様の効果が得られ
る。また、両ガイド板６、９を挟持する手段としてガイ
ド板ストッパ１２を用いたが、これに限定されるもので
はない。In the description of the second embodiment, the support 1
Although both ends of the reference numeral 0 are slidable in the axial direction with the fitting holes 6a and 9a of the guide plates 6 and 9, respectively, the same effect can be obtained even if one of them is fixed and only the other is slidable. can get. Further, the guide plate stopper 12 is used as a means for sandwiching the two guide plates 6 and 9, but the present invention is not limited to this.
【００１８】また、上記実施の形態１および２では、プ
ローブ針５の形状をコブラ型で説明したが、Ｌ型等の別
の形状のものでも同様の効果が得られることはいうまで
もない。Further, in the first and second embodiments, the probe needle 5 has been described as a cobra type, but it is needless to say that the same effect can be obtained with another shape such as an L type.
【００１９】[0019]
【発明の効果】以上のように、この発明の請求項１によ
れば、上側ガイド板と、該上側ガイド板に間隔をあけて
対向し所定の位置に複数のガイド孔が形成された下側ガ
イド板と、上端が上記上側ガイド板に固着され下端が上
記下側ガイド板の上記ガイド孔を貫通して所定の長さ突
出する複数のプローブ針と、上記両ガイド板間に介在し
上記間隔を所定の値に設定できるよう形成されたガイド
板位置調整手段とで構成したので、プローブ針先端の研
磨または洗浄が容易にできる垂直型プローブカード装置
が得られる効果がある。As described above, according to the first aspect of the present invention, the upper guide plate and the lower side having a plurality of guide holes formed at predetermined positions facing the upper guide plate at intervals. A guide plate, a plurality of probe needles having an upper end fixed to the upper guide plate and a lower end protruding a predetermined length through the guide hole of the lower guide plate, and the interval interposed between the two guide plates. And a guide plate position adjusting means formed so as to be able to set a predetermined value, the effect of obtaining a vertical probe card device which can easily polish or clean the tip of the probe needle.
【００２０】また、この発明の請求項２によれば、請求
項１において、ガイド板位置調整手段は、一端がいずれ
か一方のガイド板に形成された貫通孔に回転可能に貫通
しかつ軸方向に拘束され他端が他方のガイド板の上記一
方のガイド板の貫通孔に対応する位置に形成されたねじ
孔に螺合する複数の位置調整棒で構成されているので、
両ガイド板の間隔を簡単に調整できプローブ針先端の研
磨または洗浄が容易にできる垂直型プローブカード装置
が得られる効果がある。According to a second aspect of the present invention, in the first aspect, the guide plate position adjusting means has one end rotatably penetrating through a through hole formed in any one of the guide plates and extending in the axial direction. The other end is configured with a plurality of position adjusting rods screwed into screw holes formed at positions corresponding to the through holes of the one guide plate of the other guide plate,
There is an effect that a vertical probe card device can be obtained in which the distance between the two guide plates can be easily adjusted and the tip or end of the probe needle can be easily polished or cleaned.
【００２１】また、この発明の請求項３によれば、請求
項１において、ガイド板位置調整手段は、両ガイド板の
対応する位置にそれぞれ形成された複数対の貫通孔に両
端がそれぞれ摺動可能に貫通し両ガイド板間の広がる方
向の間隔を規制する支柱と、上記支柱をガイドとして上
記両ガイド板間に介在し上記両ガイド板を上記広がる方
向に付勢するばね部材とで構成されているので、両ガイ
ド板の間隔を簡単に調整できプローブ針先端の研磨また
は洗浄が作業性良く容易にできる垂直型プローブカード
装置が得られる効果がある。According to a third aspect of the present invention, in the first aspect, the guide plate position adjusting means slides at both ends into a plurality of pairs of through holes formed at corresponding positions of the two guide plates. A support member that penetrates as much as possible and regulates an interval in a spreading direction between the two guide plates; and a spring member that is interposed between the two guide plates using the support column as a guide and urges the two guide plates in the spreading direction. Therefore, there is an effect that a vertical probe card device can be obtained in which the distance between the two guide plates can be easily adjusted, and the tip or end of the probe needle can be easily polished or cleaned with good workability.
【図１】 この発明の実施の形態１による垂直型プロー
ブカード装置におけるプローブ針とガイド板の構成を示
し、（Ａ）に通常のウエハテスト時の状態を、（Ｂ）に
プローブ針を洗浄する時の状態をそれぞれ示す概略図で
ある。FIG. 1 shows a configuration of a probe needle and a guide plate in a vertical probe card device according to a first embodiment of the present invention. FIG. 1A shows a state during a normal wafer test, and FIG. It is the schematic which shows the state at the time of each.
【図２】 この発明の実施の形態２による垂直型プロー
ブカード装置におけるプローブ針とガイド板の構成を示
し、（Ａ）に通常のウエハテスト時の状態を、（Ｂ）に
プローブ針を洗浄する時の状態をそれぞれ示す概略図で
ある。FIG. 2 shows a configuration of a probe needle and a guide plate in a vertical probe card device according to a second embodiment of the present invention. FIG. 2A shows a state during a normal wafer test, and FIG. It is the schematic which shows the state at the time of each.
【図３】 従来の垂直型プローブカード装置におけるプ
ローブ針とガイド板の構成を示す概略図である。FIG. 3 is a schematic view showing a configuration of a probe needle and a guide plate in a conventional vertical probe card device.
５ プローブ針、５ｂ 先端、６ 上側ガイド板、７
下側ガイド板、７ａ ガイド孔、８ 位置調整棒（ガイ
ド板位置調整手段）、８ａ 一端部、８ｂ 他端部、９
下側ガイド板、９ａ ガイド孔、１０ 支柱、１０
ａ，１０ｂ 頭部、１１ ばね部材、１２ ガイド板ス
トッパ。5 Probe needle, 5b tip, 6 Upper guide plate, 7
Lower guide plate, 7a guide hole, 8 position adjusting rod (guide plate position adjusting means), 8a one end, 8b other end, 9
Lower guide plate, 9a guide hole, 10 columns, 10
a, 10b head, 11 spring member, 12 guide plate stopper.
Claims (3)
をあけて対向し所定の位置に複数のガイド孔が形成され
た下側ガイド板と、上端が上記上側ガイド板に固着され
下端が上記下側ガイド板の上記ガイド孔を貫通して所定
の長さ突出する複数のプローブ針と、上記両ガイド板間
に介在し上記間隔を所定の値に設定できるよう形成され
たガイド板位置調整手段とを備えたことを特徴とする垂
直型プローブカード装置。1. An upper guide plate, a lower guide plate facing the upper guide plate at intervals and having a plurality of guide holes formed at predetermined positions, an upper end fixed to the upper guide plate, and a lower end fixed to the upper guide plate. A plurality of probe needles projecting a predetermined length through the guide holes of the lower guide plate, and a guide plate position adjustment interposed between the two guide plates and formed so that the interval can be set to a predetermined value. And a vertical probe card device.
か一方のガイド板に形成された貫通孔に回転可能に貫通
しかつ軸方向に拘束され他端が他方のガイド板の上記一
方のガイド板の貫通孔に対応する位置に形成されたねじ
孔に螺合する複数の位置調整棒で構成されていることを
特徴とする請求項１に記載の垂直型プローブカード装
置。The guide plate position adjusting means has one end rotatably penetrating through a through hole formed in one of the guide plates, and is axially constrained, and the other end of the one guide plate of the other guide plate. 2. The vertical probe card device according to claim 1, comprising a plurality of position adjusting rods screwed into screw holes formed at positions corresponding to the through holes of the plate.
対応する位置にそれぞれ形成された複数対の貫通孔に両
端がそれぞれ摺動可能に貫通し両ガイド板間の広がる方
向の間隔を規制する支柱と、上記支柱をガイドとして上
記両ガイド板間に介在し上記両ガイド板を上記広がる方
向に付勢するばね部材とで構成されていることを特徴と
する請求項１に記載の垂直型プローブカード装置。3. The guide plate position adjusting means has both ends slidably penetrating through a plurality of pairs of through holes respectively formed at corresponding positions of the both guide plates, and regulates a gap in a spreading direction between the two guide plates. The vertical type according to claim 1, characterized in that the vertical type is constituted by a supporting member that is interposed between the two guide plates using the supporting member as a guide and biases the two guide plates in the expanding direction. Probe card device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19264697A JPH1138044A (en) | 1997-07-17 | 1997-07-17 | Perpendicular type probe card device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19264697A JPH1138044A (en) | 1997-07-17 | 1997-07-17 | Perpendicular type probe card device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1138044A true JPH1138044A (en) | 1999-02-12 |
Family
ID=16294720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19264697A Pending JPH1138044A (en) | 1997-07-17 | 1997-07-17 | Perpendicular type probe card device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1138044A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074108A3 (en) * | 1999-05-28 | 2002-07-11 | Spire Technologies Pte Ltd | An interface device |
| JP2008134248A (en) * | 2006-11-27 | 2008-06-12 | Feinmetall Gmbh | Apparatus and method for making contact with electric analyte to be inspected |
| JP2015025749A (en) * | 2013-07-26 | 2015-02-05 | 株式会社日本マイクロニクス | Probe card |
| JP2015184283A (en) * | 2014-03-25 | 2015-10-22 | 旺▲夕▼科技股▲分▼有限公司 | Vertical type probe module and its columnar support portion |
| CN105102990A (en) * | 2013-04-09 | 2015-11-25 | 泰克诺探头公司 | Testing head of electronic devices |
| JP2018503805A (en) * | 2014-12-04 | 2018-02-08 | テクノプローベ エス．ピー．エー． | Test head with vertical probe |
| WO2020032273A1 (en) * | 2018-08-09 | 2020-02-13 | オムロン株式会社 | Probe unit |
| JP2021018094A (en) * | 2019-07-18 | 2021-02-15 | オムロン株式会社 | Probe unit |
-
1997
- 1997-07-17 JP JP19264697A patent/JPH1138044A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000074108A3 (en) * | 1999-05-28 | 2002-07-11 | Spire Technologies Pte Ltd | An interface device |
| US6937036B1 (en) | 1999-05-28 | 2005-08-30 | Spire Technologies Pte Ltd. | Interface device an interface between testing equipment and an integrated circuit |
| DE102007054187B4 (en) | 2006-11-27 | 2018-08-02 | Feinmetall Gmbh | Contacting device for contacting an electrical test specimen to be tested and corresponding contacting method |
| US7795888B2 (en) | 2006-11-27 | 2010-09-14 | Feinmetall Gmbh | Contact device to contact an electrical test specimen to be tested and a corresponding contact process |
| JP4733684B2 (en) * | 2006-11-27 | 2011-07-27 | ファインメタル ゲーエムベーハー | Contact device and contact method for contacting an electrical object to be examined |
| JP2008134248A (en) * | 2006-11-27 | 2008-06-12 | Feinmetall Gmbh | Apparatus and method for making contact with electric analyte to be inspected |
| CN105102990A (en) * | 2013-04-09 | 2015-11-25 | 泰克诺探头公司 | Testing head of electronic devices |
| JP2015025749A (en) * | 2013-07-26 | 2015-02-05 | 株式会社日本マイクロニクス | Probe card |
| JP2015184283A (en) * | 2014-03-25 | 2015-10-22 | 旺▲夕▼科技股▲分▼有限公司 | Vertical type probe module and its columnar support portion |
| US10119991B2 (en) | 2014-03-25 | 2018-11-06 | Mpi Corporation | Vertical probe device and supporter used in the same |
| JP2018503805A (en) * | 2014-12-04 | 2018-02-08 | テクノプローベ エス．ピー．エー． | Test head with vertical probe |
| WO2020032273A1 (en) * | 2018-08-09 | 2020-02-13 | オムロン株式会社 | Probe unit |
| CN112534276A (en) * | 2018-08-09 | 2021-03-19 | 欧姆龙株式会社 | Probe unit |
| JP2021018094A (en) * | 2019-07-18 | 2021-02-15 | オムロン株式会社 | Probe unit |
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