SE9501017D0 - Laminat för förslutning av kapslar - Google Patents

Laminat för förslutning av kapslar

Info

Publication number
SE9501017D0
SE9501017D0 SE9501017A SE9501017A SE9501017D0 SE 9501017 D0 SE9501017 D0 SE 9501017D0 SE 9501017 A SE9501017 A SE 9501017A SE 9501017 A SE9501017 A SE 9501017A SE 9501017 D0 SE9501017 D0 SE 9501017D0
Authority
SE
Sweden
Prior art keywords
metal
layer
laminate
plastics
sealing
Prior art date
Application number
SE9501017A
Other languages
English (en)
Other versions
SE504195C2 (sv
SE9501017L (sv
Inventor
Karl-Erik Leeb
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9501017A priority Critical patent/SE504195C2/sv
Publication of SE9501017D0 publication Critical patent/SE9501017D0/sv
Priority to AU51304/96A priority patent/AU5130496A/en
Priority to DE69628289T priority patent/DE69628289T2/de
Priority to EP96907842A priority patent/EP0819055B1/en
Priority to US08/894,684 priority patent/US6238802B1/en
Priority to CN96192684A priority patent/CN1102498C/zh
Priority to PCT/SE1996/000343 priority patent/WO1996029202A1/en
Priority to JP52833396A priority patent/JP4558847B2/ja
Priority to KR1019970706445A priority patent/KR100357434B1/ko
Publication of SE9501017L publication Critical patent/SE9501017L/sv
Publication of SE504195C2 publication Critical patent/SE504195C2/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/12—Deep-drawing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2581/00—Seals; Sealing equipment; Gaskets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
SE9501017A 1995-03-21 1995-03-21 Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning SE504195C2 (sv)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SE9501017A SE504195C2 (sv) 1995-03-21 1995-03-21 Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning
KR1019970706445A KR100357434B1 (ko) 1995-03-21 1996-03-19 전자회로기판을밀봉및캡슐화하는적층체
US08/894,684 US6238802B1 (en) 1995-03-21 1996-03-19 Laminate for sealing capsules
DE69628289T DE69628289T2 (de) 1995-03-21 1996-03-19 Laminat zum versiegeln von kapseln
EP96907842A EP0819055B1 (en) 1995-03-21 1996-03-19 A laminate for sealing capsules
AU51304/96A AU5130496A (en) 1995-03-21 1996-03-19 A laminate for sealing capsules
CN96192684A CN1102498C (zh) 1995-03-21 1996-03-19 用于密封和封装的压层材料和方法
PCT/SE1996/000343 WO1996029202A1 (en) 1995-03-21 1996-03-19 A laminate for sealing capsules
JP52833396A JP4558847B2 (ja) 1995-03-21 1996-03-19 カプセルを密封するための積層体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9501017A SE504195C2 (sv) 1995-03-21 1995-03-21 Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning

Publications (3)

Publication Number Publication Date
SE9501017D0 true SE9501017D0 (sv) 1995-03-21
SE9501017L SE9501017L (sv) 1996-09-22
SE504195C2 SE504195C2 (sv) 1996-12-02

Family

ID=20397631

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9501017A SE504195C2 (sv) 1995-03-21 1995-03-21 Laminat för förslutning och kapsling av elektroniska komponenter, samt sätt för dess framställning

Country Status (9)

Country Link
US (1) US6238802B1 (sv)
EP (1) EP0819055B1 (sv)
JP (1) JP4558847B2 (sv)
KR (1) KR100357434B1 (sv)
CN (1) CN1102498C (sv)
AU (1) AU5130496A (sv)
DE (1) DE69628289T2 (sv)
SE (1) SE504195C2 (sv)
WO (1) WO1996029202A1 (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144389A (ja) * 1999-11-10 2001-05-25 Fujikura Ltd フレキシブルプリント基板
SE517022C2 (sv) * 1999-12-07 2002-04-02 Imego Ab Förseglingsanordning samt metod för hermetisk försegling
KR20010099392A (ko) * 2001-09-25 2001-11-09 주식회사 누리테크 파릴렌을 이용한 전자파차폐방법
JP4037810B2 (ja) * 2003-09-05 2008-01-23 Ｎｅｃアクセステクニカ株式会社 小型無線装置及びその実装方法
US20060254202A1 (en) * 2005-05-13 2006-11-16 Dan Villanella Lightweight shielded panel system including acoustical shielding
BRPI0520405A2 (pt) * 2005-06-30 2009-05-05 Siemens Ag sistema de proteção de hardware na forma de placas de circuito impresso de estampagem profunda como meias conchas
CN101497251A (zh) * 2008-02-01 2009-08-05 深圳富泰宏精密工业有限公司 壳体
TWI372558B (en) * 2009-04-08 2012-09-11 Flexible thin image-sensing module with anti-emi function and flexible thin pcb module with anti-emi function
NO20101359A1 (no) * 2010-09-30 2012-04-02 Nexans Kraftkabel med laminert vannbarriere
CN104553240A (zh) * 2015-01-09 2015-04-29 深圳顺络电子股份有限公司 一种叠层片式元件的成型方法及其使用的复合材料
CN104500745B (zh) * 2015-01-16 2016-06-08 王仪靖 一种高耐磨且具有吸收补偿功能的浮动式密封装置
GB2554737A (en) * 2016-10-07 2018-04-11 Jaguar Land Rover Ltd Control unit
US10829048B2 (en) * 2016-10-07 2020-11-10 Jaguar Land Rover Limited Control unit

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US439810A (en) * 1890-11-04 Casseday
US3725169A (en) 1971-06-11 1973-04-03 Anaconda Aluminum Co Bimetallic laminate and method of making same
DE2233958A1 (de) * 1971-08-12 1973-02-22 Alsacienne Aluminium Verbundbaustoffelement und verfahren sowie vorrichtung zu seiner herstellung
JPS6116125Y2 (sv) * 1980-04-14 1986-05-19
CA1180654A (en) * 1981-01-19 1985-01-08 Richard H. Brezinsky Plastic/metal laminates, cable shielding or armoring tapes, and electrical cables made therewith
US4351864A (en) * 1981-05-06 1982-09-28 The Standard Products Company Molding having encapsulated metallized film
US4439810A (en) 1981-09-10 1984-03-27 Marcon Electronics Co., Ltd. Electric capacitor with enclosure structure consisting of plastic laminated film
EP0108710A2 (de) * 1982-10-08 1984-05-16 Ciba-Geigy Ag Laminate aus Metallplatten und thermoplastischem Material
CA1241586A (en) * 1983-10-13 1988-09-06 Nobuo Fukushima Vibration-damping material with excellent workability
JPS60151045A (ja) * 1984-01-19 1985-08-08 富士写真フイルム株式会社 感光材料用包装材料
JPS62173244A (ja) * 1986-01-27 1987-07-30 新日本製鐵株式会社 耐食性に優れた複合鋼製飲食缶用側面継目なし容器およびその製造法
JPH0825565B2 (ja) * 1987-04-28 1996-03-13 富士写真フイルム株式会社 写真感光材料用１重ガゼット袋
JPH0659718B2 (ja) * 1987-05-15 1994-08-10 富士写真フイルム株式会社 感光物質用包装材料
US5376446A (en) 1991-02-01 1994-12-27 E. I. Du Pont De Nemours And Company Electrically dissipative composite
SE505658C2 (sv) 1993-03-24 1997-09-29 Ericsson Telefon Ab L M Anordning för elektrisk kontaktering i fogar

Also Published As

Publication number Publication date
SE504195C2 (sv) 1996-12-02
KR100357434B1 (ko) 2003-10-17
EP0819055A1 (en) 1998-01-21
DE69628289T2 (de) 2004-04-01
WO1996029202A1 (en) 1996-09-26
CN1102498C (zh) 2003-03-05
CN1179129A (zh) 1998-04-15
US6238802B1 (en) 2001-05-29
AU5130496A (en) 1996-10-08
JP4558847B2 (ja) 2010-10-06
SE9501017L (sv) 1996-09-22
EP0819055B1 (en) 2003-05-21
JPH11502177A (ja) 1999-02-23
KR19980703037A (ko) 1998-09-05
DE69628289D1 (de) 2003-06-26

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