SE8300311D0 - Sett att framstella en halvledaranordning - Google Patents

Sett att framstella en halvledaranordning

Info

Publication number
SE8300311D0
SE8300311D0 SE8300311A SE8300311A SE8300311D0 SE 8300311 D0 SE8300311 D0 SE 8300311D0 SE 8300311 A SE8300311 A SE 8300311A SE 8300311 A SE8300311 A SE 8300311A SE 8300311 D0 SE8300311 D0 SE 8300311D0
Authority
SE
Sweden
Prior art keywords
glass layer
semiconductor device
make
junction
thin glass
Prior art date
Application number
SE8300311A
Other languages
English (en)
Other versions
SE8300311L (sv
SE456463B (sv
Inventor
S Funakawa
M Yamane
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SE8300311D0 publication Critical patent/SE8300311D0/sv
Publication of SE8300311L publication Critical patent/SE8300311L/sv
Publication of SE456463B publication Critical patent/SE456463B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/6609—Diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3178—Coating or filling in grooves made in the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
SE8300311A 1976-07-06 1983-01-21 Sett att framstella en halvledaranordning, varvid en pn-overgang bildas i en halvledar-skiva, i vars ena huvudyta spar upptas, sa att overgangen uppdelas i ett antal enskilda overgangsdelar, som i sina endar er frilagda SE456463B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8073776A JPS535971A (en) 1976-07-06 1976-07-06 Semiconductor device

Publications (3)

Publication Number Publication Date
SE8300311D0 true SE8300311D0 (sv) 1983-01-21
SE8300311L SE8300311L (sv) 1983-01-21
SE456463B SE456463B (sv) 1988-10-03

Family

ID=13726694

Family Applications (2)

Application Number Title Priority Date Filing Date
SE7707807A SE429277B (sv) 1976-07-06 1977-07-05 Halvledaranordning belagd med en ytpassiverande film och sett for dess framstellning
SE8300311A SE456463B (sv) 1976-07-06 1983-01-21 Sett att framstella en halvledaranordning, varvid en pn-overgang bildas i en halvledar-skiva, i vars ena huvudyta spar upptas, sa att overgangen uppdelas i ett antal enskilda overgangsdelar, som i sina endar er frilagda

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE7707807A SE429277B (sv) 1976-07-06 1977-07-05 Halvledaranordning belagd med en ytpassiverande film och sett for dess framstellning

Country Status (5)

Country Link
US (1) US4080621A (sv)
JP (1) JPS535971A (sv)
CA (1) CA1075830A (sv)
DE (1) DE2730566C3 (sv)
SE (2) SE429277B (sv)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5395581A (en) * 1977-02-02 1978-08-21 Hitachi Ltd Manufacture for semiconductor device
DE2739762C2 (de) * 1977-09-03 1982-12-02 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Verfahren zur Passivierung von Halbleiterkörpern
US4235645A (en) * 1978-12-15 1980-11-25 Westinghouse Electric Corp. Process for forming glass-sealed multichip semiconductor devices
US4340900A (en) * 1979-06-19 1982-07-20 The United States Of America As Represented By The Secretary Of The Air Force Mesa epitaxial diode with oxide passivated junction and plated heat sink
US4378410A (en) * 1980-06-06 1983-03-29 Rockwell International Corporation Compliant glass for solid state devices
DE3247938A1 (de) * 1982-12-24 1984-07-05 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbauelement hoher sperrspannungsbelastbarkeit
DE3534418A1 (de) * 1985-09-27 1987-04-02 Telefunken Electronic Gmbh Verfahren zum herstellen von vertiefungen in einem halbleiterbauelemente enthaltenden halbleiterkoerper
US5136354A (en) * 1989-04-13 1992-08-04 Seiko Epson Corporation Semiconductor device wafer with interlayer insulating film covering the scribe lines
US5414297A (en) * 1989-04-13 1995-05-09 Seiko Epson Corporation Semiconductor device chip with interlayer insulating film covering the scribe lines
KR940016630A (ko) * 1992-12-23 1994-07-23 프레데릭 얀 스미트 반도체 장치 및 제조방법
CN1074168C (zh) * 1996-06-05 2001-10-31 智威科技股份有限公司 全切面结玻璃钝化的硅半导体二极管芯片及其制造方法
EP0818820A1 (en) * 1996-07-11 1998-01-14 Zowie Technology Corp. Full open P-N junction glass passivated silicon semiconductor diode chip and preparation method thereof
US5882986A (en) * 1998-03-30 1999-03-16 General Semiconductor, Inc. Semiconductor chips having a mesa structure provided by sawing
CN100419975C (zh) * 2002-10-22 2008-09-17 台湾积体电路制造股份有限公司 一种晶体管及其制造方法
US20100015782A1 (en) * 2008-07-18 2010-01-21 Chen-Hua Yu Wafer Dicing Methods
EP2453474A1 (en) * 2010-11-10 2012-05-16 Nxp B.V. Semiconductor device packaging method and semiconductor device package
CN102208370B (zh) * 2011-04-29 2012-12-12 昆山东日半导体有限公司 表面形成玻璃层的硅晶圆及其制造方法
DE102011112659B4 (de) * 2011-09-06 2022-01-27 Vishay Semiconductor Gmbh Oberflächenmontierbares elektronisches Bauelement
EP3113219B1 (de) * 2015-06-30 2020-03-11 SEMIKRON Elektronik GmbH & Co. KG Halbleiterbauelement und verfahren zu dessen herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247428A (en) * 1961-09-29 1966-04-19 Ibm Coated objects and methods of providing the protective coverings therefor
JPS5134265B2 (sv) * 1972-05-12 1976-09-25
US4002541A (en) * 1972-11-03 1977-01-11 Design Systems, Inc. Solar energy absorbing article and method of making same

Also Published As

Publication number Publication date
US4080621A (en) 1978-03-21
DE2730566A1 (de) 1978-01-19
DE2730566B2 (de) 1979-04-26
JPS535971A (en) 1978-01-19
JPS552730B2 (sv) 1980-01-22
CA1075830A (en) 1980-04-15
SE8300311L (sv) 1983-01-21
SE429277B (sv) 1983-08-22
SE7707807L (sv) 1978-01-07
SE456463B (sv) 1988-10-03
DE2730566C3 (de) 1979-12-20

Similar Documents

Publication Publication Date Title
SE8300311D0 (sv) Sett att framstella en halvledaranordning
SE7508613L (sv) Kiselhalvledarkomponent.
AU504667B2 (en) Semiconductor device with passivating layer
NL7714399A (nl) Halfgeleiderinrichting met passiveringslaag.
JPS52101967A (en) Semiconductor device
JPS5240071A (en) Semiconductor device
ES384149A1 (es) Un dispositivo semiconductor que tiene una pelicula protec-tora que cubre un extremo opuesto de una union positiva ne- gativa.
JPS5681966A (en) Input protecting circuit for semiconductor device
JPS5228277A (en) Non-voltatile semiconductor memory device
JPS52129380A (en) Semiconductor device
SE7704782L (sv) Sett att framstella en halvledaranordning
JPS5617078A (en) Semiconductor device containing photosensor
JPS548982A (en) Semiconductor device
JPS5431289A (en) Semiconductor device
JPS53105385A (en) Manufacture for semiconductor
JPS5399765A (en) Semiconductor device having bonding pad
JPS5414173A (en) Semiconductor device
JPS5439585A (en) Semiconductor memory device
JPS5298480A (en) Semiconductor device
JPS5427380A (en) Semiconductor device
JPS5342748A (en) Photo semiconductor device
JPS5219978A (en) Manufacture process for a semiconductor device
JPS5353988A (en) Semiconductor integrated circuit
JPS5332682A (en) Semiconductor device
JPS5344186A (en) Semiconductor device

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 8300311-1

Effective date: 19950210

Format of ref document f/p: F

NUG Patent has lapsed

Ref document number: 8300311-1

Format of ref document f/p: F