SE515856C2 - Bärare för elektronikkomponenter - Google Patents

Bärare för elektronikkomponenter

Info

Publication number
SE515856C2
SE515856C2 SE9901831A SE9901831A SE515856C2 SE 515856 C2 SE515856 C2 SE 515856C2 SE 9901831 A SE9901831 A SE 9901831A SE 9901831 A SE9901831 A SE 9901831A SE 515856 C2 SE515856 C2 SE 515856C2
Authority
SE
Sweden
Prior art keywords
carrier
components
component
dielectric layer
spaces
Prior art date
Application number
SE9901831A
Other languages
English (en)
Swedish (sv)
Other versions
SE9901831L (sv
SE9901831D0 (sv
Inventor
Leif Bergstedt
Per Ligander
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9901831A priority Critical patent/SE515856C2/sv
Publication of SE9901831D0 publication Critical patent/SE9901831D0/xx
Priority to PCT/SE2000/001008 priority patent/WO2000070679A1/en
Priority to JP2000619030A priority patent/JP4758006B2/ja
Priority to AU49685/00A priority patent/AU4968500A/en
Priority to BR0010572-4A priority patent/BR0010572A/pt
Priority to EP00931872A priority patent/EP1186033B1/en
Priority to DE60041916T priority patent/DE60041916D1/de
Priority to US09/574,243 priority patent/US6690583B1/en
Publication of SE9901831L publication Critical patent/SE9901831L/xx
Publication of SE515856C2 publication Critical patent/SE515856C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15165—Monolayer substrate
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Details Of Resistors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
SE9901831A 1999-05-19 1999-05-19 Bärare för elektronikkomponenter SE515856C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9901831A SE515856C2 (sv) 1999-05-19 1999-05-19 Bärare för elektronikkomponenter
PCT/SE2000/001008 WO2000070679A1 (en) 1999-05-19 2000-05-18 Carrier for electronic components and a method for manufacturing a carrier
JP2000619030A JP4758006B2 (ja) 1999-05-19 2000-05-18 電子部品用のキャリア及びキャリアの製造方法
AU49685/00A AU4968500A (en) 1999-05-19 2000-05-18 Carrier for electronic components and a method for manufacturing a carrier
BR0010572-4A BR0010572A (pt) 1999-05-19 2000-05-18 Portador projetado para um ou diversos componentes eletrônicos, e, processo para fabricar um portador substancialmente condutor de calor para um componente eletrônico
EP00931872A EP1186033B1 (en) 1999-05-19 2000-05-18 Carrier for electronic components and a method for manufacturing a carrier
DE60041916T DE60041916D1 (de) 1999-05-19 2000-05-18 Elektonikbauteil-träger und seine herstellung
US09/574,243 US6690583B1 (en) 1999-05-19 2000-05-19 Carrier for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9901831A SE515856C2 (sv) 1999-05-19 1999-05-19 Bärare för elektronikkomponenter

Publications (3)

Publication Number Publication Date
SE9901831D0 SE9901831D0 (sv) 1999-05-19
SE9901831L SE9901831L (sv) 2000-11-20
SE515856C2 true SE515856C2 (sv) 2001-10-22

Family

ID=20415669

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9901831A SE515856C2 (sv) 1999-05-19 1999-05-19 Bärare för elektronikkomponenter

Country Status (8)

Country Link
US (1) US6690583B1 (ja)
EP (1) EP1186033B1 (ja)
JP (1) JP4758006B2 (ja)
AU (1) AU4968500A (ja)
BR (1) BR0010572A (ja)
DE (1) DE60041916D1 (ja)
SE (1) SE515856C2 (ja)
WO (1) WO2000070679A1 (ja)

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FI119583B (fi) * 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US7429596B2 (en) * 2003-06-20 2008-09-30 The Regents Of The University Of California 1H-pyrrolo [2,3-D] pyrimidine derivatives and methods of use thereof
US7321098B2 (en) * 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
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US9512125B2 (en) 2004-11-19 2016-12-06 The Regents Of The University Of California Substituted pyrazolo[3.4-D] pyrimidines as anti-inflammatory agents
US7365273B2 (en) * 2004-12-03 2008-04-29 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices
FR2879819B1 (fr) * 2004-12-21 2007-02-23 Ulis Soc Par Actions Simplifie Composant de detection de rayonnements electromagnetiques notamment infrarouges
US7335986B1 (en) 2005-09-14 2008-02-26 Amkor Technology, Inc. Wafer level chip scale package
AU2007347115A1 (en) 2006-04-04 2008-10-23 The Regents Of The University Of California PI3 kinase antagonists
KR100825766B1 (ko) 2007-04-26 2008-04-29 한국전자통신연구원 Ｌｔｃｃ 패키지 및 그 제조방법
DE102007037538A1 (de) * 2007-08-09 2009-02-12 Robert Bosch Gmbh Baugruppe sowie Herstellung einer Baugruppe
WO2009046448A1 (en) * 2007-10-04 2009-04-09 Intellikine, Inc. Chemical entities and therapeutic uses thereof
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EP1186033A1 (en) 2002-03-13
WO2000070679A1 (en) 2000-11-23
BR0010572A (pt) 2002-06-04
SE9901831D0 (sv) 1999-05-19
WO2000070679B1 (en) 2001-02-08
JP4758006B2 (ja) 2011-08-24
AU4968500A (en) 2000-12-05
EP1186033B1 (en) 2009-04-01
US6690583B1 (en) 2004-02-10
DE60041916D1 (de) 2009-05-14
JP2003500834A (ja) 2003-01-07

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