SE521415C2 - Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden - Google Patents
Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metodenInfo
- Publication number
- SE521415C2 SE521415C2 SE9800462A SE9800462A SE521415C2 SE 521415 C2 SE521415 C2 SE 521415C2 SE 9800462 A SE9800462 A SE 9800462A SE 9800462 A SE9800462 A SE 9800462A SE 521415 C2 SE521415 C2 SE 521415C2
- Authority
- SE
- Sweden
- Prior art keywords
- detector
- conductive
- ridge
- ridges
- column
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 238000004049 embossing Methods 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 134
- 239000002184 metal Substances 0.000 claims description 134
- 238000009429 electrical wiring Methods 0.000 claims description 18
- 230000007704 transition Effects 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 230000000295 complement effect Effects 0.000 claims description 12
- 238000005266 casting Methods 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 6
- 230000005676 thermoelectric effect Effects 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 238000010292 electrical insulation Methods 0.000 claims description 5
- 238000011156 evaluation Methods 0.000 claims description 4
- 239000004071 soot Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 241000269420 Bufonidae Species 0.000 claims 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000004847 absorption spectroscopy Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0214—Biosensors; Chemical sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0136—Comb structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/034—Moulding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- General Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Micromachines (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Optical Measuring Cells (AREA)
- Optical Couplings Of Light Guides (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Priority Applications (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9800462A SE521415C2 (sv) | 1998-02-17 | 1998-02-17 | Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden |
SE9800839A SE522989C2 (sv) | 1998-02-17 | 1998-03-13 | Metod för komponentframställning |
AU26493/99A AU748969B2 (en) | 1998-02-17 | 1999-02-04 | A method of producing a detector belonging to a gas sensor, and a detector produced in accordance with the method |
JP2000531725A JP4401021B2 (ja) | 1998-02-17 | 1999-02-04 | ガス・センサに属する検出器を製作する方法およびこの方法に従って製作した検出器 |
AU26494/99A AU2649499A (en) | 1998-02-17 | 1999-02-04 | A method of component manufacture |
CA002320920A CA2320920A1 (en) | 1998-02-17 | 1999-02-04 | A method of component manufacture |
EP99906636A EP1057006B1 (en) | 1998-02-17 | 1999-02-04 | A method of producing a detector arrangement including a gas sensor, and a detector arrangement produced in accordance with the method |
DE69943160T DE69943160D1 (de) | 1998-02-17 | 1999-02-04 | Verfahren zur herstellung einer detektoranordnung einschliesslich eines gassensors und mit diesem verfahren hergestellte detektoranordnung |
EP99906637A EP1057213A2 (en) | 1998-02-17 | 1999-02-04 | A method of component manufacture |
CA002320919A CA2320919A1 (en) | 1998-02-17 | 1999-02-04 | A method of producing a detector belonging to a gas sensor, and a detector produced in accordance with the method |
JP2000531864A JP2002503556A (ja) | 1998-02-17 | 1999-02-04 | 素子製造方法 |
PCT/SE1999/000145 WO1999041592A1 (en) | 1998-02-17 | 1999-02-04 | A method of producing a detector belonging to a gas sensor, and a detector produced in accordance with the method |
CNB998051241A CN1174237C (zh) | 1998-02-17 | 1999-02-04 | 制造属于气敏传感器的检测器的方法和根据该方法制造的检测器 |
US09/622,398 US6372542B1 (en) | 1998-02-17 | 1999-02-04 | Method of component manufacture |
PCT/SE1999/000146 WO1999041772A2 (en) | 1998-02-17 | 1999-02-04 | A method of component manufacture |
AT99906636T ATE497156T1 (de) | 1998-02-17 | 1999-02-04 | Verfahren zur herstellung einer detektoranordnung einschliesslich eines gassensors und mit diesem verfahren hergestellte detektoranordnung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9800462A SE521415C2 (sv) | 1998-02-17 | 1998-02-17 | Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9800462D0 SE9800462D0 (sv) | 1998-02-17 |
SE9800462L SE9800462L (sv) | 1999-08-18 |
SE521415C2 true SE521415C2 (sv) | 2003-10-28 |
Family
ID=20410206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9800462A SE521415C2 (sv) | 1998-02-17 | 1998-02-17 | Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden |
Country Status (10)
Country | Link |
---|---|
US (1) | US6372542B1 (ja) |
EP (2) | EP1057006B1 (ja) |
JP (2) | JP2002503556A (ja) |
CN (1) | CN1174237C (ja) |
AT (1) | ATE497156T1 (ja) |
AU (2) | AU2649499A (ja) |
CA (2) | CA2320920A1 (ja) |
DE (1) | DE69943160D1 (ja) |
SE (1) | SE521415C2 (ja) |
WO (2) | WO1999041592A1 (ja) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6911349B2 (en) * | 2001-02-16 | 2005-06-28 | Boxer Cross Inc. | Evaluating sidewall coverage in a semiconductor wafer |
WO2004029221A2 (en) * | 2002-09-27 | 2004-04-08 | The General Hospital Corporation | Microfluidic device for cell separation and uses thereof |
SE526006C2 (sv) * | 2003-04-29 | 2005-06-14 | Senseair Ab | Behandlat tunnfilmssubstrat |
JP4547385B2 (ja) * | 2003-12-12 | 2010-09-22 | イーエルティー インコーポレイテッド | ガスセンサ |
KR100494103B1 (ko) * | 2003-12-12 | 2005-06-10 | (주)이엘티 | 광학적 가스 센서 |
US20090284745A1 (en) * | 2004-10-18 | 2009-11-19 | Seung-Hwan Yi | Gas cell using two parabolic concave mirrors and method of producing gas sensor using the same |
EP1874920A4 (en) * | 2005-04-05 | 2009-11-04 | Cellpoint Diagnostics | DEVICES AND METHODS FOR ENRICHING AND MODIFYING CIRCULATING TUMOR CELLS AND OTHER PARTICLES |
EP1894242A2 (en) * | 2005-06-06 | 2008-03-05 | Nxp B.V. | Method for manufacturing a crossbar circuit device |
US8921102B2 (en) | 2005-07-29 | 2014-12-30 | Gpb Scientific, Llc | Devices and methods for enrichment and alteration of circulating tumor cells and other particles |
SE0802069A1 (sv) | 2008-09-30 | 2010-03-31 | Senseair Ab | Ett för en spektralanalys av höga gaskoncentrationer anpassat arrangemang |
CN103582816B (zh) | 2011-04-06 | 2017-04-19 | 奥索临床诊断有限公司 | 具有斜方形突出的测定装置 |
US9541480B2 (en) | 2011-06-29 | 2017-01-10 | Academia Sinica | Capture, purification, and release of biological substances using a surface coating |
BR102013001395A2 (pt) | 2012-01-20 | 2015-11-17 | Ortho Clinical Diagnostics Inc | dispositivo de ensaio tendo múltiplas células de reagentes |
JP6395999B2 (ja) | 2012-01-20 | 2018-09-26 | オーソ−クリニカル・ダイアグノスティックス・インコーポレイテッドOrtho−Clinical Diagnostics, Inc. | アッセイ装置を通じた流体流の制御 |
US8895293B2 (en) | 2012-01-20 | 2014-11-25 | Ortho-Clinical Diagnostics, Inc. | Assay device having uniform flow around corners |
WO2013109821A1 (en) | 2012-01-20 | 2013-07-25 | Ortho-Clinical Diagnostics, Inc. | Assay device having multiplexing |
CA2802645C (en) | 2012-01-20 | 2020-08-11 | Ortho-Clinical Diagnostics, Inc. | Assay device having controllable sample size |
DE102012203792A1 (de) * | 2012-03-12 | 2013-09-12 | Siemens Aktiengesellschaft | Infrarotsensor, Wärmebildkamera und Verfahren zum Herstellen einer Mikrostruktur aus thermoelektrischen Sensorstäben |
KR101358245B1 (ko) | 2012-03-19 | 2014-02-07 | 연세대학교 산학협력단 | 수소 센서 및 수소 센서 제조 방법 |
CA2818332C (en) | 2012-06-12 | 2021-07-20 | Ortho-Clinical Diagnostics, Inc. | Lateral flow assay devices for use in clinical diagnostic apparatus and configuration of clinical diagnostic apparatus for same |
CA3129014A1 (en) | 2012-11-15 | 2014-05-15 | Ortho-Clinical Diagnostics, Inc. | Quality/process control of a lateral flow assay device based on flow monitoring |
RU2015121732A (ru) | 2012-11-15 | 2017-01-10 | Орто-Клиникал Дайэгностикс, Инк. | Калибровка анализов с использованием времени реакции |
CA2841692C (en) | 2013-02-12 | 2023-08-22 | Zhong Ding | Reagent zone deposition pattern |
EP2777499B1 (en) | 2013-03-15 | 2015-09-16 | Ortho-Clinical Diagnostics Inc | Rotatable fluid sample collection device |
EP2778679B1 (en) | 2013-03-15 | 2017-09-27 | Ortho-Clinical Diagnostics, Inc. | Rotable disk-shaped fluid sample collection device |
DE102013218840A1 (de) * | 2013-09-19 | 2015-03-19 | Robert Bosch Gmbh | Mikroheizplattenvorrichtung und Sensor mit einer Mikroheizplattenvorrichtung |
ES2756124T3 (es) | 2013-12-06 | 2020-04-27 | Ortho Clinical Diagnostics Inc | Dispositivo de ensayo que tiene un puerto de lavado |
TW201623605A (zh) | 2014-04-01 | 2016-07-01 | 中央研究院 | 用於癌症診斷及預後之方法及系統 |
US10031085B2 (en) | 2014-07-24 | 2018-07-24 | Ortho-Clinical Diagnostics, Inc. | Point of care analytical processing system |
US10073091B2 (en) | 2014-08-08 | 2018-09-11 | Ortho-Clinical Diagnostics, Inc. | Lateral flow assay device |
US11033896B2 (en) | 2014-08-08 | 2021-06-15 | Ortho-Clinical Diagnostics, Inc. | Lateral-flow assay device with filtration flow control |
US10071373B2 (en) | 2014-08-08 | 2018-09-11 | Ortho-Clinical Diagnostics, Inc. | Lateral-flow assay device having flow constrictions |
US10112198B2 (en) | 2014-08-26 | 2018-10-30 | Academia Sinica | Collector architecture layout design |
US11002732B2 (en) | 2015-05-19 | 2021-05-11 | Ortho-Clinical Diagnostics, Inc. | Method of improving liquid sample flow in assay device |
US10107726B2 (en) | 2016-03-16 | 2018-10-23 | Cellmax, Ltd. | Collection of suspended cells using a transferable membrane |
DE102017217120A1 (de) * | 2017-09-26 | 2019-03-28 | Mahle International Gmbh | Verfahren zum Beschichten von Substraten mit thermoelektrisch aktivem Material |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB849983A (en) * | 1956-08-18 | 1960-09-28 | Hartmann & Braun Ag | Method and apparatus for the analysis by radiation of mixtures of gases and/or vapours |
IL45788A (en) * | 1974-10-04 | 1977-11-30 | Yeda Res & Dev | Thermoelectric detector |
US4772790A (en) * | 1986-10-14 | 1988-09-20 | Teledyne Industries, Inc. | Non-dispersive optical gas analyzer |
CH680541A5 (ja) * | 1990-07-12 | 1992-09-15 | Landis & Gyr Betriebs Ag | |
JP3160940B2 (ja) * | 1991-05-17 | 2001-04-25 | 株式会社村田製作所 | サーモパイル |
US5716218A (en) * | 1991-06-04 | 1998-02-10 | Micron Technology, Inc. | Process for manufacturing an interconnect for testing a semiconductor die |
JPH054232A (ja) * | 1991-06-25 | 1993-01-14 | Tohoku Nakatani:Kk | 金型製造法 |
JPH0512722A (ja) * | 1991-07-05 | 1993-01-22 | Tohoku Nakatani:Kk | スタンパー製造方法 |
JPH0614936U (ja) * | 1991-10-29 | 1994-02-25 | 日本セラミック株式会社 | 焦電型赤外線センサ及びその電極の製造方法 |
US5268782A (en) * | 1992-01-16 | 1993-12-07 | Minnesota Mining And Manufacturing Company | Micro-ridged, polymeric liquid crystal display substrate and display device |
GB9209912D0 (en) * | 1992-05-08 | 1992-06-24 | Winslow Int Ltd | Mounting arrangement for an intergrated circuit chip carrier |
JP3245308B2 (ja) * | 1994-08-26 | 2002-01-15 | 日本碍子株式会社 | 半導体装置の製造方法 |
JPH08225929A (ja) * | 1995-02-23 | 1996-09-03 | Matsushita Electric Ind Co Ltd | レーザ・アブレーションを用いた薄膜形成法およびレーザ・アブレーション装置 |
JPH08306080A (ja) * | 1995-04-28 | 1996-11-22 | Sony Corp | 情報記録媒体及びその成形型 |
JPH08306978A (ja) * | 1995-05-10 | 1996-11-22 | Hitachi Cable Ltd | 酸化物薄膜の製造方法および装置 |
JPH0936440A (ja) * | 1995-07-21 | 1997-02-07 | Osaka Gas Co Ltd | 熱電材料の作製方法 |
JPH09175835A (ja) * | 1995-12-25 | 1997-07-08 | Toyota Motor Corp | 表面加工方法 |
JP2955224B2 (ja) * | 1995-12-28 | 1999-10-04 | 花王株式会社 | 光ディスク用基板の製造方法 |
JPH09184803A (ja) * | 1995-12-29 | 1997-07-15 | Horiba Ltd | 赤外線ガス分析計 |
JPH09229858A (ja) * | 1996-02-20 | 1997-09-05 | Horiba Ltd | 赤外線ガス分析計 |
JP3376203B2 (ja) * | 1996-02-28 | 2003-02-10 | 株式会社東芝 | 半導体装置とその製造方法及びこの半導体装置を用いた実装構造体とその製造方法 |
JP3716504B2 (ja) * | 1996-08-05 | 2005-11-16 | 富士ゼロックス株式会社 | 微小構造体の製造方法および装置 |
GB9616809D0 (en) * | 1996-08-10 | 1996-09-25 | Eev Ltd | Gas monitors |
US5894108A (en) * | 1997-02-11 | 1999-04-13 | National Semiconductor Corporation | Plastic package with exposed die |
KR100279293B1 (ko) * | 1998-09-18 | 2001-03-02 | 윤종용 | 마이크로 볼 그리드 어레이 패키지에 의해서 포장되는 반도체장치 |
KR100338983B1 (ko) * | 1998-11-30 | 2002-07-18 | 윤종용 | 웨이퍼분리도구및이를이용하는웨이퍼분리방법 |
FR2787241B1 (fr) * | 1998-12-14 | 2003-01-31 | Ela Medical Sa | Composant microelectronique cms enrobe, notamment pour un dispositif medical implantable actif, et son procede de fabrication |
US6271048B1 (en) * | 2000-10-20 | 2001-08-07 | Unisys Corporation | Process for recycling a substrate from an integrated circuit package |
-
1998
- 1998-02-17 SE SE9800462A patent/SE521415C2/sv unknown
-
1999
- 1999-02-04 EP EP99906636A patent/EP1057006B1/en not_active Expired - Lifetime
- 1999-02-04 AU AU26494/99A patent/AU2649499A/en not_active Abandoned
- 1999-02-04 WO PCT/SE1999/000145 patent/WO1999041592A1/en active IP Right Grant
- 1999-02-04 AT AT99906636T patent/ATE497156T1/de not_active IP Right Cessation
- 1999-02-04 JP JP2000531864A patent/JP2002503556A/ja active Pending
- 1999-02-04 AU AU26493/99A patent/AU748969B2/en not_active Ceased
- 1999-02-04 EP EP99906637A patent/EP1057213A2/en not_active Ceased
- 1999-02-04 CA CA002320920A patent/CA2320920A1/en not_active Abandoned
- 1999-02-04 CN CNB998051241A patent/CN1174237C/zh not_active Expired - Fee Related
- 1999-02-04 DE DE69943160T patent/DE69943160D1/de not_active Expired - Lifetime
- 1999-02-04 WO PCT/SE1999/000146 patent/WO1999041772A2/en not_active Application Discontinuation
- 1999-02-04 US US09/622,398 patent/US6372542B1/en not_active Expired - Lifetime
- 1999-02-04 CA CA002320919A patent/CA2320919A1/en not_active Abandoned
- 1999-02-04 JP JP2000531725A patent/JP4401021B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU748969B2 (en) | 2002-06-13 |
ATE497156T1 (de) | 2011-02-15 |
WO1999041772A3 (en) | 1999-11-04 |
SE9800462D0 (sv) | 1998-02-17 |
EP1057006B1 (en) | 2011-01-26 |
JP4401021B2 (ja) | 2010-01-20 |
CN1297530A (zh) | 2001-05-30 |
WO1999041592A1 (en) | 1999-08-19 |
SE9800462L (sv) | 1999-08-18 |
JP2002503806A (ja) | 2002-02-05 |
CA2320920A1 (en) | 1999-08-19 |
EP1057213A2 (en) | 2000-12-06 |
DE69943160D1 (de) | 2011-03-10 |
AU2649399A (en) | 1999-08-30 |
CA2320919A1 (en) | 1999-08-19 |
US6372542B1 (en) | 2002-04-16 |
WO1999041772A2 (en) | 1999-08-19 |
JP2002503556A (ja) | 2002-02-05 |
AU2649499A (en) | 1999-08-30 |
CN1174237C (zh) | 2004-11-03 |
EP1057006A1 (en) | 2000-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE521415C2 (sv) | Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden | |
EP1642100B1 (en) | Thermal detector | |
US6871537B1 (en) | Liquid flow sensor thermal interface methods and systems | |
US20130043552A1 (en) | Integrated infrared sensors with optical elements and methods | |
EP0003271A1 (fr) | Fluxmètre thermique | |
WO1998011411A1 (en) | Microbridge structure for emitting or detecting radiations, and method for forming such microbridge structure | |
Markowski | Thermoelectric energy harvester fabricated in thick-film/LTCC technology | |
US5048973A (en) | Plug-type heat flux gauge | |
US6403959B1 (en) | Infrared detector element, and infrared sensor unit and infrared detecting device using it | |
JPH01778A (ja) | 熱電対式温度センサ | |
EP1262736B1 (en) | Sensor head | |
US5086204A (en) | Method of producing a plug-type heat flux gauge | |
CN111609951B (zh) | 一种厚膜热流计的共形制备方法以及产品 | |
SE521792C2 (sv) | Användning av en detektor i en kalorimeter samt en detektor härför | |
JPH07263710A (ja) | 半導体装置およびその製造方法 | |
GB2358472A (en) | Heat flux sensor | |
JPH085597A (ja) | 防風構造を有するマイクロガスセンサ | |
SE522989C2 (sv) | Metod för komponentframställning | |
CN219657031U (zh) | 非制冷焦平面红外传感器 | |
JP4216237B2 (ja) | 熱電式化学センサの製造方法 | |
CN103185810A (zh) | 无线式热气泡式加速仪及其制备方法 | |
Whatmore et al. | Pyroelectric arrays using ceramics and thin films integrated radiation collectors: Design fabrication and testing | |
CN116558651A (zh) | 非制冷焦平面红外传感器及其制备方法 | |
JPH1079531A (ja) | エネルギ変換素子及びその製造方法 | |
Damerell et al. | Design and performance of the SLD vertex detector, a 120 Mpixel tracking system |