UA42106C2 - Спосіб виготовлення несучого елемента для напівпровідникового чипа - Google Patents

Спосіб виготовлення несучого елемента для напівпровідникового чипа

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Publication number
UA42106C2
UA42106C2 UA98126594A UA98126594A UA42106C2 UA 42106 C2 UA42106 C2 UA 42106C2 UA 98126594 A UA98126594 A UA 98126594A UA 98126594 A UA98126594 A UA 98126594A UA 42106 C2 UA42106 C2 UA 42106C2
Authority
UA
Ukraine
Prior art keywords
production
bearing element
application
task
semiconductor chip
Prior art date
Application number
UA98126594A
Other languages
English (en)
Russian (ru)
Inventor
Міхаель Хубер
Михаель Хубер
Петер Штампка
Детлеф Удо
Юрген Фішер
Юрген ФИШЕР
Йозеф Хайтцер
Хельмут Граф
Original Assignee
Сіменс Акцієнгезельшафт
Сименс Акциентгезельшафт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19623826A external-priority patent/DE19623826C2/de
Priority claimed from DE29621837U external-priority patent/DE29621837U1/de
Application filed by Сіменс Акцієнгезельшафт, Сименс Акциентгезельшафт filed Critical Сіменс Акцієнгезельшафт
Publication of UA42106C2 publication Critical patent/UA42106C2/uk

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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Abstract

Задачею винаходу є розробка простого способу виготовлення несучого елемента. Задача вирішена шляхом здійснення способу виготовлення несучого елемента згідно з п. 1 формули винаходу. Вигідні вдосконалення винаходу відображені в додаткових пунктах формули винаходу. Перевага винайденого способу полягає в тому, що виконуються ті самі або подібні технологічні операції, що й при виготовленні підкладки або відомих несучих елементів. Ними е операції висічки і нанесення шарів. Крім того, оскільки зміцнювальна пластинка має такі ж зовнішні розміри, що й несучий елемент, для її нанесення можуть бути використані те ж обладнання, що й для нанесення мідної фольги, з якої утворюють контактні площадки.
UA98126594A 1996-06-14 1997-06-10 Спосіб виготовлення несучого елемента для напівпровідникового чипа UA42106C2 (uk)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19623826A DE19623826C2 (de) 1996-06-14 1996-06-14 Verfahren zur Herstellung eines Trägerelements für Halbleiterchips
DE29621837U DE29621837U1 (de) 1996-12-16 1996-12-16 Trägerelement für Halbleiterchips
PCT/DE1997/001170 WO1997048133A1 (de) 1996-06-14 1997-06-10 Verfahren zur herstellung eines trägerelements für halbleiterchips

Publications (1)

Publication Number Publication Date
UA42106C2 true UA42106C2 (uk) 2001-10-15

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Application Number Title Priority Date Filing Date
UA98126594A UA42106C2 (uk) 1996-06-14 1997-06-10 Спосіб виготовлення несучого елемента для напівпровідникового чипа

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Country Link
EP (1) EP0904602B1 (uk)
JP (1) JP3498800B2 (uk)
CN (1) CN1156002C (uk)
AT (1) ATE212752T1 (uk)
BR (1) BR9709717A (uk)
DE (1) DE59706247D1 (uk)
ES (1) ES2171948T3 (uk)
IN (1) IN192422B (uk)
RU (1) RU2191446C2 (uk)
UA (1) UA42106C2 (uk)
WO (1) WO1997048133A1 (uk)

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ATE388488T1 (de) * 2003-03-07 2008-03-15 Nxp Bv Halbleiterbauelement, halbleiterkörper und verfahren zu seiner herstellung
CN102144291B (zh) * 2008-11-17 2015-11-25 先进封装技术私人有限公司 半导体基板、封装与装置
CN104392968B (zh) * 2008-11-21 2018-05-18 先进封装技术私人有限公司 半导体基板
FR2974969B1 (fr) * 2011-05-03 2014-03-14 Alstom Transport Sa Dispositif d'interconnexion electrique d'au moins un composant electronique avec une alimentation electrique comprenant des moyens de diminution d'une inductance de boucle entre des premiere et deuxieme bornes
US20140239428A1 (en) * 2013-02-28 2014-08-28 Infineon Technologies Ag Chip arrangement and a method for manufacturing a chip arrangement

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JPS61204788A (ja) * 1985-03-08 1986-09-10 Dainippon Printing Co Ltd 携持用電子装置
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente

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EP0904602B1 (de) 2002-01-30
ES2171948T3 (es) 2002-09-16
IN192422B (uk) 2004-04-24
WO1997048133A1 (de) 1997-12-18
CN1156002C (zh) 2004-06-30
BR9709717A (pt) 1999-08-10
CN1222253A (zh) 1999-07-07
EP0904602A1 (de) 1999-03-31
RU2191446C2 (ru) 2002-10-20
ATE212752T1 (de) 2002-02-15
DE59706247D1 (de) 2002-03-14
JP3498800B2 (ja) 2004-02-16
JP2000512045A (ja) 2000-09-12

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