RU2012139358A - Способ создания электропроводных скреплений между солнечными элементами - Google Patents
Способ создания электропроводных скреплений между солнечными элементами Download PDFInfo
- Publication number
- RU2012139358A RU2012139358A RU2012139358/28A RU2012139358A RU2012139358A RU 2012139358 A RU2012139358 A RU 2012139358A RU 2012139358/28 A RU2012139358/28 A RU 2012139358/28A RU 2012139358 A RU2012139358 A RU 2012139358A RU 2012139358 A RU2012139358 A RU 2012139358A
- Authority
- RU
- Russia
- Prior art keywords
- adhesive
- laser
- weight
- carrier
- electrically conductive
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract 21
- 239000000853 adhesive Substances 0.000 claims abstract 25
- 230000001070 adhesive effect Effects 0.000 claims abstract 25
- 239000002245 particle Substances 0.000 claims abstract 10
- 239000012790 adhesive layer Substances 0.000 claims abstract 6
- 239000000758 substrate Substances 0.000 claims abstract 6
- 238000000576 coating method Methods 0.000 claims abstract 4
- 239000007787 solid Substances 0.000 claims abstract 4
- 230000002745 absorbent Effects 0.000 claims abstract 3
- 239000002250 absorbent Substances 0.000 claims abstract 3
- 239000011230 binding agent Substances 0.000 claims abstract 2
- 238000005266 casting Methods 0.000 claims abstract 2
- 239000002270 dispersing agent Substances 0.000 claims abstract 2
- 238000001035 drying Methods 0.000 claims abstract 2
- 239000000835 fiber Substances 0.000 claims abstract 2
- 229920002457 flexible plastic Polymers 0.000 claims abstract 2
- 239000011521 glass Substances 0.000 claims abstract 2
- 230000001678 irradiating effect Effects 0.000 claims abstract 2
- 239000011159 matrix material Substances 0.000 claims abstract 2
- 238000007639 printing Methods 0.000 claims abstract 2
- 230000005855 radiation Effects 0.000 claims abstract 2
- 238000005096 rolling process Methods 0.000 claims abstract 2
- 239000002904 solvent Substances 0.000 claims abstract 2
- 238000005507 spraying Methods 0.000 claims abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 229910052799 carbon Inorganic materials 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000002105 nanoparticle Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- MUBKMWFYVHYZAI-UHFFFAOYSA-N [Al].[Cu].[Zn] Chemical compound [Al].[Cu].[Zn] MUBKMWFYVHYZAI-UHFFFAOYSA-N 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 claims 1
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 1
- 229910021389 graphene Inorganic materials 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910003437 indium oxide Inorganic materials 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052746 lanthanum Inorganic materials 0.000 claims 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims 1
- 239000004071 soot Substances 0.000 claims 1
- 239000012798 spherical particle Substances 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- 229910001887 tin oxide Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 229910001930 tungsten oxide Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Sustainable Energy (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Photovoltaic Devices (AREA)
Abstract
1. Способ создания электропроводных скреплений между солнечными элементами, содержащий следующие стадии:(a) переноса адгезива, содержащего электропроводные частицы, с носителя на субстрат посредством облучения носителя лазером,(b) частичной сушки и/или отверждения адгезива, перенесенного на субстрат, с формированием адгезивного слоя,(c) скрепления адгезива с электрическим соединением,(d) отверждения адгезивного слоя.2. Способ по п.1, в котором переносу в стадии а) предшествует нанесение адгезива на носитель.3. Способ по п.2, в котором адгезив наносят на носитель способом покрытия.4. Способ по п.3, в котором способ покрытия представляет собой процесс печати, литья, прокатки или распыления.5. Способ по п.1, в котором лазер генерирует лазерный луч, имеющий длину волны в интервале от 150 до 10600 нм.6. Способ по п.1, в котором лазер представляет собой твердотельный лазер, волоконный лазер, диодный лазер, газовый лазер или эксимерный лазер.7. Способ по п.1, в котором адгезив наносят на верхнюю и нижнюю стороны субстрата для сформирования адгезивного слоя.8. Способ по любому из пп.1-7, где носитель представляет собой жесткую или гибкую пластмассу или стекло, который прозрачен для используемого лазерного излучения.9. Адгезив для осуществления способа по любому из пп.1-8, содержащий от 20 до 98% по весу электропроводных частиц, от 0,01 до 60% по весу органического связующего компонента, используемого в качестве матричного материала, в каждом случае исходя из содержания твердой части адгезива, от 0,005 до 20% по весу абсорбента, исходя из веса проводящих частиц в адгезиве, и от 0 до 50% по весу диспергирующего агента и от 1 до 20% по весу растворителя, в каждо�
Claims (15)
1. Способ создания электропроводных скреплений между солнечными элементами, содержащий следующие стадии:
(a) переноса адгезива, содержащего электропроводные частицы, с носителя на субстрат посредством облучения носителя лазером,
(b) частичной сушки и/или отверждения адгезива, перенесенного на субстрат, с формированием адгезивного слоя,
(c) скрепления адгезива с электрическим соединением,
(d) отверждения адгезивного слоя.
2. Способ по п.1, в котором переносу в стадии а) предшествует нанесение адгезива на носитель.
3. Способ по п.2, в котором адгезив наносят на носитель способом покрытия.
4. Способ по п.3, в котором способ покрытия представляет собой процесс печати, литья, прокатки или распыления.
5. Способ по п.1, в котором лазер генерирует лазерный луч, имеющий длину волны в интервале от 150 до 10600 нм.
6. Способ по п.1, в котором лазер представляет собой твердотельный лазер, волоконный лазер, диодный лазер, газовый лазер или эксимерный лазер.
7. Способ по п.1, в котором адгезив наносят на верхнюю и нижнюю стороны субстрата для сформирования адгезивного слоя.
8. Способ по любому из пп.1-7, где носитель представляет собой жесткую или гибкую пластмассу или стекло, который прозрачен для используемого лазерного излучения.
9. Адгезив для осуществления способа по любому из пп.1-8, содержащий от 20 до 98% по весу электропроводных частиц, от 0,01 до 60% по весу органического связующего компонента, используемого в качестве матричного материала, в каждом случае исходя из содержания твердой части адгезива, от 0,005 до 20% по весу абсорбента, исходя из веса проводящих частиц в адгезиве, и от 0 до 50% по весу диспергирующего агента и от 1 до 20% по весу растворителя, в каждом случае исходя из всей массы не высушенного и не отвержденного адгезива.
10. Адгезив по п.9, в котором электропроводные частицы содержат, по меньшей мере, один металл и/или углерод.
11. Адгезив по п.10, в котором металл выбран из группы, состоящей из серебра, золота, алюминия, меди, цинка, олова, платины, палладия, никеля и титана.
12. Адгезив по п.9, в котором электропроводные частицы имеют различные геометрии частиц.
13. Адгезив по любому из пп.9-12, в котором абсорбент выбран из углерода, гексаборида лантана и/или наночастиц серебра, золота, платины, палладия, вольфрама, никеля, олова, железа, смешанного оксида индия и олова, оксида вольфрама, карбида титана или нитрида титана.
14. Адгезив по п.13, в котором наночастицы представляют собой сферические частицы или частицы в форме призм.
15. Адгезив по п.13, в котором углерод находится в форме сажи, графита, графена или нанотрубок углерода.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30516210P | 2010-02-17 | 2010-02-17 | |
US61/305,162 | 2010-02-17 | ||
PCT/IB2011/050641 WO2011101788A1 (en) | 2010-02-17 | 2011-02-16 | Process for producing electrically conductive bonds between solar cells |
Publications (2)
Publication Number | Publication Date |
---|---|
RU2012139358A true RU2012139358A (ru) | 2014-03-27 |
RU2553774C2 RU2553774C2 (ru) | 2015-06-20 |
Family
ID=44482492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2012139358/28A RU2553774C2 (ru) | 2010-02-17 | 2011-02-16 | Способ создания электропроводных скреплений между солнечными элементами |
Country Status (14)
Country | Link |
---|---|
US (1) | US8920591B2 (ru) |
EP (1) | EP2537188A4 (ru) |
JP (1) | JP5898097B2 (ru) |
KR (1) | KR20130008554A (ru) |
CN (1) | CN102770971B (ru) |
AU (1) | AU2011216964B2 (ru) |
CA (1) | CA2789913A1 (ru) |
IL (1) | IL221324A (ru) |
MX (1) | MX2012009464A (ru) |
MY (1) | MY162086A (ru) |
RU (1) | RU2553774C2 (ru) |
SG (1) | SG183160A1 (ru) |
TW (1) | TWI577037B (ru) |
WO (1) | WO2011101788A1 (ru) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2720281C1 (ru) * | 2017-04-12 | 2020-04-28 | Абб Швайц Аг | Графеновый композиционный материал для скользящего контакта |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9449734B2 (en) * | 2010-08-27 | 2016-09-20 | Lg Chem, Ltd. | Conductive metal ink composition, and method for preparing a conductive pattern |
TWI524825B (zh) | 2012-10-29 | 2016-03-01 | 財團法人工業技術研究院 | 碳材導電膜的轉印方法 |
EP2935429B1 (en) | 2012-12-20 | 2018-11-07 | Dow Silicones Corporation | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same |
CN103928077B (zh) | 2013-01-10 | 2017-06-06 | 杜邦公司 | 含有共混弹性体的导电粘合剂 |
WO2014159792A1 (en) | 2013-03-14 | 2014-10-02 | Dow Corning Corporation | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same |
WO2014150302A1 (en) | 2013-03-14 | 2014-09-25 | Dow Corning Corporation | Conductive silicone materials and uses |
JP6416188B2 (ja) | 2013-03-14 | 2018-10-31 | ダウ シリコーンズ コーポレーション | 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス |
CN105765008A (zh) * | 2013-11-13 | 2016-07-13 | R.R.当纳利父子公司 | 电池 |
CN105280736B (zh) * | 2014-07-23 | 2017-04-19 | 北京有色金属研究总院 | 一种具有双层界面带隙缓冲层的非晶硅锗薄膜太阳能电池 |
CN105280741B (zh) * | 2015-06-19 | 2018-08-03 | 天合光能股份有限公司 | 一种太阳能电池组件焊带 |
US20170073553A1 (en) * | 2015-09-15 | 2017-03-16 | Kuo-Hsin CHANG | Graphene glue, its composition and using method |
CN106409952B (zh) * | 2016-11-03 | 2017-12-29 | 张立水 | 一种太阳能电池焊料 |
CN109705666A (zh) * | 2017-10-25 | 2019-05-03 | Tcl集团股份有限公司 | 一种复合墨水及其制备方法、器件 |
CN109705663A (zh) * | 2017-10-25 | 2019-05-03 | Tcl集团股份有限公司 | 一种复合墨水及其制备方法、器件 |
CN109705662A (zh) * | 2017-10-25 | 2019-05-03 | Tcl集团股份有限公司 | 一种复合墨水及其制备方法、器件 |
CN109705659A (zh) * | 2017-10-25 | 2019-05-03 | Tcl集团股份有限公司 | 一种复合墨水及其制备方法、器件 |
US10947424B2 (en) * | 2018-08-02 | 2021-03-16 | Xerox Corporation | Adhesive composition comprising eutectic metal alloy nanoparticles |
US11142671B2 (en) * | 2018-08-02 | 2021-10-12 | Xerox Corporation | Adhesive composition comprising metal nanoparticles |
US10843262B2 (en) | 2018-08-02 | 2020-11-24 | Xerox Corporation | Compositions comprising eutectic metal alloy nanoparticles |
FR3087683B1 (fr) * | 2018-10-24 | 2022-11-18 | Letat Francais Represente Par Le Mini De Linterieur | Colle conductrice electrique et (re)generation de circuits (micro)electriques |
CN109652005A (zh) * | 2018-12-10 | 2019-04-19 | 贵州振华风光半导体有限公司 | 一种导电粘接剂 |
CN109911848B (zh) * | 2019-04-12 | 2019-12-20 | 湖南城市学院 | 一种精密操控和传递纳米线的装置及方法 |
JP7319630B2 (ja) * | 2019-09-20 | 2023-08-02 | 株式会社レゾナック | 接着剤組成物、接着剤組成物の製造方法、及び接着剤フィルム |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4606962A (en) * | 1983-06-13 | 1986-08-19 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
DE3702643A1 (de) | 1986-02-10 | 1987-08-13 | Toshiba Kawasaki Kk | Tintenstrahlschreiber sowie schreibkopf und schreibkopfkassette dafuer |
JPS62184860A (ja) * | 1986-02-10 | 1987-08-13 | Toshiba Corp | インクジエツト記録装置 |
DE4034834C2 (de) * | 1990-11-02 | 1995-03-23 | Heraeus Noblelight Gmbh | Verfahren zur Herstellung metallischer Schichten auf Substraten und Verwendung der Schichten |
US5685939A (en) * | 1995-03-10 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Process for making a Z-axis adhesive and establishing electrical interconnection therewith |
JPH11243224A (ja) * | 1997-12-26 | 1999-09-07 | Canon Inc | 光起電力素子モジュール及びその製造方法並びに非接触処理方法 |
TW417383B (en) * | 1998-07-01 | 2001-01-01 | Cmos Sensor Inc | Silicon butting contact image sensor chip with line transfer and pixel readout (LTPR) structure |
US6177151B1 (en) * | 1999-01-27 | 2001-01-23 | The United States Of America As Represented By The Secretary Of The Navy | Matrix assisted pulsed laser evaporation direct write |
WO2003040427A1 (en) * | 2001-10-16 | 2003-05-15 | Data Storage Institute | Thin film deposition by laser irradiation |
US6967123B2 (en) * | 2002-04-11 | 2005-11-22 | Agilent Technologies, Inc. | Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method |
JP4839622B2 (ja) * | 2005-01-31 | 2011-12-21 | 日立化成工業株式会社 | 接着フィルム及びこれを備える積層体 |
BRPI0712709A2 (pt) * | 2006-06-14 | 2012-05-22 | Basf Se | método para produzir superfìcies de área-inteira ou estruturada, eletricamente condutivas sobre um suporte. |
TWI305194B (en) * | 2006-07-31 | 2009-01-11 | Nat Univ Chung Cheng | A laser-transfer based fabrication method for creating carbon-nanotube patterns and its application to fabrication of carbon-nanotube field emitters |
KR101040002B1 (ko) * | 2006-08-29 | 2011-06-09 | 히다치 가세고교 가부시끼가이샤 | 도전성 접착 필름 및 태양 전지 모듈 |
JP2008135654A (ja) * | 2006-11-29 | 2008-06-12 | Sanyo Electric Co Ltd | 太陽電池モジュール |
WO2008080893A1 (de) * | 2007-01-05 | 2008-07-10 | Basf Se | Verfahren zur herstellung von elektrisch leitfähigen oberflächen |
BRPI0806629A2 (pt) * | 2007-01-19 | 2011-09-13 | Basf Se | método para a produção de superfìcies eletricamente condutivas estruturadas sobre um substrato |
WO2009112573A2 (de) | 2008-03-13 | 2009-09-17 | Basf Se | Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse |
US20090266399A1 (en) * | 2008-04-28 | 2009-10-29 | Basol Bulent M | Metallic foil substrate and packaging technique for thin film solar cells and modules |
TWI470041B (zh) | 2008-06-09 | 2015-01-21 | Basf Se | 用於施加金屬層之分散液 |
JP2009298915A (ja) * | 2008-06-12 | 2009-12-24 | Seiko Epson Corp | 接合方法および接合体 |
EP2304814A2 (de) | 2008-06-18 | 2011-04-06 | Basf Se | Verfahren zur herstellung von elektroden für solarzellen |
CA2733286A1 (en) | 2008-08-13 | 2010-02-18 | Basf Se | Multilayered elements, the production thereof and the use thereof |
US8789466B2 (en) | 2008-10-02 | 2014-07-29 | Basf Se | Method for printing substrates |
JP5764495B2 (ja) | 2008-12-17 | 2015-08-19 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 基体を印刷する印刷機及び印刷方法 |
PH12011501221A1 (en) | 2008-12-17 | 2010-06-24 | Basf Se | Method and printing press for printing a substrate |
ES2402033T3 (es) | 2008-12-17 | 2013-04-26 | Basf Se | Máquina de imprenta así como procedimiento para imprimir un sustrato |
SG176819A1 (en) | 2009-06-22 | 2012-01-30 | Basf Se | Method for producing a structured metal coating |
TWI553663B (zh) | 2009-09-04 | 2016-10-11 | 巴地斯顏料化工廠 | 用於印刷電極之組合物 |
ES2422175T3 (es) | 2009-09-04 | 2013-09-09 | Basf Se | Procedimiento para producir superficies eléctricamente conductoras |
KR101789838B1 (ko) | 2009-09-04 | 2017-10-25 | 바스프 에스이 | 전도체 트랙을 인쇄하기 위한 조성물 및 태양 전지를 제조하기 위한 방법 |
US8895651B2 (en) | 2010-02-16 | 2014-11-25 | Basf Se | Composition for printing a seed layer and process for producing conductor tracks |
-
2011
- 2011-02-16 AU AU2011216964A patent/AU2011216964B2/en not_active Ceased
- 2011-02-16 CA CA2789913A patent/CA2789913A1/en not_active Abandoned
- 2011-02-16 CN CN201180009931.2A patent/CN102770971B/zh not_active Expired - Fee Related
- 2011-02-16 EP EP11744339.0A patent/EP2537188A4/en not_active Withdrawn
- 2011-02-16 US US13/579,718 patent/US8920591B2/en not_active Expired - Fee Related
- 2011-02-16 MX MX2012009464A patent/MX2012009464A/es active IP Right Grant
- 2011-02-16 JP JP2012553429A patent/JP5898097B2/ja not_active Expired - Fee Related
- 2011-02-16 KR KR1020127024128A patent/KR20130008554A/ko not_active Application Discontinuation
- 2011-02-16 MY MYPI2012003664A patent/MY162086A/en unknown
- 2011-02-16 WO PCT/IB2011/050641 patent/WO2011101788A1/en active Application Filing
- 2011-02-16 RU RU2012139358/28A patent/RU2553774C2/ru not_active IP Right Cessation
- 2011-02-16 SG SG2012057659A patent/SG183160A1/en unknown
- 2011-02-17 TW TW100105281A patent/TWI577037B/zh not_active IP Right Cessation
-
2012
- 2012-08-06 IL IL221324A patent/IL221324A/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2720281C1 (ru) * | 2017-04-12 | 2020-04-28 | Абб Швайц Аг | Графеновый композиционный материал для скользящего контакта |
US11183344B2 (en) | 2017-04-12 | 2021-11-23 | Hitachi Energy Switzerland Ag | Graphene composite material for sliding contact |
Also Published As
Publication number | Publication date |
---|---|
AU2011216964A1 (en) | 2012-09-06 |
JP2013519782A (ja) | 2013-05-30 |
CN102770971A (zh) | 2012-11-07 |
TW201214738A (en) | 2012-04-01 |
RU2553774C2 (ru) | 2015-06-20 |
KR20130008554A (ko) | 2013-01-22 |
US8920591B2 (en) | 2014-12-30 |
IL221324A0 (en) | 2012-10-31 |
MY162086A (en) | 2017-05-31 |
MX2012009464A (es) | 2012-09-12 |
SG183160A1 (en) | 2012-09-27 |
CA2789913A1 (en) | 2011-08-25 |
EP2537188A4 (en) | 2016-04-13 |
JP5898097B2 (ja) | 2016-04-06 |
IL221324A (en) | 2016-10-31 |
AU2011216964B2 (en) | 2015-07-09 |
CN102770971B (zh) | 2016-03-30 |
TWI577037B (zh) | 2017-04-01 |
US20120312467A1 (en) | 2012-12-13 |
WO2011101788A1 (en) | 2011-08-25 |
EP2537188A1 (en) | 2012-12-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2012139358A (ru) | Способ создания электропроводных скреплений между солнечными элементами | |
Joo et al. | A highly reliable copper nanowire/nanoparticle ink pattern with high conductivity on flexible substrate prepared via a flash light-sintering technique | |
Yang et al. | Reduced graphene oxide conformally wrapped silver nanowire networks for flexible transparent heating and electromagnetic interference shielding | |
Morris | Nanopackaging: Nanotechnologies and electronics packaging | |
US8323744B2 (en) | Systems, methods, devices and arrangements for nanowire meshes | |
Hwang et al. | Intensive plasmonic flash light sintering of copper nanoinks using a band-pass light filter for highly electrically conductive electrodes in printed electronics | |
Miller et al. | Silver nanowire/optical adhesive coatings as transparent electrodes for flexible electronics | |
JP6258303B2 (ja) | 光照射による加熱焼成用の樹脂基材フィルム、基板及び加熱焼成方法 | |
CA2728055A1 (en) | Process for producing electrodes for solar cells | |
JP2011524646A5 (ru) | ||
Yim et al. | Hybrid copper–silver conductive tracks for enhanced oxidation resistance under flash light sintering | |
TWI534838B (zh) | 銅微粒子分散液 | |
JP6766160B2 (ja) | 金属接合用組成物 | |
CN104822773A (zh) | 导电材料及连接结构体 | |
CN105390934B (zh) | 基于等离激元增强的光增强/调制电子发射的装置 | |
JP2010179642A (ja) | 透明導電性基板、色素増感型太陽電池用透明導電性基板及び透明導電性基板の製造方法 | |
US20120286218A1 (en) | Low cost alternatives to conductive silver-based inks | |
KR101635848B1 (ko) | 탄소 비결합성 금속 나노입자가 함유된 잉크 기제 제조 방법 및 금속 나노입자가 분산된 잉크 | |
Singh et al. | Light induced morphological reforms in thin film of advanced nano-materials for energy generation: A review | |
Yan et al. | Electrically sintered silver nanowire networks for use as transparent electrodes and heaters | |
Ko et al. | Flashlight-Induced Strong Self-Adhesive Surface on a Nanowire-Impregnated Transparent Conductive Film | |
CN104134719A (zh) | 太阳能电池模块的制造方法 | |
TW201803959A (zh) | 高附著性導電銅膠體及其網版印刷應用方法 | |
JP7204890B2 (ja) | 電極の製造方法および光電変換素子の製造方法 | |
Zhang et al. | Progress in polyacrylate‐based electrically conductive adhesives: Featured properties, preparation, applications, and perspectives |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | The patent is invalid due to non-payment of fees |
Effective date: 20180217 |