TWI577037B - 製造太陽能電池間之導電接合的方法 - Google Patents
製造太陽能電池間之導電接合的方法 Download PDFInfo
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- TWI577037B TWI577037B TW100105281A TW100105281A TWI577037B TW I577037 B TWI577037 B TW I577037B TW 100105281 A TW100105281 A TW 100105281A TW 100105281 A TW100105281 A TW 100105281A TW I577037 B TWI577037 B TW I577037B
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- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H—ELECTRICITY
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- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Description
本發明係關於一種製造太陽能電池間之導電接合的方法及一種實施該方法之黏著劑。
根據本發明之方法係適用於在太陽能電池上製造接觸或使太陽能電池彼此接合。
於光伏打模組之構造中,單獨太陽能電池目前幾乎僅藉由焊接方法彼此接合。此係描述於(例如)EP-A 2 058 868中。然而,此處所揭示方法之缺點在於液體金屬合金需精確定位及量測。於使用此等合金的情況中,亦需大量能量以液化金屬。大部份合金亦包含鉛以獲得就加工而言足夠低的熔點。於冷卻期間,亦會因焊接接觸的收縮而形成破裂。
另一可能性係使用導電黏著膜,其同樣描述於EP-A 2 058 868中。然而,此處,與太陽能電池的連接及接合常不可靠。此外,此等膜通常成本高且不便製造及難以定位。
本發明之一目的係提供一種在太陽能電池上製造電接觸之方法,其中該導電接觸可無需使用液體金屬焊料而製得,及其中可準確定位接觸位點。
此目的係藉由製造太陽能電池間之導電接合的方法實現,該方法包含以下步驟:
(a) 利用雷射輻射將包含導電顆粒之黏著劑自載體轉移至基板之導電層,
(b) 部份乾燥及/或硬化轉移至該基板之該黏著劑以形成一黏著層,
(c) 將該黏著劑接合至一電連接,
(d) 完全硬化轉移基板之該黏著劑。
施用黏著劑之適宜基板之實例係適於製造太陽能電池之所有剛性或可撓基板。用於製造太陽能電池之適宜基板係(例如)單晶矽、多晶矽或無定形矽、諸如GaAs、GaSb、GaInP、GaInP/GaAs、GaAs/Ge之III-V半導體、諸如CdTe之II-VI半導體,或I-III-VI半導體,例如,CuInS2、CuGaSe2或如通式ABC2之半導體,其中A係Cu、Ag或Au,B係Al、Ga或In,及C係S、Se或Te。
亦適宜者係塗覆有上述半導體之所有剛性及可撓基板,例如,玻璃及聚合物膜。
可用於實施該方法之適宜黏著劑包含20至98重量%導電顆粒、0.01至60重量%用作基質材料之有機黏合劑組分,於各情況中均係基於黏著劑之固體含量;基於黏著劑中導電顆粒重量之0.005至20重量%吸收劑;及0至50重量%分散劑及1至30重量%溶劑,於各情況中均係基於未乾燥及未硬化黏著劑之總質量。
一般而言,將用於電連接之接觸安裝於由半導體材料組成之基板上。該等接觸可(例如)呈匯流條之形式。一般而言,將由導電材料,特定言之,銀、銅、鎳、鋁及其等合金,以及核殼顆粒組成之導體履帶用於該等接觸。
為電連接太陽能電池,將黏著劑施用於安裝在半導體材料上之接觸。
於第一步驟中,將包含導電顆粒之黏著劑自載體轉移至基板。利用雷射輻射載體上之黏著劑來實施此轉移。
於一實施例中,較佳將其中存在有導電顆粒之黏著劑施用於載體的整個面積,然後轉移至基板。或者,理所當然地,亦可以結構化方式將黏著劑施用於載體。然而,較佳地,施用於整個面積。
於另一實施例中,使用已塗覆有黏著劑之載體。為此,例如,可使用呈塗覆有黏著劑之膜形式的載體,其纏繞在一膜供應器上。轉移黏著劑後,收集該膜並(例如)處理或再利用。
適宜載體係特定雷射輻射可穿透之所有材料,例如,塑膠或玻璃。例如,於使用IR雷射之情況中,可使用聚烯烴膜、PET膜、聚醯亞胺膜、聚醯胺膜、PEN膜、聚苯乙烯膜或玻璃。較佳者係聚醯亞胺膜。
載體可為剛性或可撓。此外,載體可係呈管狀或連續膜、或套管的形式、或呈平坦載體之形式。
用於產生雷射束之適宜雷射束源可自市面購置。原則上,可採用所有雷射束源。此等雷射束源為(例如)脉衝或連續氣體、纖維、固態、二極體或準分子雷射。若雷射輻射可穿透特定載體,則可使用此等中之任一者,且包含導電顆粒且已施用於載體之黏著劑可充分吸收雷射輻射以因將光能轉化為熱能而於黏著層中產生空泡。
雷射器產生之雷射束之波長較佳係於150至10 600 nm之範圍內,特定言之,於600至10 600 nm之範圍內。
較佳使用脉衝或連續(cw)IR雷射器作為雷射源,例如,Nd:YAG雷射器、Yb:YAG雷射器、纖維雷射器或二極體雷射器。此等雷射器廉價且可獲得高能量。特佳者係連續(cw)IR雷射器。根據包含導電顆粒之黏著劑之吸收行為,然而,亦可使用具有可見波長或UV頻率範圍內之波長之雷射器。針對此目的之適宜實例係Ar雷射器、HeNe雷射器、倍頻IR固態雷射器或準分子雷射器,如ArF雷射器、KrF雷射器、XeCl雷射器或XeF雷射器。根據所使用之雷射束源、雷射功率及透鏡系統及調變器,雷射束之聚焦直徑係於1 μm至100 μm之範圍內。為製造表面結構,亦可沿雷射束路徑佈置一遮罩或採用熟習本技藝者已知之成像方法。
於一較佳實施例中,藉由聚焦於施用於載體之黏著劑的所需部份之雷射將該部份黏著劑轉移至基板。
為實施本發明之方法,可移動雷射束及/或載體及/或基板。雷射束可(例如)藉由熟習本技藝者已知的包含旋轉鏡之透鏡系統移動。載體可(例如)呈連續地塗覆有包含導電顆粒之黏著劑之旋轉連續膜形式。基板可(例如)藉由XY台或以連續膜形式藉由展開及捲繞裝置移動。
自載體轉移至基板之黏著劑包含處於基質材料中之導電顆粒。該等顆粒係具任何所需幾何形狀且由任何所需導電材料組成、由不同導電材料之混合物組成或由導電材料與非導電材料之混合物組成之顆粒。適宜導電材料係(例如)諸如碳黑、石墨、石墨烯或碳奈米管之碳,或金屬。較佳金屬係鎳、錫、鋅、銅、銀、金、鋁、鈦、鈀、鉑及其等合金,或包含此等金屬中之至少一者之金屬混合物。導電顆粒之特佳材料係銀、鋁、銅、鎳、錫、鋅及碳、及其等混合物。
導電顆粒較佳具有0.001至100 μm,較佳0.002至80 μm及特佳0.005至50 μm之平均粒徑。平均粒徑可藉由(例如)在Microtrac X100測量儀上之雷射繞射測定來確定。粒徑分佈係視其製造方法而定。一般而言,粒徑分佈僅具有一最大值,但數個最大值亦可。為使顆粒特別緊密地填充,較佳使用不同的粒徑。例如,可將平均粒徑大於1 μm之顆粒與平均粒徑小於100 nm之奈米顆粒混合。
該等顆粒另亦可包含一第一金屬及一第二金屬,於此情況中,第二金屬係呈與第一金屬或一或多種其他金屬的合金形式。該等顆粒亦可包含兩種不同合金。
除顆粒之選擇外,顆粒之形式亦影響黏著劑塗覆後之性質。就形狀而言,可為熟習本技藝者已知的多種形狀。顆粒之形狀可為(例如)針狀、圓柱形、板形或球形。此等顆粒形狀係理想化形式,且實際形式例如可因製造在一定程度上發生變化。例如,於本發明中之滴狀顆粒實際上與理想球形不符。
具有不同顆粒形狀之適宜顆粒可自市面購置。
當使用顆粒混合物時,單獨混合搭配物亦可具有不同顆粒形狀及/或粒徑。亦可使用具有不同粒徑及/或顆粒形狀之僅一類顆粒的混合物。於不同顆粒形狀及/或粒徑之情況中,較佳者同樣係銀、鋁、銅、鎳、錫、鋅及碳、及其等混合物。
當使用多種顆粒形狀之混合物時,較佳使用球形顆粒與板形顆粒之混合物。於一實施例中,例如,將球形銀顆粒與板形銀顆粒及/或其他幾何形狀之碳顆粒一起使用。於另一實施例中,將球形銀顆粒與板形鋁顆粒組合。
導電顆粒更佳係由與施用黏著劑之半導體材料上之接觸相同的材料組成或包含此等材料。
基於乾燥塗料之總重量,導電顆粒之比例係於20至100重量%之範圍內。顆粒比例之較佳範圍係基於乾燥黏著劑總重量之50至95重量%。
適宜基質材料係(例如)天然及合成聚合物及其等衍生物、天然樹脂及合成樹脂及其等衍生物、天然橡膠、合成橡膠等。此等物可但不必化學或物理硬化,例如,空氣硬化、輻射硬化或溫度硬化。
基質材料較佳係聚合物或聚合物混合物。
作為基質材料之較佳聚合物係丙烯酸酯樹脂;烷基乙烯基乙酸酯;伸烷基-乙酸乙烯酯共聚物,特定言之,亞甲基-乙酸乙烯酯、伸乙基-乙酸乙烯酯、伸丁基-乙酸乙烯酯;伸烷基-乙烯氯共聚物;胺基樹脂;醛樹脂及酮樹脂;環氧丙烯酸酯;環氧樹脂;經改質之環氧樹脂,例如雙官能性或多官能性雙酚A或雙酚F樹脂、環氧酚醛樹脂、乙烯醚、伸乙基-丙烯酸共聚物;烴樹脂;MABS(包含丙烯酸酯單元之透明ABS);三聚氰胺樹脂、馬來酸酐共聚物;甲基丙烯酸酯;天然橡膠;合成橡膠;氯化橡膠;天然樹脂;酚系樹脂;苯氧基樹脂、聚酯樹脂、聚醯胺;聚醯亞胺;聚對苯二甲酸丁二酯(PBT);聚碳酸酯(例如,來自Bayer AG之Makrolon);聚甲基丙烯酸甲酯(PMMA);聚苯醚(PPO);聚乙烯化合物,特定言之,聚氯乙烯(PVC)、PVC共聚物、PVdC、聚乙烯乙酸酯及其等共聚物、聚乙烯縮醛、聚乙烯乙酸酯、聚乙烯醚、聚乙烯丙烯酸酯及聚乙烯甲基丙烯酸酯溶液及分散液,亦及其等共聚物、聚丙烯酸酯及聚苯乙烯共聚物;未交聯或與異氰酸酯交聯之聚胺基甲酸酯;聚胺基甲酸酯丙烯酸酯;1-及2-組分聚矽氧樹脂及聚矽氧橡膠、苯乙烯-丙烯酸共聚物;苯乙烯-丁二烯嵌段共聚物(例如,來自BASF AG之Styroflex或Styrolux,來自CPC之K-ResinTM);SIS;三嗪樹脂、雙馬來醯亞胺-三嗪樹脂(BT)、氰酸酯樹脂(CE)。兩或更多種聚合物之混合物亦可形成基質材料。
作為基質材料之特佳聚合物係丙烯酸酯、丙烯酸酯樹脂、甲基丙烯酸酯、甲基丙烯酸酯樹脂、三聚氰胺及胺基樹脂、聚醯亞胺、環氧樹脂、經改質之環氧樹脂、聚乙烯醚、酚系樹脂、聚胺基甲酸酯、聚酯、聚乙烯縮醛、聚乙烯乙酸酯、聚苯乙烯共聚物、聚苯乙烯丙烯酸酯、苯乙烯-丁二烯嵌段共聚物、苯乙烯-異戊二烯嵌段共聚物、合成橡膠、苯氧基樹脂、伸烷基-乙酸乙烯酯及乙烯氯共聚物、聚醯胺、亦及其等共聚物、亦及聚矽氧橡膠及聚矽氧樹脂。
基於乾黏著劑之總重量,用作基質材料之有機黏合劑組分之比例為0.01至60重量%。該比例較佳為0.1至45重量%,更佳0.5至35重量%。
為將包含導電顆粒及基質材料之黏著劑施用於載體,可另將溶劑或溶劑混合物添加至該黏著劑中,以建立適於特定施用方法之黏著劑黏度。適宜溶劑係(例如)脂族及芳族烴(例如,正辛烷、環己烷、甲苯、二甲苯)、醇(例如,甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇、2-丁醇、3-甲基丁醇、戊醇)、諸如甘油、乙二醇、丙二醇、新戊二醇之多元醇;烷基酯(例如,乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯、乙酸異丁酯、乙酸異丙酯)、烷氧基醇(例如,甲氧基丙醇、甲氧基丁醇、乙氧基丙醇)、烷基苯(例如,乙苯、異丙苯)、乙二醇丁醚、二乙二醇丁醚、乙二醇烷基醚乙酸酯(例如,乙二醇丁醚乙酸酯、二乙二醇丁醚乙酸酯、丙二醇甲基醚乙酸酯)、二丙酮醇、二乙二醇二烷基醚、二乙二醇單烷基醚、二丙二醇二烷基醚、二丙二醇單烷基醚、二乙二醇烷基醚乙酸酯、二丙二醇烷基醚乙酸酯、二氧雜環己烷、二丙二醇及醚、二乙二醇及醚、DBE(二元酯)、2,2,4-三甲基-1,3-戊二醇單異丁酸酯、醚類(例如,二乙基醚、四氫呋喃)、氯乙烯、乙二醇、乙二醇乙酸酯、乙二醇二甲基酯、甲酚、內酯(例如,丁內酯)、酮類(例如、丙酮、2-丁酮、環己酮、甲基乙基酮(MEK)、甲基異丁基酮(MIBK))、甲基二乙二醇、二氯甲烷、甲二醇、乙二醇一甲醚乙酸酯、甲基酚(鄰、間、對甲酚)、吡咯啶酮(例如,N-甲基-2-吡咯啶酮)、丙二醇、碳酸丙烯酯、四氯化碳、甲苯、三羥甲基丙烷(TMP)、芳族烴及混合物、脂族烴及混合物、醇類單萜(例如,萜品醇)、水及兩或更多種此等溶劑之混合物。
較佳溶劑係醇(例如,乙醇、1-丙醇、2-丙醇、丁醇)、烷氧基醇(例如,甲氧基丙醇、乙氧基丙醇、乙二醇丁醚、二乙二醇丁醚)、丁內酯、二乙二醇二烷基醚、二乙二醇單烷基醚、二丙二醇二烷基醚、二丙二醇單烷基醚、酯類(例如,乙酸乙酯、乙酸丁酯、乙二醇丁醚乙酸酯、二乙二醇丁醚乙酸酯、二乙二醇烷基醚乙酸酯、二丙二醇烷基醚乙酸酯、DBE、丙二醇甲基醚乙酸酯、2,2,4-三甲基-1,3-戊二醇單異丁酸酯)、醚類(例如,四氫呋喃、二氧雜環己烷)、諸如甘油、乙二醇、丙二醇、新戊二醇之多元醇;酮類(例如,丙酮、甲基乙基酮、甲基異丁基酮、環己酮)、烴(例如,環己烷、乙苯、甲苯、二甲苯)、N-甲基-2-吡咯啶酮、水及其等混合物。
於液體基質材料之情況中,亦可在施用期間藉由溫度,或藉由溶劑與溫度之組合建立特定黏度。
黏著劑中溶劑之比例係於1至50重量%之範圍內,較佳2至20重量%之範圍內,及特定言之,5至15重量%之範圍內,於各情況中均係基於未乾燥及未硬化黏著劑之總質量。
黏著劑可進一步包含分散劑組分。此係由一或多種分散劑組成。
原則上,熟習本技藝者所已知用於分散液中且於先前技藝中所述之所有分散劑均適宜。較佳分散劑係表面活性劑或表面活性劑混合物,例如,陰離子、陽離子、兩性或非離子性表面活性劑。陽離子及陰離子表面活性劑係描述於(例如)「Encyclopedia of Polymer Science and Technology」,J. Wiley & Sons(1966),第5卷,816至818頁,及「Emulsion Polymerisation and Emulsion Polymers」,編輯:P. Lovell and M. El-Asser,Verlag Wiley & Sons(1997),224至226頁中。然而,亦可將具有顏料親和錨定基團且為熟習本技藝者已知之聚合物用作分散劑。
分散劑使用量為基於未乾燥及未硬化黏著劑總重量之0至50重量%。該比例較佳係0.1至25重量%,更佳0.2至10重量%。
若載體上黏著劑中的導電顆粒自身無法充分吸收能量源(例如,雷射器)之能量,則可將吸收劑添加至該黏著劑中。根據所使用之雷射束源,需選擇有效吸收雷射輻射之不同吸收劑或吸收劑之混合物。將吸收劑添加至黏著劑中或將包含吸收劑的另一單獨吸收層施用於載體與黏著劑之間。於後一情況中,能量被局部地吸收於吸收層中並藉由熱傳導轉移至黏著劑。
用於雷射輻射之適宜吸收劑在雷射波長區域內具有高吸收。特別適宜者係在電磁譜之近紅外及長波VIS區域中具有高吸收之吸收劑。此等吸收劑特別適於吸收高功率固態雷射器(例如,Nd:YAG雷射器),亦及IR二極體雷射器之輻射。用於雷射輻射之適宜吸收劑之實例係在紅外頻譜區高度吸收之染料,例如,酞菁、萘酞菁、花青、醌、金屬錯合物顏料,如烯二硫醇、或光致變色染料。
此外,適宜吸收劑係無機顏料,特定言之,諸如鉻氧化物、鐵氧化物、鐵氧化物水合物或呈(例如)碳黑、石墨、石墨烯或碳奈米管形式之碳之深色無機染料。
除上述吸收劑外,亦可使用奈米顆粒,特定言之,金屬奈米顆粒,作為吸收劑。
本發明之奈米顆粒應理解為意指具有1至800 nm之粒徑之顆粒。用作吸收劑之奈米顆粒一般具有3至800 nm之粒徑。
可用作雷射輻射吸收劑之奈米顆粒,具體而言,係銀、金、鉑、鈀、鎢、鎳、錫、鐵、氧化銦錫、氧化鎢、碳化鈦或氮化鈦奈米顆粒。
使用銀、金、鉑、鈀、鎢、鎳、錫、鐵、氧化銦錫或碳化鈦之一優點係此等物質導電。因此,奈米顆粒亦可用作導電顆粒,以使黏著劑導電性較包含非導電吸收劑之黏著劑得以改良。
奈米顆粒之特佳物質係銀。
於一實施例中,奈米顆粒係球形顆粒。本發明之球形顆粒意指該等顆粒基本上係呈球形,但實際顆粒亦可與理想球形不符。例如,實際顆粒亦可(例如)經斜截或具有滴形。因製造而發生的與理想球形之其他不符亦可。
當奈米顆粒係球形顆粒時,其等直徑較佳為2至100 nm。特定言之,於使用紅外雷射(特定言之,具有1050 nm波長之紅外雷射)之情況中,發現粒徑為2至50 nm之球形奈米顆粒特別適宜。球形顆粒之直徑更佳係於6 nm範圍內。
當使用呈球形顆粒形式之奈米顆粒時,特定言之,黏著劑中奈米顆粒之比例為基於黏著劑中導電顆粒重量之0.5至12重量%。
於另一實施例中,奈米顆粒係具有15至1000 nm之邊長及3至100 nm之高度之棱柱。棱柱形式可多變。例如,該形式特定言之係取決於所使用之雷射輻射。棱柱底面可(例如)係呈任意多角形之形式,例如,三角形或五邊形。用作奈米顆粒之棱柱一般係吸收行為與所使用之雷射波長相匹配之電漿諧振器。例如,藉由棱柱之邊長及橫截面積來匹配所使用之雷射波長。例如,不同的橫截面積及不同的邊長各具有不同的吸收行為。棱柱高度亦對吸收行為產生影響。
當將棱柱用作奈米顆粒時,黏著劑中呈棱柱形式之奈米顆粒之比例較佳為基於黏著劑中導電顆粒之重量之3至10重量%。
除將球形顆粒或棱柱用作雷射輻射之吸收劑外,亦可同時使用球形顆粒及棱柱。球形顆粒對棱柱可為任何所需比。呈棱柱形式之奈米顆粒之比例越大,則黏著劑中奈米顆粒之比例越小。
該等奈米顆粒一般在製造期間以適宜添加劑來進行穩定,特定言之係針對於傳輸。於黏著劑製備期間,一般不移除該等添加劑,以使其等隨後仍存在於黏著劑中。穩定用添加劑之比例一般不超過奈米顆粒質量之15重量%。用於穩定奈米顆粒之添加劑可(例如)為長鏈胺,例如,十二烷基胺。適於穩定奈米顆粒之其他添加劑為(例如)辛基胺、癸基胺、油酸及聚乙二亞胺。
特別適宜的雷射輻射吸收劑係微細碳類型及微細六硼化鑭(LaB6),亦及金屬奈米顆粒。
一般而言,使用基於黏著劑中導電顆粒重量之0.005至20重量%的吸收劑。較佳使用0.01至15重量%的吸收劑及特佳使用0.1至12重量%的吸收劑,於各情況中均係基於黏著劑中導電顆粒之重量。
所添加之吸收劑之量係由熟習本技藝者根據各情況中所需之黏著層之性質選擇。就此而言,熟習本技藝者亦可考慮所添加之吸收劑不僅影響黏著劑之雷射轉移速度及效率,亦影響其他性質,例如,黏著劑於載體之黏著、硬化或導電性。
取決於所使用之雷射及/或製造載體之材料,可將轉移包含顆粒之黏著劑所需之能量施加於塗覆有黏著劑之一側或黏著劑之相對側。若需要,亦可使用兩不同方法之組合。
部份黏著劑自載體至基板之轉移可於一側或兩側進行。於此情況中,該轉移涉及利用兩雷射源連續或例如同時自兩側之塗覆有黏著劑之兩側及塗覆有黏著劑之兩載體。
為增加生產率,可使用一種以上的雷射源。
於本發明方法之一較佳實施例中,將黏著劑自載體轉移至基板前,先將黏著劑施用於載體。例如,該施用係藉由熟習本技藝者已知之塗覆方法實施。此等塗覆方法係(例如)澆鑄,如幕簾澆鑄、輥塗、延展、刮塗、刷塗、噴塗、浸塗等。或者,藉由任何所需印刷方法將包含顆粒之黏著劑印刷於載體上。印刷黏著劑之印刷方法係(例如)輥印刷法或電弧印刷法,例如,絲網印刷、凹版印刷、彈性凸版印刷、凸版印刷、移印、噴墨印刷、平版印刷。然而,亦可使用熟習本技藝者已知之任何其他印刷方法。
於一較佳實施例中,黏著劑在載體上未完全乾燥及/或硬化,而係以濕潤狀態轉移至基板。例如,此可使用連續印刷單元,其中可持續地更新載體上之黏著劑。此方案可獲得極高生產率。連續補充油墨之印刷單元係為熟習本技藝者已知,例如,自DE-A 37 02 643已知。為防止顆粒自黏著劑沉澱出,黏著劑宜在施用於載體之前於儲存容器中攪拌及/或循環泵壓。此外,當可控制存在有黏著劑之儲存容器之溫度時,宜建立該黏著劑之黏度。
於一較佳實施例中,將載體組態為特定雷射輻射可穿透之連續帶,其(例如)係藉由內部運輸輥移動。或者,可將載體設計成圓柱體,該圓柱體可藉由內部運輸輥移動或直接驅動。隨後例如藉由熟習本技藝者已知之方法,例如,藉由存在有黏著劑之儲存容器之輥或輥系統,使載體塗覆有包含顆粒之黏著劑。輥或輥系統之旋轉會帶動施用於載體之黏著劑。載體移動通過塗覆輥可將整個面積黏著層施用於該載體。為將黏著劑轉移至基板,將雷射束源置於連續帶或圓柱體內部。為轉移黏著劑,使雷射束聚焦於黏著層上,及雷射束經由該雷射束可穿透之載體,踫撞黏著劑並將踫撞黏著劑處之黏著劑轉移至基板。此印刷單元係描述於(例如)DE-A 37 02 643中。黏著劑轉移係(例如)藉由至少部份地蒸發黏著劑溶劑之雷射束能及藉由形成之轉移黏著劑之氣泡。未自載體轉移至基板之黏著劑可於下一塗覆步驟中再使用。
藉由雷射轉移而轉移至基板之黏著層之層厚度較佳為0.01至50 μm,更佳0.05至30 μm及特佳0.1至20 μm。可將黏著層施用於整個表面或以結構化方式施用。
當製造大量特定結構時宜以結構化方式將黏著劑施用於載體,且該結構化施用降低需施用於載體之黏著劑量。此獲得較低製造成本。
為在基板上獲得機械穩定、結構化或整個面積的黏著層,較佳含黏著劑之結構化或整個面積之黏著層施用於基板後,物理乾燥或硬化黏著劑。取決於基質材料,乾燥或硬化係(例如)藉由加熱、光(UV/vis)及/或輻射,例如紅外輻射、電子束、γ輻射、x-輻射、微波的作用來實施。為引發硬化反應,需添加適宜活化劑。硬化亦可藉由組合各種方法,例如,藉由組合UV輻射與加熱來實施。硬化方法之組合可同時或接續地進行。例如,可僅先使用UV或IR輻射以部份地硬化或部份地乾燥層體,以使形成的結構不再流動。此後,可藉由加熱的作用進一步硬化或乾燥層體。
本發明用於結構化地將導電黏著劑施用於基板之方法可以連續、半連續或分批模式操作。亦可僅連續地實施該方法之個別步驟,而其他步驟分批進行。
除製造結構化表面外,亦可藉由本發明方法連續地將複數層施用於基板。例如,製造第一導電表面的方法後可進行上述印刷方法以施用第二結構化或整個面積的導電表面,其例如含有另一導電顆粒組成。
於第三步驟中,將黏著劑接合至一電連接。該電連接係用於連接複數個太陽能電池以形成一光伏打模組。所使用之電連接係(例如)連接線。一般而言,太陽能電池前側面接觸於各情況中係連接至相鄰太陽能電池後側接觸。然而,適於太陽能電池連接之任何其他電連接亦可。
將黏著劑接合至電連接後,完全硬化該黏著劑。此獲得電連接與太陽能電池接觸之穩定且持久接合。完全硬化係,如上所述,例如藉由光、熱或輻射作用實施。
Claims (8)
- 一種製造太陽能電池間之導電接合的方法,其包含以下步驟:(a)利用雷射輻射載體而將包含導電顆粒之黏著劑自該載體轉移至基板,(b)部份地乾燥及/或硬化轉移至該基板之該黏著劑以形成一黏著層,(c)將該黏著劑接合至一電連接,(d)硬化該黏著層。
- 如請求項1之方法,其中步驟a)中之該轉移係在將該黏著劑施用於該載體之後。
- 如請求項2之方法,其中該黏著劑係藉由塗覆方法施用於該載體。
- 如請求項3之方法,其中該塗覆方法係印刷、澆鑄、輥壓或噴塗方法。
- 如請求項1之方法,其中該雷射器產生具有150至10 600nm波長範圍之雷射束。
- 如請求項1之方法,其中該雷射器係固態雷射器、纖維雷射器、二極體雷射器、氣體雷射器或準分子雷射器。
- 如請求項1之方法,其中將該黏著劑施用於基板頂面及底面以形成黏著層。
- 如請求項1之方法,其中該載體係所用雷射輻射可穿透之剛性或可撓塑膠或玻璃。
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EP2058868A1 (en) * | 2006-08-29 | 2009-05-13 | Hitachi Chemical Company, Ltd. | Conductive adhesive film and solar cell module |
US20090288697A1 (en) * | 2006-08-29 | 2009-11-26 | Hitachi Chemical Co., Ltd. | Conductive adhesive film and solar cell module |
TW200836601A (en) * | 2007-01-05 | 2008-09-01 | Basf Ag | Method for producing electrically conductive surfaces |
TW200845845A (en) * | 2007-01-19 | 2008-11-16 | Basf Ag | Method for producing structured electrically conductive surfaces |
Also Published As
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JP2013519782A (ja) | 2013-05-30 |
EP2537188A4 (en) | 2016-04-13 |
AU2011216964B2 (en) | 2015-07-09 |
MX2012009464A (es) | 2012-09-12 |
EP2537188A1 (en) | 2012-12-26 |
TW201214738A (en) | 2012-04-01 |
JP5898097B2 (ja) | 2016-04-06 |
IL221324A0 (en) | 2012-10-31 |
SG183160A1 (en) | 2012-09-27 |
KR20130008554A (ko) | 2013-01-22 |
US8920591B2 (en) | 2014-12-30 |
CA2789913A1 (en) | 2011-08-25 |
MY162086A (en) | 2017-05-31 |
AU2011216964A1 (en) | 2012-09-06 |
US20120312467A1 (en) | 2012-12-13 |
RU2553774C2 (ru) | 2015-06-20 |
WO2011101788A1 (en) | 2011-08-25 |
RU2012139358A (ru) | 2014-03-27 |
CN102770971A (zh) | 2012-11-07 |
IL221324A (en) | 2016-10-31 |
CN102770971B (zh) | 2016-03-30 |
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