SE465272B - Koppar-nickel-tenn-titanlegering, foerfaraande foer framstaellning daerav samt anvaendning daerav - Google Patents
Koppar-nickel-tenn-titanlegering, foerfaraande foer framstaellning daerav samt anvaendning daeravInfo
- Publication number
- SE465272B SE465272B SE8502835A SE8502835A SE465272B SE 465272 B SE465272 B SE 465272B SE 8502835 A SE8502835 A SE 8502835A SE 8502835 A SE8502835 A SE 8502835A SE 465272 B SE465272 B SE 465272B
- Authority
- SE
- Sweden
- Prior art keywords
- tin
- nickel
- alloy
- copper
- titanium
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 10
- 229910001069 Ti alloy Inorganic materials 0.000 title claims description 9
- HAGWIPLBDFOLMO-UHFFFAOYSA-N [Ni].[Ti].[Cu].[Sn] Chemical compound [Ni].[Ti].[Cu].[Sn] HAGWIPLBDFOLMO-UHFFFAOYSA-N 0.000 title claims description 8
- 239000000956 alloy Substances 0.000 claims description 43
- 229910045601 alloy Inorganic materials 0.000 claims description 42
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 31
- 239000011651 chromium Substances 0.000 claims description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052804 chromium Inorganic materials 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 14
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 9
- 238000005097 cold rolling Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000005098 hot rolling Methods 0.000 claims description 4
- 238000005496 tempering Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000005275 alloying Methods 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims 3
- 239000012876 carrier material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000002244 precipitate Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000011135 tin Substances 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 101150007129 MRRF gene Proteins 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000004584 weight gain Effects 0.000 description 2
- 235000019786 weight gain Nutrition 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- BLOIXGFLXPCOGW-UHFFFAOYSA-N [Ti].[Sn] Chemical compound [Ti].[Sn] BLOIXGFLXPCOGW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000029142 excretion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000028327 secretion Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843421198 DE3421198C1 (de) | 1984-06-07 | 1984-06-07 | Kupfer-Nickel-Zinn-Titan-Legierung, Verfahren zu ihrer Herstellung sowie ihre Verwendung |
| DE3432226A DE3432226C1 (de) | 1984-06-07 | 1984-09-01 | Kupfer-Nickel-Zinn-Titan-Legierung,Verfahren zu ihrer Herstellung sowie ihre Verwendung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE8502835D0 SE8502835D0 (sv) | 1985-06-07 |
| SE8502835L SE8502835L (sv) | 1985-12-08 |
| SE465272B true SE465272B (sv) | 1991-08-19 |
Family
ID=25821928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE8502835A SE465272B (sv) | 1984-06-07 | 1985-06-07 | Koppar-nickel-tenn-titanlegering, foerfaraande foer framstaellning daerav samt anvaendning daerav |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4601879A (it) |
| CH (1) | CH665222A5 (it) |
| DE (1) | DE3432226C1 (it) |
| FR (1) | FR2565601B1 (it) |
| GB (1) | GB2159836B (it) |
| IT (1) | IT1183884B (it) |
| SE (1) | SE465272B (it) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3660351D1 (en) * | 1985-02-01 | 1988-08-04 | Kobe Steel Ltd | Lead material for ceramic package ic |
| DE3527341C1 (de) * | 1985-07-31 | 1986-10-23 | Wieland-Werke Ag, 7900 Ulm | Kupfer-Chrom-Titan-Silizium-Legierung und ihre Verwendung |
| JPS6250425A (ja) * | 1985-08-29 | 1987-03-05 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
| US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
| US4788627A (en) * | 1986-06-06 | 1988-11-29 | Tektronix, Inc. | Heat sink device using composite metal alloy |
| JPH02225651A (ja) * | 1988-11-15 | 1990-09-07 | Mitsubishi Electric Corp | 高強度Ｃｕ―Ｎｉ―Ｓｎ合金の製造方法 |
| US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
| US20040166017A1 (en) * | 2002-09-13 | 2004-08-26 | Olin Corporation | Age-hardening copper-base alloy and processing |
| CN110241327B (zh) * | 2019-06-25 | 2020-10-20 | 宁波金田铜业(集团)股份有限公司 | 一种含Ti锡青铜棒及其制备加工和热处理工艺方法 |
| CN115896534A (zh) * | 2022-11-29 | 2023-04-04 | 宁波博威合金板带有限公司 | 一种含铬铜合金带材及其制备方法和应用 |
| CN115874080B (zh) * | 2022-12-14 | 2024-02-20 | 河南科技大学 | 一种铜基合金材料及其制备方法和应用 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1458340A1 (de) * | 1963-12-27 | 1968-11-07 | Berkenhoff & Co | Aushaertbare Legierung |
| US3421888A (en) * | 1966-08-12 | 1969-01-14 | Calumet & Hecla Corp | Copper alloy |
| AU8343175A (en) * | 1974-10-04 | 1977-02-03 | Olin Corp | High strength, corrosion resistant cubase-si-sn alloys with good strength to bend ductility |
| US4046596A (en) * | 1975-06-27 | 1977-09-06 | American Optical Corporation | Process for producing spectacle frames using an age-hardenable nickel-bronze alloy |
| JPS6012422B2 (ja) * | 1976-07-29 | 1985-04-01 | 株式会社東芝 | リ−ド線材の製造方法 |
| DE2948916C2 (de) * | 1979-12-05 | 1981-12-10 | Wieland-Werke Ag, 7900 Ulm | Kupfer-Zinn-Legierung, Verfahren zu ihrer Herstellung sowie ihre Verwendung |
| JPS5834536B2 (ja) * | 1980-06-06 | 1983-07-27 | 日本鉱業株式会社 | 半導体機器のリ−ド材用の銅合金 |
| JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
| JPS60181250A (ja) * | 1984-02-28 | 1985-09-14 | Mitsubishi Metal Corp | 半導体機器のリ−ド材用銅合金 |
| JPS60184655A (ja) * | 1984-03-02 | 1985-09-20 | Hitachi Metals Ltd | 高強度高電導度銅合金 |
-
1984
- 1984-09-01 DE DE3432226A patent/DE3432226C1/de not_active Expired
-
1985
- 1985-05-24 US US06/737,976 patent/US4601879A/en not_active Expired - Fee Related
- 1985-06-06 FR FR8508563A patent/FR2565601B1/fr not_active Expired
- 1985-06-06 GB GB08514283A patent/GB2159836B/en not_active Expired
- 1985-06-06 CH CH2403/85A patent/CH665222A5/de not_active IP Right Cessation
- 1985-06-07 SE SE8502835A patent/SE465272B/sv not_active IP Right Cessation
- 1985-06-07 IT IT67536/85A patent/IT1183884B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| GB2159836A (en) | 1985-12-11 |
| SE8502835D0 (sv) | 1985-06-07 |
| CH665222A5 (de) | 1988-04-29 |
| SE8502835L (sv) | 1985-12-08 |
| FR2565601A1 (fr) | 1985-12-13 |
| DE3432226C1 (de) | 1985-08-22 |
| IT8567536A1 (it) | 1986-12-07 |
| GB2159836B (en) | 1988-02-24 |
| US4601879A (en) | 1986-07-22 |
| IT8567536A0 (it) | 1985-06-07 |
| FR2565601B1 (fr) | 1988-03-11 |
| IT1183884B (it) | 1987-10-22 |
| GB8514283D0 (en) | 1985-07-10 |
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