SG10201404686YA - Resin mold for imprinting and method for producing same - Google Patents

Resin mold for imprinting and method for producing same

Info

Publication number
SG10201404686YA
SG10201404686YA SG10201404686YA SG10201404686YA SG10201404686YA SG 10201404686Y A SG10201404686Y A SG 10201404686YA SG 10201404686Y A SG10201404686Y A SG 10201404686YA SG 10201404686Y A SG10201404686Y A SG 10201404686YA SG 10201404686Y A SG10201404686Y A SG 10201404686YA
Authority
SG
Singapore
Prior art keywords
imprinting
resin mold
producing same
producing
same
Prior art date
Application number
SG10201404686YA
Other languages
English (en)
Inventor
Takahide Mizawa
Satoshi Uehara
Original Assignee
Soken Kagaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soken Kagaku Kk filed Critical Soken Kagaku Kk
Publication of SG10201404686YA publication Critical patent/SG10201404686YA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/40—Plastics, e.g. foam or rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG10201404686YA 2009-08-07 2010-08-06 Resin mold for imprinting and method for producing same SG10201404686YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009184915 2009-08-07
JP2010173812 2010-08-02

Publications (1)

Publication Number Publication Date
SG10201404686YA true SG10201404686YA (en) 2014-10-30

Family

ID=43544443

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404686YA SG10201404686YA (en) 2009-08-07 2010-08-06 Resin mold for imprinting and method for producing same

Country Status (9)

Country Link
US (1) US9354512B2 (ja)
EP (1) EP2463073B1 (ja)
JP (2) JPWO2011016549A1 (ja)
KR (1) KR20120046743A (ja)
CN (1) CN102470565B (ja)
CA (1) CA2768830C (ja)
DK (1) DK2463073T3 (ja)
SG (1) SG10201404686YA (ja)
WO (1) WO2011016549A1 (ja)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101010431B1 (ko) * 2003-12-27 2011-01-21 엘지디스플레이 주식회사 평판표시소자의 제조방법 및 장치
DK2602089T3 (da) 2010-08-06 2018-01-29 Soken Kagaku Kk Resinform til nanotryk og fremgangsmåde til fremstilling deraf
JP5292622B2 (ja) 2010-08-06 2013-09-18 綜研化学株式会社 樹脂製モールド、その製造方法およびその使用方法
TWI426624B (zh) * 2011-02-14 2014-02-11 私立中原大學 高效率發光二極體之製作方法
CN103392135A (zh) * 2011-02-22 2013-11-13 旭硝子株式会社 微细结构成形体和包括该微细结构成形体的液晶显示装置
US8804344B2 (en) * 2011-06-10 2014-08-12 Scott Moncrieff Injection molded control panel with in-molded decorated plastic film
CN103857509A (zh) * 2011-08-15 2014-06-11 约翰逊控制技术公司 适于增加脱模次数的半永久性工具涂层的增强
JP5653864B2 (ja) * 2011-08-18 2015-01-14 富士フイルム株式会社 ナノインプリント用のモールドの離型処理方法およびそれを用いた製造方法並びにモールド、ナノインプリント方法およびパターン化基板の製造方法
US9278857B2 (en) 2012-01-31 2016-03-08 Seagate Technology Inc. Method of surface tension control to reduce trapped gas bubbles
JP6015140B2 (ja) * 2012-06-01 2016-10-26 大日本印刷株式会社 ナノインプリントモールドおよびその製造方法
KR101705743B1 (ko) 2012-10-05 2017-02-10 제이엑스 에네루기 가부시키가이샤 필름형 몰드를 사용한 광학 기판의 제조 방법, 제조 장치 및 얻어진 광학 기판
JP2014124873A (ja) * 2012-12-27 2014-07-07 Seiko Epson Corp インプリント用型およびインプリント用型の製造方法
CN105143976B (zh) 2013-03-15 2019-12-17 佳能纳米技术公司 使用具有金属或氧化物涂层的可再次利用的聚合物模板的纳米压印
JP2016181530A (ja) * 2013-08-09 2016-10-13 綜研化学株式会社 マイクロコンタクトプリント用スタンパ、及びこれを用いた構造体の製造方法
TWI548316B (zh) * 2014-07-24 2016-09-01 友達光電股份有限公司 電子裝置及其製造方法
WO2016065308A1 (en) * 2014-10-23 2016-04-28 Board Of Regents, The University Of Texas System Nanoshape patterning techniques that allow high-speed and low-cost fabrication of nanoshape structures
CN106477514B (zh) * 2015-08-28 2018-03-30 中芯国际集成电路制造(上海)有限公司 Mems器件及其形成方法
CN116175846A (zh) 2015-09-29 2023-05-30 大日本印刷株式会社 压印用的模具及其制造方法
JP6818406B2 (ja) * 2015-12-03 2021-01-20 三井化学東セロ株式会社 プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法
KR102331438B1 (ko) 2016-04-06 2021-11-26 코닌클리케 필립스 엔.브이. 임프린트 리소그래피 스탬프, 이의 제조 방법 및 사용 방법
CN105700292B (zh) * 2016-04-21 2019-10-11 深圳市华星光电技术有限公司 纳米压印模板的制作方法及纳米压印模板
WO2017195633A1 (ja) * 2016-05-09 2017-11-16 デクセリアルズ株式会社 レプリカ原盤、レプリカ原盤の製造方法、物品および被形成体の製造方法
JP6924006B2 (ja) 2016-05-09 2021-08-25 デクセリアルズ株式会社 レプリカ原盤の製造方法、および被形成体の製造方法
US20200331172A1 (en) * 2016-05-19 2020-10-22 Agency For Science, Technology And Research An anti-stiction flexible mold and a method for fabricating the same
JP2020044456A (ja) * 2017-01-18 2020-03-26 綜研化学株式会社 ハードコートフィルム及びその製造方法
CN107170675A (zh) * 2017-05-23 2017-09-15 深圳市华星光电技术有限公司 纳米线栅结构的制作方法
CN107643652A (zh) * 2017-10-31 2018-01-30 武汉华星光电技术有限公司 纳米压印模板及其制作方法和应用
JP7003667B2 (ja) * 2018-01-05 2022-02-10 凸版印刷株式会社 化粧材
JP7060840B2 (ja) * 2018-03-06 2022-04-27 大日本印刷株式会社 インプリントモールド及びインプリント方法
CN109270620B (zh) * 2018-11-16 2022-07-19 京东方科技集团股份有限公司 金属线栅偏振片的制作方法及显示面板
US10892167B2 (en) * 2019-03-05 2021-01-12 Canon Kabushiki Kaisha Gas permeable superstrate and methods of using the same
JP7511160B2 (ja) 2020-09-17 2024-07-05 パナソニックＩｐマネジメント株式会社 樹脂モールド、およびフィルム構造体の製造方法
JP7569882B2 (ja) 2020-11-27 2024-10-18 アールエム東セロ株式会社 プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法
JP7534989B2 (ja) * 2021-03-12 2024-08-15 キオクシア株式会社 テンプレートおよびその製造方法
JP6972409B1 (ja) * 2021-03-30 2021-11-24 リンテック株式会社 マイクロニードルの製造方法およびマイクロニードルの製造装置
CN113736005A (zh) * 2021-09-08 2021-12-03 安徽新涛光电科技有限公司 透镜用亚克力浇铸板及其制备方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3555332B2 (ja) 1996-05-30 2004-08-18 住友化学工業株式会社 熱可塑性樹脂シ−トの熱成形方法
JP3751778B2 (ja) 1999-04-26 2006-03-01 日本板硝子株式会社 ゾルゲル成形物の製造方法
JP2001269942A (ja) 2000-03-27 2001-10-02 Seiko Epson Corp 微細構造体および映像表示デバイスの製造方法
JP2001315248A (ja) * 2000-05-01 2001-11-13 Chuko Kasei Kogyo Kk 複合シート
JP2002270541A (ja) 2001-03-08 2002-09-20 Matsushita Electric Ind Co Ltd モールド、モールドの製造方法及びパターン形成方法
DE102004046385A1 (de) * 2004-09-24 2006-04-06 Construction Research & Technology Gmbh Flüssige fluorhaltige Zusammensetzungen für die Oberflächenbehandlung mineralischer und nichtmineralischer Untergründe
TWI280159B (en) 2005-03-29 2007-05-01 Li Bing Huan Method for fabricating nano-adhesive
US8603381B2 (en) * 2005-10-03 2013-12-10 Massachusetts Insitute Of Technology Nanotemplate arbitrary-imprint lithography
JP4933801B2 (ja) * 2006-03-06 2012-05-16 三菱レイヨン株式会社 表面微細凹凸構造を有する成形品およびその製造方法
JP2007245684A (ja) 2006-03-20 2007-09-27 Sekisui Chem Co Ltd レプリカモールドの製造方法
JP2007307752A (ja) * 2006-05-17 2007-11-29 Asahi Glass Co Ltd モールドおよびその製造方法
KR100831046B1 (ko) * 2006-09-13 2008-05-21 삼성전자주식회사 나노 임프린트용 몰드 및 그 제조 방법
JP4940884B2 (ja) * 2006-10-17 2012-05-30 大日本印刷株式会社 パターン形成体の製造方法
JP4978188B2 (ja) * 2006-12-28 2012-07-18 旭硝子株式会社 微細構造体の製造方法
JP2008221491A (ja) 2007-03-09 2008-09-25 Dainippon Printing Co Ltd ナノインプリント用モールドおよびその製造方法
JP5034578B2 (ja) 2007-03-15 2012-09-26 パナソニック株式会社 薄膜処理装置
JP2008290330A (ja) * 2007-05-24 2008-12-04 Oji Paper Co Ltd ナノインプリントシートの製造装置および製造方法
JP2009001002A (ja) * 2007-05-24 2009-01-08 Univ Waseda モールド、その製造方法および転写微細パターンを有する基材の製造方法
JP5209901B2 (ja) * 2007-05-29 2013-06-12 旭化成イーマテリアルズ株式会社 転写装置および転写方法
WO2008149544A1 (ja) * 2007-06-04 2008-12-11 Scivax Corporation 型、微細加工品およびそれらの製造方法
JP5394619B2 (ja) * 2007-07-04 2014-01-22 丸善石油化学株式会社 熱インプリント方法
JP5473266B2 (ja) * 2007-08-03 2014-04-16 キヤノン株式会社 インプリント方法および基板の加工方法、基板の加工方法による半導体デバイスの製造方法
JP5002422B2 (ja) 2007-11-14 2012-08-15 株式会社日立ハイテクノロジーズ ナノプリント用樹脂スタンパ
JP5167282B2 (ja) 2007-12-28 2013-03-21 株式会社アルバック 成膜装置及び成膜方法
JP5309579B2 (ja) * 2008-02-01 2013-10-09 コニカミノルタ株式会社 樹脂成形金型及びその製造方法
WO2009148138A1 (ja) * 2008-06-05 2009-12-10 旭硝子株式会社 ナノインプリント用モールド、その製造方法および表面に微細凹凸構造を有する樹脂成形体ならびにワイヤグリッド型偏光子の製造方法

Also Published As

Publication number Publication date
EP2463073A4 (en) 2015-05-13
EP2463073B1 (en) 2018-04-04
DK2463073T3 (en) 2018-05-22
EP2463073A1 (en) 2012-06-13
US20120133077A1 (en) 2012-05-31
CA2768830C (en) 2018-07-31
KR20120046743A (ko) 2012-05-10
US9354512B2 (en) 2016-05-31
CN102470565A (zh) 2012-05-23
WO2011016549A1 (ja) 2011-02-10
JP2015201652A (ja) 2015-11-12
JPWO2011016549A1 (ja) 2013-01-17
CA2768830A1 (en) 2011-02-10
CN102470565B (zh) 2015-04-29

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