RU2191446C2 - Способ изготовления несущего элемента для полупроводниковых чипов - Google Patents

Способ изготовления несущего элемента для полупроводниковых чипов Download PDF

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Publication number
RU2191446C2
RU2191446C2 RU99100202/28A RU99100202A RU2191446C2 RU 2191446 C2 RU2191446 C2 RU 2191446C2 RU 99100202/28 A RU99100202/28 A RU 99100202/28A RU 99100202 A RU99100202 A RU 99100202A RU 2191446 C2 RU2191446 C2 RU 2191446C2
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RU
Russia
Prior art keywords
film
chip
stiffness
substrate
frame
Prior art date
Application number
RU99100202/28A
Other languages
English (en)
Russian (ru)
Other versions
RU99100202A (ru
Inventor
Михель Хубер
Петер Штампка
Детлеф Удо
Юрген ФИШЕР
Йозеф Хайтцер
Хельмут Граф
Original Assignee
Сименс Акциенгезелльшафт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19623826A external-priority patent/DE19623826C2/de
Priority claimed from DE29621837U external-priority patent/DE29621837U1/de
Application filed by Сименс Акциенгезелльшафт filed Critical Сименс Акциенгезелльшафт
Publication of RU99100202A publication Critical patent/RU99100202A/ru
Application granted granted Critical
Publication of RU2191446C2 publication Critical patent/RU2191446C2/ru

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Turning (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Light Receiving Elements (AREA)
  • Wire Bonding (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Die Bonding (AREA)
RU99100202/28A 1996-06-14 1997-06-10 Способ изготовления несущего элемента для полупроводниковых чипов RU2191446C2 (ru)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19623826A DE19623826C2 (de) 1996-06-14 1996-06-14 Verfahren zur Herstellung eines Trägerelements für Halbleiterchips
DE19623826.9 1996-06-14
DE29621837.5 1996-12-16
DE29621837U DE29621837U1 (de) 1996-12-16 1996-12-16 Trägerelement für Halbleiterchips

Publications (2)

Publication Number Publication Date
RU99100202A RU99100202A (ru) 2000-10-20
RU2191446C2 true RU2191446C2 (ru) 2002-10-20

Family

ID=26026591

Family Applications (1)

Application Number Title Priority Date Filing Date
RU99100202/28A RU2191446C2 (ru) 1996-06-14 1997-06-10 Способ изготовления несущего элемента для полупроводниковых чипов

Country Status (11)

Country Link
EP (1) EP0904602B1 (enExample)
JP (1) JP3498800B2 (enExample)
CN (1) CN1156002C (enExample)
AT (1) ATE212752T1 (enExample)
BR (1) BR9709717A (enExample)
DE (1) DE59706247D1 (enExample)
ES (1) ES2171948T3 (enExample)
IN (1) IN192422B (enExample)
RU (1) RU2191446C2 (enExample)
UA (1) UA42106C2 (enExample)
WO (1) WO1997048133A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2790850B1 (fr) * 1999-03-12 2004-02-27 Gemplus Card Int Procede de fabrication de dispositif electronique portable de type carte a puce
JP3314304B2 (ja) 1999-06-07 2002-08-12 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ用の回路基板
JP2006520102A (ja) * 2003-03-07 2006-08-31 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 半導体装置、半導体本体並びにその製造方法
CN105161427B (zh) * 2008-11-17 2019-12-06 先进封装技术私人有限公司 半导体基板、半导体封装与半导体装置的制造方法
TWI581378B (zh) * 2008-11-21 2017-05-01 先進封裝技術私人有限公司 半導體基板
FR2974969B1 (fr) * 2011-05-03 2014-03-14 Alstom Transport Sa Dispositif d'interconnexion electrique d'au moins un composant electronique avec une alimentation electrique comprenant des moyens de diminution d'une inductance de boucle entre des premiere et deuxieme bornes
US20140239428A1 (en) * 2013-02-28 2014-08-28 Infineon Technologies Ag Chip arrangement and a method for manufacturing a chip arrangement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61204788A (ja) * 1985-03-08 1986-09-10 Dainippon Printing Co Ltd 携持用電子装置
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5147982A (en) * 1989-04-07 1992-09-15 Sgs-Thomson Microelectronics S.A. Encapsulation of electronic modules

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Березин А.С., Мочалкина О.Р. Технология и конструирование интегральных микросхем. - М.: Радио и связь, 1983, с.84-86. *

Also Published As

Publication number Publication date
DE59706247D1 (de) 2002-03-14
JP3498800B2 (ja) 2004-02-16
WO1997048133A1 (de) 1997-12-18
CN1156002C (zh) 2004-06-30
ATE212752T1 (de) 2002-02-15
EP0904602A1 (de) 1999-03-31
CN1222253A (zh) 1999-07-07
BR9709717A (pt) 1999-08-10
IN192422B (enExample) 2004-04-24
JP2000512045A (ja) 2000-09-12
ES2171948T3 (es) 2002-09-16
EP0904602B1 (de) 2002-01-30
UA42106C2 (uk) 2001-10-15

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MM4A The patent is invalid due to non-payment of fees

Effective date: 20070611