TWI553663B - 用於印刷電極之組合物 - Google Patents
用於印刷電極之組合物 Download PDFInfo
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- TWI553663B TWI553663B TW099129532A TW99129532A TWI553663B TW I553663 B TWI553663 B TW I553663B TW 099129532 A TW099129532 A TW 099129532A TW 99129532 A TW99129532 A TW 99129532A TW I553663 B TWI553663 B TW I553663B
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- Prior art keywords
- composition
- weight
- oxide
- organometallic compound
- metal
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 86
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- 150000002902 organometallic compounds Chemical class 0.000 claims description 14
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 13
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
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- 150000004706 metal oxides Chemical class 0.000 description 1
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- 239000002736 nonionic surfactant Substances 0.000 description 1
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- 235000018102 proteins Nutrition 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- BPEVHDGLPIIAGH-UHFFFAOYSA-N ruthenium(3+) Chemical compound [Ru+3] BPEVHDGLPIIAGH-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
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Classifications
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- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
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- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
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- Y02E10/50—Photovoltaic [PV] energy
Description
本發明係關於一種用於在基板上印刷電極之組合物,該組合物包含導電顆粒、玻璃粉及溶劑。
特別使用包含分散於溶劑中之導電顆粒及玻璃粉之組合物以於半導體基板上印刷電極。將以此方式印刷之半導體基板用作,例如,太陽能電池。
為製造電極,藉由慣用印刷方法將組合物塗覆於基板。適宜的印刷方法為,例如,噴墨印刷或雷射印刷。
組合物中存在之導電顆粒一般係銀顆粒。此等導電顆粒可呈小板形或球形。亦已知呈小板形與球形之銀顆粒之混合物。為確定印刷所需之黏度,該組合物包含溶劑。一般使用有機溶劑。然而,缺點在於於印刷後之進一步處理期間溶劑從組合物中逸出,及因此進入環境中。
為使組合物不流動,一般亦存在聚合物材料,組合物與該聚合物材料先結合至半導體材料。印刷後,一般燃燒該組合物。於燃燒期間,聚合物材料分解並自導體軌道移除。組合物中存在的玻璃粉熔化且使包含導電顆粒之壓印導體軌道結合至該基板。
例如,WO 2007/089273中描述可用於製造太陽能電池之光接收表面電極之糊狀組合物。該糊狀物包含具有0.2至0.6 m2/g之比表面積之銀顆粒、玻璃粉、樹脂黏結劑及稀釋劑。所使用之稀釋劑係有機溶劑。
EP-A 1 775 759中描述包含具有兩不同平均直徑之銀粉之組合物。除銀粉外,該組合物亦包含玻璃粉及有機載劑。銀於電極材料中之比例為75至95重量%。
WO 2006/132766中描述用於太陽能電池之電極之糊狀物,其包含85至99重量%之導電金屬組分及1至15重量%之玻璃組分,亦及有機組分。
然而,此已知組合物之缺點係其中所存在之有機物質會於塗覆該組合物後之乾燥期間及燃燒期間釋放。
因此,本發明之一目的係提供一種用於印刷電極之組合物,其中於乾燥及燃燒期間較少有機材料釋放至環境。
此目的係藉由用於在基板上印刷電極之組合物實現,該組合物包含在每一情況下以組合物總質量計之30至90重量%之導電顆粒,0至7重量%之玻璃粉,0.1至5重量%之用於雷射輻射之至少一吸收劑,0至8重量%之至少一基質材料,0至8重量%之至少一有機金屬化合物,3至50重量%之作為溶劑之水,0至65重量%之至少一助留劑及0至5重量%之至少一添加劑。
本發明組合物尤其適宜藉由雷射印刷方法印刷電極。
將水用作溶劑可降低於乾燥及燃燒用於製造電極之組合物期間釋放至環境之有機物質之比例。此可減少製造太陽能電池時之環境污染。
存在於組合物中之導電顆粒可為由任一導電材料組成之任何幾何形狀之顆粒。存在於組合物中之導電顆粒較佳包含銀、金、鋁、鉑、鈀、錫、鎳、鎘、鎵、銦、銅、鋅、鐵、鉍、鈷、錳、鉻、釩、鈦或其等混合物或合金。
所使用顆粒之平均粒度較佳係於3 nm至100 μm之範圍內。該平均粒度更佳係於100 nm至50 μm之範圍內及特定言之500 nm至10 μm之範圍內。所使用顆粒可具有為熟習本技藝者所已知之任何所需形式。例如,顆粒可呈小板形或球形。球形顆粒亦理解為意指實際形狀與理想球形有所不同的彼等顆粒。例如,球形顆粒由於製造原因亦可具有液滴形狀或經截切。可用於製造組合物之適宜顆粒係為熟習本技藝者已知且可自市面購置。特佳地,使用球形銀顆粒。球形顆粒之優點係其等相較於小板形顆粒之改良之流變行為。例如,包含球形顆粒之組合物具有較包含小板形顆粒之組合物更低的黏度。此外,包含球形顆粒之組合物於剪切時具有顯著降低之黏度。此亦可獲得至多約90%之高填充率,於此情況中組合物仍可印刷。
若使用兩或更多種不同類型的導電顆粒,則可藉由混合各類型顆粒來實施。不同類型之顆粒可於材料、形狀及/或大小上不同。
導電顆粒於組合物中之比例係於50至90重量%之範圍內。該比例較佳係於70至87重量%及尤其係於75至85重量%之範圍內。
為獲得可印刷分散液,該組合物包含溶劑。根據本發明,所使用之溶劑係水,其係以3至20重量%之比例存在於組合物中。水於組合物中之比例較佳係於5至15重量%及尤其係6至12重量%之範圍內。
由於水一般會相對快速地蒸發,故需添加助留劑(稱為阻滯劑),以減緩蒸發。助留劑係以0至65重量%,較佳0.5至10重量%及尤其係0.8至4重量%之比例存在於組合物中。
適宜的助留劑為極性水黏結溶劑。適宜的極性水黏結溶劑為,例如,甘油;二醇,例如,乙二醇、丙二醇;聚二醇,諸如二乙二醇、聚乙二醇(例如,PEG200)、聚丙二醇;烷醇胺,例如甲基二乙醇胺、乙基二乙醇胺;N-甲基吡咯啶酮、聚伸乙基亞胺、聚乙烯胺、聚乙烯甲醯胺或其等混合物。特佳助留劑為甘油及聚乙二醇。此等物質具有高表面張力,其減少組合物於待印刷基板之表面上之流動。因此,可印刷更清晰的結構。
為使組合物於晶圓之實際燃燒之前不流動,而反之黏附於晶圓上,另存在基質材料。
所使用之基質材料較佳為水可溶或水可分散聚合物或聚合物混合物。
以於水中形成低黏度溶液之水可溶或水可分散聚合物或聚合物混合物為較佳。此可使低黏度導電顆粒獲得高填充率。此外,例如製造所使用之太陽能晶圓之表面之太陽能電池時,所使用之聚合物應對待印刷之基板表面具有良好黏附性。該等聚合物亦應獲得印刷導體軌道之足夠完整性。
可用作基質材料之適宜聚合物為,例如,丙烯酸酯分散液及丙烯酸酯共聚物,例如,苯乙烯丙烯酸酯、鹼性可溶的丙烯酸酯樹脂及其等共聚物、馬來酸酐共聚物,例如苯乙烯馬來酸分散液,醇酸樹脂分散液、苯乙烯-丁二烯分散液、纖維素衍生物,特定言之,羥烷基纖維素、羧烷基纖維素,聚酯分散液、聚乙烯醇,特定言之部份或完全水解之聚乙烯醇、水解之乙酸乙烯酯共聚物,例如接枝聚乙二醇-乙酸乙烯酯共聚物、聚乙烯基吡咯啶酮及乙烯基吡咯啶酮共聚物、聚乙烯亞胺、聚乙烯基胺、聚乙烯基甲醯胺、超支化聚碳酸酯、聚二醇、聚胺基甲酸酯分散液、蛋白質,例如酪蛋白。兩或更多種聚合物亦可形成該基質材料。
為於太陽能電池之製造中獲得組合物對用作基板之半導體材料之良好黏附性,玻璃粉係以0至7重量%之比例存在於組合物中。玻璃粉之比例較佳係於1.5至4重量%及特定言之2至3.5重量%之範圍內。
較佳使用實質上無鉛之玻璃粉。此等玻璃粉為,例如,基於氧化鉍之玻璃。適用於組合物之玻璃粉包含,特定言之,氧化鉍、氧化矽及/或氧化碲。氧化碲之比例較佳係於0.01至10重量%之範圍內。氧化鉍之比例較佳係於40至95重量%之範圍內。氧化鉍之比例更佳係於50至80重量%之範圍內及特定言之60至75重量%之範圍內。氧化矽之比例於各情況中較佳係以玻璃粉質量計之0至30重量%之範圍內,特定言之1至4重量%之範圍內。
除氧化鉍、氧化矽及氧化碲外,玻璃粉可另包含氧化硼。氧化硼之比例較佳係於0.1至10重量%之範圍內,尤其0.5至8重量%之範圍內及於最佳實施例中係於1至4重量%之範圍內。
除所描述之氧化物外,玻璃粉可包含氧化鋅及/或氧化鋁。氧化鋅之比例係於0至15重量%之範圍內及氧化鋁之比例係於0至3重量%之範圍內。
可存在於玻璃粉中之其他金屬氧化物為,例如,氧化銀(Ag2O)、氧化銻(Sb2O3)、氧化鍺(GeO2)、氧化銦(In2O3)、五氧化二磷(P2O5)、五氧化二釩(V2O5)、五氧化二鈮(Nb2O5)及五氧化二鉭(Ta2O5)。可存在於玻璃粉中之Ag2O、P2O5、V2O5、Nb2O5、及/或Ta2O5之比例在每一情況中係於約0至8重量%之範圍內。In2O3及/或Sb2O3於玻璃粉中之比例較佳在每一情況中係於0至5重量%之範圍內。此外,玻璃粉可包含一或多種鹼金屬氧化物,一般而言,Na2O、Li2O及/或K2O。鹼金屬氧化物於玻璃粉中之比例在每一情況中係於0至3重量%之範圍內。此外,玻璃粉中亦可存在鹼土金屬氧化物。常存在之鹼土金屬氧化物為BaO、CaO、MgO及/或SrO。鹼土金屬氧化物於玻璃粉中之比例在每一情況中係於0至8重量%之範圍內。
就本發明而言實質上無鉛意指未將鉛添加至玻璃粉中且鉛於玻璃粉中之比例係小於1000 ppm。
本發明組合物進一步包含至少一有機金屬化合物。有機金屬化合物於組合物中之比例係於0至5重量%之範圍內,較佳1至3重量%之範圍內及特定言之1.5至2.5重量%之範圍內。
於基板與其上印刷的組合物燃燒期間,有機金屬化合物之有機成份分解及自組合物移除。所存在之金屬保留於組合物中且可另用作導電材料。
可使用之適宜有機金屬化合物為金屬羧酸鹽、金屬丙酸鹽、金屬烷氧化物、金屬錯合物或其等混合物。有機金屬化合物亦可包含芳族或脂族基團。
適宜羧酸鹽為,例如,甲酸鹽、乙酸鹽或丙酸鹽。適宜烷氧化物為,例如,甲氧化物、乙氧化物、丙氧化物、丁氧化物、五氧化物、六氧化物、七氧化物、八氧化物、九氧化物、十氧化物、十一氧化物及十二氧化物。
有機金屬化合物之金屬較佳係選自由鋁、鉍、鋅及釩組成之群。
此外,有機金屬化合物可包含硼或矽。
可使用之適宜有機金屬化合物為,例如,乙酸鉍(III)、三苯基鉍、六氟戊二酸鉍(III)、四甲基庚二酸鉍(III)、新癸酸鉍、2-乙基己酸鉍(III)、碳酸鉍氧化物、碱式棓酸鉍水合物、棓酸鉍(III)鹼性水合物、鹼式水楊酸鉍(III)、三(2,2,6,6-四甲基-3,5-庚二酸)鉍(III)、三苯基碳酸鉍(III)、三(2-甲氧基苯基)鉍。
特佳有機金屬化合物為乙酸鉍(III)、2-乙基己酸鉍(III)、碳酸鉍氧化物、碱式棓酸鉍水合物、棓酸鉍(III)鹼性水合物、鹼式水楊酸鉍(III)。
此外,該組合物亦可包含其他添加劑。可存在於組合物中之添加劑為,例如,分散劑、觸變劑、增塑劑、潤濕劑、消泡劑、乾燥劑、交聯劑、錯合劑、導電聚合物顆粒及/或用於雷射輻射之吸收劑。添加劑可獨立或以兩或更多種添加劑之混合物使用。
添加劑於組合物中之比例一般係於0至5重量%之範圍內,較佳0.1至3重量%之範圍內及特定言之0.1至2重量%之範圍內。
當分散劑用作添加劑時,可僅使用一種分散劑或多於一種分散劑。
原理上,為熟習該技藝者已知之用於分散液及先前技藝中有所描述的所有分散劑均適宜。適宜分散劑為表面活性劑或表面活性劑混合物,例如,陰離子、陽離子、兩性或非離子性表面活性劑。適宜陽離子及陰離子表面活性劑係描述於,例如,「Encyclopedia of Polymer Science and Technology」,J. Wiley & Sons(1966),5卷,816至818頁及「Emulsion Polymerisation and Emulsion Polymers」,編輯者:P. Lovell及M. EI-Asser,出版者:Wiley & Sons(1997),224至226頁中。然而,亦可將為熟習本技藝者已知之具有親顏料錨定基團之聚合物用作分散劑。
當以添加劑添加觸變劑時,可,例如,使用有機觸變劑。可使用之增稠劑為,例如,聚丙烯酸、聚胺基甲酸酯或氫化蓖麻油。
可使用之增塑劑、潤濕劑、消泡劑、乾燥劑、交聯劑、錯合劑及導電聚合物顆粒為常用於分散液中及為熟習本技藝者已知之彼等物。
若藉由雷射印刷方法將組合物印刷於基板上,則較佳於將用以印刷之例如雷射之能源之能量之吸收劑以另一添加劑添加至組合物時。取決於所使用之雷射束源,需使用不同吸收劑或有效吸收雷射輻射之吸收劑混合物。
適用於雷射輻射之吸收劑於雷射波長範圍內具有高吸收。特別適宜者係於近紅外內及於電磁波譜之較長波VIS區域中具有高吸收之吸收劑。此等吸收劑特別適於吸收來自高功率固態雷射,例如Nd:YAG雷射,及來自IR二極體雷射之輻射。適用於雷射輻射之吸收劑為,例如,於紅外光譜區域中高度吸收之染料,如酞菁、萘酞菁、花青素、醌、諸如烯二硫醇之金屬錯合物染料或光致變色染料。
其他適宜吸收劑為無機顏料,特定言之,色彩濃重之無機顏料,如鉻氧化物、鐵氧化物或氧化鐵水合物。
同樣適宜作為吸收劑者為呈,例如,碳黑、石墨、碳奈米管或石墨烯形式之碳。
當所使用之吸收劑係碳黑時,碳黑於組合物中之比例係於0至5重量%之範圍內。該比例較佳係於0.01至3重量%之範圍內及特定言之0.5至2重量%之範圍內。所使用之碳黑可為熟習本技藝者已知之任何所需碳黑。此等碳黑係為熟習該技術者已知且可自市面購置。
除上述吸收劑外,亦可將銀、金、鉑、鈀、鎢、鎳、錫、鐵、氧化銦錫、氧化鎢、碳化鈦或氮化鈦之奈米顆粒用作雷射輻射之吸收劑。以此方式,可分散有,例如,呈碳黑、碳奈米管、石墨烯或石墨形式之元素碳作為雷射輻射之吸收劑,或較已知組合物顯著地減少所需之量。
使用銀、金、鉑、鈀、鎢、鎳、錫、鐵、氧化銦錫或碳化鈦之另一優點係此等材料可導電。就此原因而言,使用奈米顆粒可很低程度上降低所印刷導體軌道之導電性或較佳根本不影響。此外,此等材料於燃燒期間未氧化;更具體而言,其等不會產生可導致導體軌道之多孔性及進而降低導電性之任何氣態化合物。作為吸收劑之碳化鈦可燃燒,但所釋放之碳量遠低於將元素碳用作吸收劑時所釋放之量。
於一實施例中,奈米顆粒係球形顆粒。就本發明而言球形顆粒意指基本上呈球形之顆粒,然而實際顆粒亦可有別於理想球形。例如,實際顆粒亦可,例如,經截切或為滴形。亦可存在因製造產生之與理想球形之其他區別。
當奈米顆粒為球形顆粒時,其等較佳具有介於2至100 nm之間的直徑。特定言之,於使用紅外雷射,尤其具有波長1050 nm之雷射之情況中,已發現粒度介於2至50 nm之間的球形奈米顆粒特別適宜。球形顆粒之直徑更佳為約6 nm。
當使用呈球形顆粒形式之奈米顆粒時,奈米顆粒於組合物中之比例尤其係於0.5至12重量%之間。
於另一實施例中,奈米顆粒係邊長為15至1000 nm及高度為3至100 nm之棱柱。棱柱之形式可變化。例如,此形式尤其係視所使用之雷射輻射而定。棱柱之底面可,例如,呈任何多邊形形式,例如,三角形或五邊形。用作奈米顆粒之棱柱一般係吸收行為與所用雷射之波長相匹配之Plasmon諧振器。例如藉由棱柱之邊長及橫截面積實現對所用雷射之波長之匹配。例如,不同橫截面積及不同邊長各具有不同吸收行為。棱柱之高度亦對吸收行為產生影響。
當使用棱柱作為奈米顆粒時,以棱柱存在之奈米顆粒於組合物中之比例較佳係於3至10重量%之範圍內。
除使用球形顆粒或棱柱作為雷射輻射之吸收劑外,另亦可同時使用球形顆粒及棱柱。球形顆粒對棱柱之比可為任何所需值。呈棱柱形式之奈米顆粒之比例越大,奈米顆粒於組合物中之比例就越低。
一般而言,於製造期間藉由適宜添加劑來穩定化奈米顆粒,以尤其用於運輸。於用於印刷導體軌道之組合物之製造期間,一般不移除添加劑,以使其等隨後亦存在於組合物中。用於穩定化之添加劑之比例一般不超過奈米顆粒質量之15重量%。用於穩定化奈米顆粒之添加劑可為,例如,長鏈胺,例如十二烷胺。適用於穩定化奈米顆粒之其他添加劑為,例如,辛胺、癸胺、油酸及聚乙烯亞胺。
雷射輻射之極適宜吸收劑為無機顏料、銀、金、鉑、鈀、鎢、鎳、錫、鐵、氧化銦錫、氧化鎢、碳化鈦或氮化鈦(尤其係銀)之奈米顆粒、細碳類或細六硼化鑭(LaB6)。
所添加之吸收劑量係由熟習本技藝者根據分散層之所需特性進行選擇。於此情況中,熟習本技藝者將額外地考慮到所添加的吸收劑不僅影響組合物之藉由雷射進行轉移的速度及效率,亦影響諸如組合物對待印刷之基板之黏附性或所印刷之導體軌道之導電性之其他特性。
本發明組合物係,例如,藉由在熟習本技藝者已知之單元中劇烈混合及分散而進行製備。此包括,例如,於溶解槽或以相當強度進行分散之單元中混合組分,於攪拌球磨機或於大量製造之情況中之粉末流化床中分散。
可藉由熟習本技藝者已知之任何方法將本發明組合物塗覆於基板上。例如,可藉由印刷方法,例如,篩網印刷、移動印刷、噴墨印刷、平板印刷或雷射印刷進行塗覆。於印刷期間所塗覆之層體厚度較佳係介於0.01至100 μm,更佳0.1至50 μm及特佳5至30 μm之間。塗覆有本發明組合物之層體可遍及整個表面或結構化。
於一特佳實施例中,藉由印刷方法將本發明組合物塗覆至基板,該印刷方法利用釋放呈電磁波形式之能量之能量釋放裝置,該組合物體積及/或位置發生變化並因此將該組合物轉移至基板。此等方法係自,例如,WO-A 03/074278獲識。
Claims (12)
- 一種用於將電極印刷於基板上之組合物,其包含在每一情況下以組合物總質量計70至90重量%之具有介於3nm至100μm間之平均粒度之導電顆粒,0至7重量%之玻璃粉,0.1至5重量%之用於雷射輻射之至少一吸收劑,0至8重量%之至少一基質材料,0至8重量%之至少一有機金屬化合物,3至50重量%之作為溶劑之水,0至65重量%之至少一助留劑及0至5重量%之至少一添加劑,其中該助留劑係減緩水蒸發的阻滯劑,且所用之該添加劑為分散劑、觸變劑、增塑劑、潤濕劑、消泡劑、乾燥劑、交聯劑、錯合劑及/或導電聚合物顆粒;及其中所使用之用於雷射輻射之該等吸收劑係無機顏料、銀、金、鉑、鈀、鎢、鎳、錫、鐵、氧化銦錫、氧化鎢、碳化鈦或氮化鈦之奈米顆粒、細碳類或細六硼化鑭。
- 如請求項1之組合物,其中該等導電顆粒包含銀、金、鋁、鉑、鈀、錫、鎳、鎘、鎵、銦、銅、鋅、鐵、鉍、鈷、錳、鉻、釩、鈦或其等混合物或合金。
- 如請求項1之組合物,其中該等導電顆粒實質上係球狀。
- 如請求項1之組合物,其中所使用之該玻璃粉係基於氧化鉍之無鉛玻璃。
- 如請求項4之組合物,其中該玻璃粉包含0.01至10重量%之氧化碲。
- 如請求項1之組合物,其中該基質材料係水可溶或水可 分散聚合物。
- 如請求項1之組合物,其中該助留劑係選自由甘油、二醇、聚二醇、烷醇胺、N-甲基吡咯啶酮、聚乙烯亞胺、聚乙烯基胺、聚乙烯基甲醯胺或其等混合物組成之群。
- 如請求項1之組合物,其中該有機金屬化合物係金屬羧酸鹽、金屬丙酸鹽、金屬烷氧化物、金屬錯合物或其等混合物。
- 如請求項1之組合物,其中該有機金屬化合物之金屬係選自由鋁、鉍、鋅及釩組成之群。
- 如請求項1之組合物,其中該有機金屬化合物另包含硼或矽。
- 如請求項1之組合物,其中該細碳包含碳黑、石墨、碳奈米管及/或石墨烯。
- 如請求項1之組合物,其係用於製造太陽能電池之電極。
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TW201120913A (en) | 2011-06-16 |
MY158807A (en) | 2016-11-15 |
KR101874125B1 (ko) | 2018-07-03 |
EP2474004B1 (de) | 2015-02-25 |
KR20120045067A (ko) | 2012-05-08 |
CN102576575B (zh) | 2015-11-25 |
ES2536696T3 (es) | 2015-05-27 |
US9396833B2 (en) | 2016-07-19 |
US20120161081A1 (en) | 2012-06-28 |
SG178931A1 (en) | 2012-04-27 |
JP5984671B2 (ja) | 2016-09-06 |
CN102576575A (zh) | 2012-07-11 |
EP2474004A1 (de) | 2012-07-11 |
JP2013504152A (ja) | 2013-02-04 |
WO2011026852A1 (de) | 2011-03-10 |
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