SE9702598D0 - Bipolär effekttransistor och framställningsförfarande - Google Patents

Bipolär effekttransistor och framställningsförfarande

Info

Publication number
SE9702598D0
SE9702598D0 SE9702598A SE9702598A SE9702598D0 SE 9702598 D0 SE9702598 D0 SE 9702598D0 SE 9702598 A SE9702598 A SE 9702598A SE 9702598 A SE9702598 A SE 9702598A SE 9702598 D0 SE9702598 D0 SE 9702598D0
Authority
SE
Sweden
Prior art keywords
power transistor
electrically connected
base
emitter
manufacturing
Prior art date
Application number
SE9702598A
Other languages
English (en)
Other versions
SE509780C2 (sv
SE9702598L (sv
Inventor
Ted Johansson
Larry Clifford Leighton
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9702598A priority Critical patent/SE509780C2/sv
Publication of SE9702598D0 publication Critical patent/SE9702598D0/sv
Priority to TW086117556A priority patent/TW420849B/zh
Priority to AU76820/98A priority patent/AU7682098A/en
Priority to CN98806912A priority patent/CN1261984A/zh
Priority to EP98924718A priority patent/EP1027733A1/en
Priority to JP50699899A priority patent/JP2002508889A/ja
Priority to CA002294806A priority patent/CA2294806A1/en
Priority to KR19997012152A priority patent/KR20010014103A/ko
Priority to PCT/SE1998/000975 priority patent/WO1999001900A1/en
Priority to US09/109,058 priority patent/US6077753A/en
Publication of SE9702598L publication Critical patent/SE9702598L/sv
Publication of SE509780C2 publication Critical patent/SE509780C2/sv
Priority to US09/524,782 priority patent/US6239475B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395—Vertical transistors, e.g. vertical IGBT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234—Bipolar junction transistors [BJT]
    • H01L29/66272—Silicon vertical transistors
    • H01L29/66295—Silicon vertical transistors with main current going through the whole silicon substrate, e.g. power bipolar transistor
    • H01L29/66303—Silicon vertical transistors with main current going through the whole silicon substrate, e.g. power bipolar transistor with multi-emitter, e.g. interdigitated, multi-cellular or distributed emitter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • H01L29/732—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SE9702598A 1997-07-04 1997-07-04 Bipolär effekttransistor och framställningsförfarande SE509780C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9702598A SE509780C2 (sv) 1997-07-04 1997-07-04 Bipolär effekttransistor och framställningsförfarande
TW086117556A TW420849B (en) 1997-07-04 1997-11-24 Bipolar power transistor and manufacturing method
PCT/SE1998/000975 WO1999001900A1 (en) 1997-07-04 1998-05-25 Bipolar power transistor and manufacturing method
EP98924718A EP1027733A1 (en) 1997-07-04 1998-05-25 Bipolar power transistor and manufacturing method
CN98806912A CN1261984A (zh) 1997-07-04 1998-05-25 双极功率晶体管及其制造方法
AU76820/98A AU7682098A (en) 1997-07-04 1998-05-25 Bipolar power transistor and manufacturing method
JP50699899A JP2002508889A (ja) 1997-07-04 1998-05-25 バイポーラ・パワー・トランジスタおよび製造方法
CA002294806A CA2294806A1 (en) 1997-07-04 1998-05-25 Bipolar power transistor and manufacturing method
KR19997012152A KR20010014103A (ko) 1997-07-04 1998-05-25 바이폴라 전력 트랜지스터 및 그 제조 방법
US09/109,058 US6077753A (en) 1997-07-04 1998-07-02 Method for manufacturing vertical bipolar transistor having a field shield between an interconnecting layer and the field oxide
US09/524,782 US6239475B1 (en) 1997-07-04 2000-03-13 Vertical bipolar transistor having a field shield between the metallic interconnecting layer and the insulation oxide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9702598A SE509780C2 (sv) 1997-07-04 1997-07-04 Bipolär effekttransistor och framställningsförfarande

Publications (3)

Publication Number Publication Date
SE9702598D0 true SE9702598D0 (sv) 1997-07-04
SE9702598L SE9702598L (sv) 1999-01-05
SE509780C2 SE509780C2 (sv) 1999-03-08

Family

ID=20407650

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9702598A SE509780C2 (sv) 1997-07-04 1997-07-04 Bipolär effekttransistor och framställningsförfarande

Country Status (10)

Country Link
US (2) US6077753A (sv)
EP (1) EP1027733A1 (sv)
JP (1) JP2002508889A (sv)
KR (1) KR20010014103A (sv)
CN (1) CN1261984A (sv)
AU (1) AU7682098A (sv)
CA (1) CA2294806A1 (sv)
SE (1) SE509780C2 (sv)
TW (1) TW420849B (sv)
WO (1) WO1999001900A1 (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0215185D0 (en) 2002-07-01 2002-08-07 Genovision As Binding a target substance
JP4626935B2 (ja) * 2002-10-01 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
US6841795B2 (en) * 2002-10-25 2005-01-11 The University Of Connecticut Semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
US6974969B2 (en) 2003-01-13 2005-12-13 The University Of Connecticut P-type quantum-well-base bipolar transistor device employing interdigitated base and emitter formed with a capping layer
US7109589B2 (en) * 2004-08-26 2006-09-19 Agere Systems Inc. Integrated circuit with substantially perpendicular wire bonds
US8429577B2 (en) * 2008-06-26 2013-04-23 Qualcomm Incorporated Predictive modeling of interconnect modules for advanced on-chip interconnect technology
US8483997B2 (en) 2008-06-26 2013-07-09 Qualcomm Incorporated Predictive modeling of contact and via modules for advanced on-chip interconnect technology
CN102403223B (zh) * 2011-10-25 2013-04-17 丹东安顺微电子有限公司 改善贮存时间Ts一致性的功率晶体管制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3302076A (en) * 1963-06-06 1967-01-31 Motorola Inc Semiconductor device with passivated junction
JPS51123562A (en) * 1975-04-21 1976-10-28 Sony Corp Production method of semiconductor device
US4573064A (en) * 1981-11-02 1986-02-25 Texas Instruments Incorporated GaAs/GaAlAs Heterojunction bipolar integrated circuit devices
JPS59188970A (ja) * 1983-04-12 1984-10-26 Nec Corp 半導体装置
JP2518886B2 (ja) * 1988-02-25 1996-07-31 富士通株式会社 バイポ―ラ型半導体装置の製造方法
US5204735A (en) * 1988-04-21 1993-04-20 Kabushiki Kaisha Toshiba High-frequency semiconductor device having emitter stabilizing resistor and method of manufacturing the same
JP2607616B2 (ja) * 1988-04-25 1997-05-07 富士通株式会社 半導体装置の製造方法
US4864379A (en) * 1988-05-20 1989-09-05 General Electric Company Bipolar transistor with field shields
JP2504547B2 (ja) * 1988-12-13 1996-06-05 日産自動車株式会社 バイポ―ラ形薄膜半導体装置
US5034337A (en) * 1989-02-10 1991-07-23 Texas Instruments Incorporated Method of making an integrated circuit that combines multi-epitaxial power transistors with logic/analog devices
US4918026A (en) * 1989-03-17 1990-04-17 Delco Electronics Corporation Process for forming vertical bipolar transistors and high voltage CMOS in a single integrated circuit chip
JP2808882B2 (ja) * 1990-05-07 1998-10-08 富士電機株式会社 絶縁ゲート型バイポーラトランジスタ
JP2650519B2 (ja) * 1991-07-25 1997-09-03 株式会社日立製作所 横型絶縁ゲートトランジスタ
JPH05343413A (ja) * 1992-06-11 1993-12-24 Fujitsu Ltd バイポーラトランジスタとその製造方法
EP0590804B1 (en) * 1992-09-03 1997-02-05 STMicroelectronics, Inc. Vertically isolated monolithic bipolar high-power transistor with top collector
DE69431609T2 (de) * 1993-04-08 2003-06-26 Koninkl Philips Electronics Nv Verfahren zur Herstellung einer Halbleiteranordnung mit einem Bipolartransistor
US5373183A (en) * 1993-04-28 1994-12-13 Harris Corporation Integrated circuit with improved reverse bias breakdown
US5488252A (en) * 1994-08-16 1996-01-30 Telefonaktiebolaget L M Erricsson Layout for radio frequency power transistors
US5606195A (en) * 1995-12-26 1997-02-25 Hughes Electronics High-voltage bipolar transistor utilizing field-terminated bond-pad electrodes

Also Published As

Publication number Publication date
US6077753A (en) 2000-06-20
WO1999001900A1 (en) 1999-01-14
CA2294806A1 (en) 1999-01-14
EP1027733A1 (en) 2000-08-16
KR20010014103A (ko) 2001-02-26
TW420849B (en) 2001-02-01
JP2002508889A (ja) 2002-03-19
US6239475B1 (en) 2001-05-29
SE509780C2 (sv) 1999-03-08
SE9702598L (sv) 1999-01-05
AU7682098A (en) 1999-01-25
CN1261984A (zh) 2000-08-02

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