RU2521224C1 - Твердотельное устройство захвата изображения - Google Patents

Твердотельное устройство захвата изображения Download PDF

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RU2521224C1
RU2521224C1 RU2013105505/28A RU2013105505A RU2521224C1 RU 2521224 C1 RU2521224 C1 RU 2521224C1 RU 2013105505/28 A RU2013105505/28 A RU 2013105505/28A RU 2013105505 A RU2013105505 A RU 2013105505A RU 2521224 C1 RU2521224 C1 RU 2521224C1
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solid
contact portion
state image
film
diffusion prevention
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RU2013105505/28A
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English (en)
Russian (ru)
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Минео СИМОЦУСА
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Кэнон Кабусики Кайся
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    • H01L2224/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
    • H01L2224/081—Disposition
    • H01L2224/0812—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/08121—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the connected bonding areas being not aligned with respect to each other
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    • H01L2224/0812—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/08135—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/08145—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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    • H01L2224/808—Bonding techniques
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    • H01L2224/808—Bonding techniques
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    • H01L2224/80986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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