SE504195C2 - Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning - Google Patents
Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställningInfo
- Publication number
- SE504195C2 SE504195C2 SE9501017A SE9501017A SE504195C2 SE 504195 C2 SE504195 C2 SE 504195C2 SE 9501017 A SE9501017 A SE 9501017A SE 9501017 A SE9501017 A SE 9501017A SE 504195 C2 SE504195 C2 SE 504195C2
- Authority
- SE
- Sweden
- Prior art keywords
- layer
- metal
- laminate
- layers
- ionomer
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 6
- 238000000034 method Methods 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000004033 plastic Substances 0.000 claims abstract description 50
- 229920003023 plastic Polymers 0.000 claims abstract description 50
- 229920000554 ionomer Polymers 0.000 claims abstract description 37
- 239000010410 layer Substances 0.000 claims description 95
- 239000000463 material Substances 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 8
- 238000007906 compression Methods 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 7
- 239000004416 thermosoftening plastic Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 3
- 239000012815 thermoplastic material Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- -1 polyethylene Polymers 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920003182 Surlyn® Polymers 0.000 description 2
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/12—Deep-drawing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/10—Polypropylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2581/00—Seals; Sealing equipment; Gaskets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31699—Ester, halide or nitrile of addition polymer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9501017A SE504195C2 (sv) | 1995-03-21 | 1995-03-21 | Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning |
US08/894,684 US6238802B1 (en) | 1995-03-21 | 1996-03-19 | Laminate for sealing capsules |
CN96192684A CN1102498C (zh) | 1995-03-21 | 1996-03-19 | 用于密封和封装的压层材料和方法 |
PCT/SE1996/000343 WO1996029202A1 (en) | 1995-03-21 | 1996-03-19 | A laminate for sealing capsules |
AU51304/96A AU5130496A (en) | 1995-03-21 | 1996-03-19 | A laminate for sealing capsules |
KR1019970706445A KR100357434B1 (ko) | 1995-03-21 | 1996-03-19 | 전자회로기판을밀봉및캡슐화하는적층체 |
JP52833396A JP4558847B2 (ja) | 1995-03-21 | 1996-03-19 | カプセルを密封するための積層体 |
DE69628289T DE69628289T2 (de) | 1995-03-21 | 1996-03-19 | Laminat zum versiegeln von kapseln |
EP96907842A EP0819055B1 (de) | 1995-03-21 | 1996-03-19 | Laminat zum versiegeln von kapseln |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9501017A SE504195C2 (sv) | 1995-03-21 | 1995-03-21 | Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9501017D0 SE9501017D0 (sv) | 1995-03-21 |
SE9501017L SE9501017L (sv) | 1996-09-22 |
SE504195C2 true SE504195C2 (sv) | 1996-12-02 |
Family
ID=20397631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9501017A SE504195C2 (sv) | 1995-03-21 | 1995-03-21 | Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning |
Country Status (9)
Country | Link |
---|---|
US (1) | US6238802B1 (de) |
EP (1) | EP0819055B1 (de) |
JP (1) | JP4558847B2 (de) |
KR (1) | KR100357434B1 (de) |
CN (1) | CN1102498C (de) |
AU (1) | AU5130496A (de) |
DE (1) | DE69628289T2 (de) |
SE (1) | SE504195C2 (de) |
WO (1) | WO1996029202A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001043517A1 (en) * | 1999-12-07 | 2001-06-14 | Imego Ab | Sealing arrangement |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144389A (ja) * | 1999-11-10 | 2001-05-25 | Fujikura Ltd | フレキシブルプリント基板 |
KR20010099392A (ko) * | 2001-09-25 | 2001-11-09 | 주식회사 누리테크 | 파릴렌을 이용한 전자파차폐방법 |
JP4037810B2 (ja) * | 2003-09-05 | 2008-01-23 | Necアクセステクニカ株式会社 | 小型無線装置及びその実装方法 |
US20060254202A1 (en) * | 2005-05-13 | 2006-11-16 | Dan Villanella | Lightweight shielded panel system including acoustical shielding |
BRPI0520405A2 (pt) * | 2005-06-30 | 2009-05-05 | Siemens Ag | sistema de proteção de hardware na forma de placas de circuito impresso de estampagem profunda como meias conchas |
CN101497251A (zh) * | 2008-02-01 | 2009-08-05 | 深圳富泰宏精密工业有限公司 | 壳体 |
TWI372558B (en) * | 2009-04-08 | 2012-09-11 | Flexible thin image-sensing module with anti-emi function and flexible thin pcb module with anti-emi function | |
NO20101359A1 (no) * | 2010-09-30 | 2012-04-02 | Nexans | Kraftkabel med laminert vannbarriere |
CN104553240A (zh) * | 2015-01-09 | 2015-04-29 | 深圳顺络电子股份有限公司 | 一种叠层片式元件的成型方法及其使用的复合材料 |
CN104500745B (zh) * | 2015-01-16 | 2016-06-08 | 王仪靖 | 一种高耐磨且具有吸收补偿功能的浮动式密封装置 |
WO2018065582A1 (en) * | 2016-10-07 | 2018-04-12 | Jaguar Land Rover Limited | Control unit |
GB2554737A (en) * | 2016-10-07 | 2018-04-11 | Jaguar Land Rover Ltd | Control unit |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US439810A (en) * | 1890-11-04 | Casseday | ||
US3725169A (en) * | 1971-06-11 | 1973-04-03 | Anaconda Aluminum Co | Bimetallic laminate and method of making same |
DE2233958A1 (de) * | 1971-08-12 | 1973-02-22 | Alsacienne Aluminium | Verbundbaustoffelement und verfahren sowie vorrichtung zu seiner herstellung |
JPS6116125Y2 (de) * | 1980-04-14 | 1986-05-19 | ||
CA1180654A (en) * | 1981-01-19 | 1985-01-08 | Richard H. Brezinsky | Plastic/metal laminates, cable shielding or armoring tapes, and electrical cables made therewith |
US4351864A (en) * | 1981-05-06 | 1982-09-28 | The Standard Products Company | Molding having encapsulated metallized film |
US4439810A (en) | 1981-09-10 | 1984-03-27 | Marcon Electronics Co., Ltd. | Electric capacitor with enclosure structure consisting of plastic laminated film |
EP0108710A2 (de) * | 1982-10-08 | 1984-05-16 | Ciba-Geigy Ag | Laminate aus Metallplatten und thermoplastischem Material |
CA1241586A (en) * | 1983-10-13 | 1988-09-06 | Nobuo Fukushima | Vibration-damping material with excellent workability |
JPS60151045A (ja) * | 1984-01-19 | 1985-08-08 | 富士写真フイルム株式会社 | 感光材料用包装材料 |
JPS62173244A (ja) * | 1986-01-27 | 1987-07-30 | 新日本製鐵株式会社 | 耐食性に優れた複合鋼製飲食缶用側面継目なし容器およびその製造法 |
JPH0825565B2 (ja) * | 1987-04-28 | 1996-03-13 | 富士写真フイルム株式会社 | 写真感光材料用1重ガゼット袋 |
JPH0659718B2 (ja) * | 1987-05-15 | 1994-08-10 | 富士写真フイルム株式会社 | 感光物質用包装材料 |
US5376446A (en) * | 1991-02-01 | 1994-12-27 | E. I. Du Pont De Nemours And Company | Electrically dissipative composite |
SE505658C2 (sv) | 1993-03-24 | 1997-09-29 | Ericsson Telefon Ab L M | Anordning för elektrisk kontaktering i fogar |
-
1995
- 1995-03-21 SE SE9501017A patent/SE504195C2/sv not_active IP Right Cessation
-
1996
- 1996-03-19 KR KR1019970706445A patent/KR100357434B1/ko not_active IP Right Cessation
- 1996-03-19 DE DE69628289T patent/DE69628289T2/de not_active Expired - Lifetime
- 1996-03-19 JP JP52833396A patent/JP4558847B2/ja not_active Expired - Fee Related
- 1996-03-19 CN CN96192684A patent/CN1102498C/zh not_active Expired - Fee Related
- 1996-03-19 WO PCT/SE1996/000343 patent/WO1996029202A1/en active IP Right Grant
- 1996-03-19 EP EP96907842A patent/EP0819055B1/de not_active Expired - Lifetime
- 1996-03-19 AU AU51304/96A patent/AU5130496A/en not_active Abandoned
- 1996-03-19 US US08/894,684 patent/US6238802B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001043517A1 (en) * | 1999-12-07 | 2001-06-14 | Imego Ab | Sealing arrangement |
Also Published As
Publication number | Publication date |
---|---|
CN1179129A (zh) | 1998-04-15 |
JPH11502177A (ja) | 1999-02-23 |
CN1102498C (zh) | 2003-03-05 |
SE9501017D0 (sv) | 1995-03-21 |
EP0819055B1 (de) | 2003-05-21 |
WO1996029202A1 (en) | 1996-09-26 |
KR100357434B1 (ko) | 2003-10-17 |
DE69628289D1 (de) | 2003-06-26 |
DE69628289T2 (de) | 2004-04-01 |
AU5130496A (en) | 1996-10-08 |
SE9501017L (sv) | 1996-09-22 |
US6238802B1 (en) | 2001-05-29 |
KR19980703037A (ko) | 1998-09-05 |
JP4558847B2 (ja) | 2010-10-06 |
EP0819055A1 (de) | 1998-01-21 |
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