SE522531C2 - Metod och anordning för märkning av halvledare - Google Patents

Metod och anordning för märkning av halvledare

Info

Publication number
SE522531C2
SE522531C2 SE9904277A SE9904277A SE522531C2 SE 522531 C2 SE522531 C2 SE 522531C2 SE 9904277 A SE9904277 A SE 9904277A SE 9904277 A SE9904277 A SE 9904277A SE 522531 C2 SE522531 C2 SE 522531C2
Authority
SE
Sweden
Prior art keywords
pattern
code
wafer
exposure
variable
Prior art date
Application number
SE9904277A
Other languages
English (en)
Swedish (sv)
Other versions
SE9904277L (sv
SE9904277D0 (sv
Inventor
Torbjoern Sandstroem
Original Assignee
Micronic Laser Systems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronic Laser Systems Ab filed Critical Micronic Laser Systems Ab
Priority to SE9904277A priority Critical patent/SE522531C2/sv
Publication of SE9904277D0 publication Critical patent/SE9904277D0/xx
Priority to JP2001540838A priority patent/JP2003515930A/ja
Priority to US10/129,364 priority patent/US6813058B1/en
Priority to EP00982014A priority patent/EP1232526A1/en
Priority to CNB008162018A priority patent/CN1227737C/zh
Priority to KR1020027006620A priority patent/KR100726054B1/ko
Priority to PCT/SE2000/002325 priority patent/WO2001039269A1/en
Priority to AU19092/01A priority patent/AU1909201A/en
Publication of SE9904277L publication Critical patent/SE9904277L/xx
Publication of SE522531C2 publication Critical patent/SE522531C2/sv
Priority to US10/953,560 priority patent/US7211453B2/en
Priority to US11/378,266 priority patent/US20060161254A1/en
Priority to US11/980,432 priority patent/US7842525B2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/44—Projection printing apparatus, e.g. enlarger, copying camera for multiple copying of the same original at the same time
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70575—Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SE9904277A 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare SE522531C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9904277A SE522531C2 (sv) 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare
AU19092/01A AU1909201A (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
CNB008162018A CN1227737C (zh) 1999-11-24 2000-11-24 用于半导体器件个性化的装置与方法
US10/129,364 US6813058B1 (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
EP00982014A EP1232526A1 (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
JP2001540838A JP2003515930A (ja) 1999-11-24 2000-11-24 半導体の個別化を行う方法および装置
KR1020027006620A KR100726054B1 (ko) 1999-11-24 2000-11-24 마이크로전자 소자의 설계 및 제조 방법, 칩-고유 정보 기록장치, 스탭퍼 제어 시스템, 칩-고유 정보를 가진 칩 설계 블록, 웨이퍼 상의 다이 개별화 방법 및 패턴 발생기의 위치 에러 수정 방법
PCT/SE2000/002325 WO2001039269A1 (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
US10/953,560 US7211453B2 (en) 1999-11-24 2004-09-30 Method and apparatus for personalization of semiconductor
US11/378,266 US20060161254A1 (en) 1999-11-24 2006-03-20 Method and apparatus for personalization of semiconductor
US11/980,432 US7842525B2 (en) 1999-11-24 2007-10-31 Method and apparatus for personalization of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9904277A SE522531C2 (sv) 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare

Publications (3)

Publication Number Publication Date
SE9904277D0 SE9904277D0 (sv) 1999-11-24
SE9904277L SE9904277L (sv) 2001-05-25
SE522531C2 true SE522531C2 (sv) 2004-02-17

Family

ID=20417858

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9904277A SE522531C2 (sv) 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare

Country Status (8)

Country Link
US (4) US6813058B1 (zh)
EP (1) EP1232526A1 (zh)
JP (1) JP2003515930A (zh)
KR (1) KR100726054B1 (zh)
CN (1) CN1227737C (zh)
AU (1) AU1909201A (zh)
SE (1) SE522531C2 (zh)
WO (1) WO2001039269A1 (zh)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE522531C2 (sv) * 1999-11-24 2004-02-17 Micronic Laser Systems Ab Metod och anordning för märkning av halvledare
US7316934B2 (en) * 2000-12-18 2008-01-08 Zavitan Semiconductors, Inc. Personalized hardware
JP2003046496A (ja) * 2001-07-31 2003-02-14 Canon Inc 情報管理方法、情報管理システム及び処理装置
KR100445974B1 (ko) * 2001-12-01 2004-08-25 주식회사 이오테크닉스 칩 스케일 마커의 마킹 위치 보정 방법 및 그 장치
JP4974049B2 (ja) * 2004-02-20 2012-07-11 株式会社ニコン 露光方法、露光装置、並びにデバイス製造方法
US7153616B2 (en) * 2004-03-31 2006-12-26 Asml Holding N.V. System and method for verifying and controlling the performance of a maskless lithography tool
EP2282338B1 (en) 2004-04-19 2014-08-06 STMicroelectronics Srl Structures for indexing dice
US7102733B2 (en) * 2004-08-13 2006-09-05 Asml Holding N.V. System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool
US7457547B2 (en) * 2004-11-08 2008-11-25 Optium Australia Pty Limited Optical calibration system and method
US20060216869A1 (en) * 2005-03-22 2006-09-28 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, code reading device and substrate
JP2006286966A (ja) * 2005-03-31 2006-10-19 Fujitsu Ltd 半導体装置の生産管理方法及び半導体基板
US20070153249A1 (en) * 2005-12-20 2007-07-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using multiple exposures and multiple exposure types
US7532403B2 (en) * 2006-02-06 2009-05-12 Asml Holding N.V. Optical system for transforming numerical aperture
US7468664B2 (en) * 2006-04-20 2008-12-23 Nve Corporation Enclosure tamper detection and protection
US7787034B2 (en) * 2006-04-27 2010-08-31 Avago Technologies General Ip (Singapore) Pte. Ltd. Identification of integrated circuits using pixel or memory cell characteristics
US8264667B2 (en) 2006-05-04 2012-09-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using interferometric and other exposure
US20080057677A1 (en) * 2006-09-06 2008-03-06 International Business Machines Corporation Chip location identification
US20080080712A1 (en) * 2006-09-29 2008-04-03 Haiquan Huang System and methods for secure communication using an enhanced GPS receiver
KR20090106617A (ko) * 2007-01-19 2009-10-09 어플라이드 머티어리얼스, 인코포레이티드 플라스마 함침 챔버
EP2135254B1 (en) 2007-03-09 2016-05-25 NVE Corporation Stressed magnetoresistive tamper detection devices
WO2009089089A1 (en) * 2008-01-02 2009-07-16 Board Of Regents, The University Of Texas System Microdevice fabrication
US20090199152A1 (en) * 2008-02-06 2009-08-06 Micronic Laser Systems Ab Methods and apparatuses for reducing mura effects in generated patterns
US8754538B2 (en) 2008-06-24 2014-06-17 Infineon Technologies Ag Semiconductor chip including identifying marks
US20100054287A1 (en) * 2008-09-04 2010-03-04 Farzan Ghauri Method and System for Laser-Based High-Speed Digital Marking of Objects
JP2010060990A (ja) * 2008-09-05 2010-03-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
US8015514B2 (en) * 2008-12-29 2011-09-06 International Business Machines Corporation Random personalization of chips during fabrication
EP2306517B1 (en) 2009-09-30 2016-11-02 STMicroelectronics Srl Indexing of electronic devices using marks distributed on two coupled chips
US9099480B2 (en) 2009-09-30 2015-08-04 Stmicroelectronics S.R.L. Indexing of electronic devices distributed on different chips
JP2011107569A (ja) * 2009-11-20 2011-06-02 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
CN102193322B (zh) * 2010-03-05 2013-01-23 上海微电子装备有限公司 光刻机物镜顶板的检测装置及调整方法
US8539395B2 (en) 2010-03-05 2013-09-17 Micronic Laser Systems Ab Method and apparatus for merging multiple geometrical pixel images and generating a single modulator pixel image
JP5335761B2 (ja) * 2010-12-13 2013-11-06 株式会社オーク製作所 露光装置
JP5335840B2 (ja) * 2011-03-15 2013-11-06 株式会社オーク製作所 露光装置
JP5335755B2 (ja) * 2010-11-04 2013-11-06 株式会社オーク製作所 露光装置
US8415813B2 (en) * 2011-06-15 2013-04-09 Truesense Imaging, Inc. Identification of dies on a semiconductor wafer
CN104903793A (zh) * 2012-10-29 2015-09-09 西北大学 热启动和投影平版印刷系统和方法
US10020264B2 (en) 2015-04-28 2018-07-10 Infineon Technologies Ag Integrated circuit substrate and method for manufacturing the same
CN106707692B (zh) * 2015-07-27 2018-03-27 中国科学院理化技术研究所 一种跨尺度结构协同工作的无掩模光刻系统
US10262164B2 (en) 2016-01-15 2019-04-16 Blockchain Asics Llc Cryptographic ASIC including circuitry-encoded transformation function
US9846128B2 (en) * 2016-01-19 2017-12-19 Applied Materials Israel Ltd. Inspection system and a method for evaluating an exit pupil of an inspection system
JP6896055B2 (ja) * 2016-07-19 2021-06-30 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィステップにおける基板に施されるべきパターンの組み合わせの決定
US10079206B2 (en) 2016-10-27 2018-09-18 Mapper Lithography Ip B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
NL2019503B1 (en) * 2016-09-08 2018-08-31 Mapper Lithography Ip Bv Fabricating unique chips using a charged particle multi-beamlet lithography system
US10714427B2 (en) 2016-09-08 2020-07-14 Asml Netherlands B.V. Secure chips with serial numbers
KR102481733B1 (ko) * 2016-09-08 2022-12-29 에이에스엠엘 네델란즈 비.브이. 하전-입자 멀티-빔렛 리소그래피 시스템을 이용한 고유한 칩들의 제작
US20180068047A1 (en) * 2016-09-08 2018-03-08 Mapper Lithography Ip B.V. Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
NL2019502B1 (en) * 2016-09-08 2018-08-31 Mapper Lithography Ip Bv Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
KR102359084B1 (ko) * 2016-12-23 2022-02-07 에이에스엠엘 네델란즈 비.브이. 하전 입자 멀티-빔렛 리소그래피 시스템을 이용한 고유 칩 제조
TWI627440B (zh) * 2017-05-17 2018-06-21 力晶科技股份有限公司 影像亮度重配模組及影像亮度重配方法
US10372943B1 (en) 2018-03-20 2019-08-06 Blockchain Asics Llc Cryptographic ASIC with combined transformation and one-way functions
US10256974B1 (en) 2018-04-25 2019-04-09 Blockchain Asics Llc Cryptographic ASIC for key hierarchy enforcement
CN109471336B (zh) * 2018-12-21 2020-07-10 武汉华星光电技术有限公司 一种打码方法、打码装置和打码系统
US20200328102A1 (en) * 2019-04-15 2020-10-15 Tokyo Electron Limited Method for die-level unique authentication and serialization of semiconductor devices
US20240152053A1 (en) * 2020-12-25 2024-05-09 Nikon Corporation Method for manufacturing semiconductor integrated circuit, method for manufacturing semiconductor device, and exposure apparatus

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
JPS63283021A (ja) 1987-05-14 1988-11-18 Sanyo Electric Co Ltd 露光方法
DE69032740T2 (de) 1989-12-20 1999-06-02 Koninklijke Philips Electronics N.V., Eindhoven Informationscodierungsverfahren zur Chipidentifizierung unter Verwendung von schrittlitografischen Methoden
US5302491A (en) * 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography
JPH0819713B2 (ja) * 1990-05-31 1996-02-28 松下電工株式会社 洋式便器用温水洗浄器の着座検出装置
JPH07123101B2 (ja) * 1990-09-14 1995-12-25 株式会社東芝 半導体装置
US5233459A (en) * 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
EP0558781B1 (en) 1992-03-05 1998-08-05 Micronic Laser Systems Ab Method and apparatus for exposure of substrates
JPH0768105B2 (ja) * 1992-04-15 1995-07-26 花王株式会社 毛髪処理剤組成物
JPH06224099A (ja) * 1993-01-26 1994-08-12 Sony Corp 半導体装置の製造方法
US6388649B1 (en) * 1993-03-26 2002-05-14 Matsushita Electric Industrial Co., Ltd. Spatial light modulator and a method for driving the same
US5617182A (en) * 1993-11-22 1997-04-01 Nikon Corporation Scanning exposure method
JPH08313842A (ja) 1995-05-15 1996-11-29 Nikon Corp 照明光学系および該光学系を備えた露光装置
US5963881A (en) * 1995-09-22 1999-10-05 Texas Instruments Incorporated Method and system for enhancing the identification of causes of variations in the performance of manufactured articles
US5986781A (en) * 1996-10-28 1999-11-16 Pacific Holographics, Inc. Apparatus and method for generating diffractive element using liquid crystal display
SE9800665D0 (sv) * 1998-03-02 1998-03-02 Micronic Laser Systems Ab Improved method for projection printing using a micromirror SLM
DE19829674A1 (de) 1998-07-03 2000-01-13 Heidelberg Instruments Mikrotechnik Gmbh Lithografisches Verfahren zur Individualisierung einzelner Chips im Scheibenprozeß
EP0997841A3 (en) * 1998-10-30 2004-01-02 Texas Instruments Incorporated High resolution digital printing with spatial light modulation
JP4951811B2 (ja) * 1999-03-24 2012-06-13 富士通セミコンダクター株式会社 半導体装置の製造方法
SE522531C2 (sv) * 1999-11-24 2004-02-17 Micronic Laser Systems Ab Metod och anordning för märkning av halvledare

Also Published As

Publication number Publication date
US20060161254A1 (en) 2006-07-20
US7211453B2 (en) 2007-05-01
SE9904277L (sv) 2001-05-25
JP2003515930A (ja) 2003-05-07
US20050047543A1 (en) 2005-03-03
KR20020070440A (ko) 2002-09-09
CN1227737C (zh) 2005-11-16
US7842525B2 (en) 2010-11-30
US6813058B1 (en) 2004-11-02
SE9904277D0 (sv) 1999-11-24
CN1399796A (zh) 2003-02-26
US20080062389A1 (en) 2008-03-13
KR100726054B1 (ko) 2007-06-11
AU1909201A (en) 2001-06-04
EP1232526A1 (en) 2002-08-21
WO2001039269A1 (en) 2001-05-31

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