RU2003107922A - Способ изготовления композиционных деталей литьем под давлением порошка и пригодные для этого композиционные порошки - Google Patents
Способ изготовления композиционных деталей литьем под давлением порошка и пригодные для этого композиционные порошки Download PDFInfo
- Publication number
- RU2003107922A RU2003107922A RU2003107922/02A RU2003107922A RU2003107922A RU 2003107922 A RU2003107922 A RU 2003107922A RU 2003107922/02 A RU2003107922/02 A RU 2003107922/02A RU 2003107922 A RU2003107922 A RU 2003107922A RU 2003107922 A RU2003107922 A RU 2003107922A
- Authority
- RU
- Russia
- Prior art keywords
- powder
- composite powder
- copper
- metal
- tungsten
- Prior art date
Links
- 239000000843 powder Substances 0.000 title claims abstract 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract 5
- 239000000203 mixture Substances 0.000 title claims 3
- 238000005266 casting Methods 0.000 title 1
- 239000002131 composite material Substances 0.000 claims abstract 11
- 238000000034 method Methods 0.000 claims abstract 10
- 239000002905 metal composite material Substances 0.000 claims abstract 9
- 239000000919 ceramic Substances 0.000 claims abstract 6
- 239000011230 binding agent Substances 0.000 claims abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 4
- 229910052802 copper Inorganic materials 0.000 claims abstract 4
- 239000010949 copper Substances 0.000 claims abstract 4
- 238000001746 injection moulding Methods 0.000 claims abstract 4
- 239000007788 liquid Substances 0.000 claims abstract 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract 3
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract 3
- 239000011733 molybdenum Substances 0.000 claims abstract 3
- 239000001301 oxygen Substances 0.000 claims abstract 3
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract 3
- 229910052721 tungsten Inorganic materials 0.000 claims abstract 3
- 239000010937 tungsten Substances 0.000 claims abstract 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000001257 hydrogen Substances 0.000 claims abstract 2
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 claims 3
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 3
- 230000001681 protective effect Effects 0.000 claims 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002923 metal particle Substances 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/12—Metallic powder containing non-metallic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Powder Metallurgy (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Claims (11)
1. Способ изготовления композиционных деталей литьем под давлением порошковой системы, содержащей металлический композиционный порошок и связующий материал, отличающийся тем, что к металлическому композиционному порошку перед смешиванием со связующим материалом в инертной атмосфере добавляют защитную жидкость.
2. Способ по п.1, отличающийся тем, что система, содержащая металлический композиционный порошок и связующий материал, дополнительно содержит керамический компонент.
3. Способ по п.1, отличающийся тем, что используют металлический композиционный порошок, получаемый при восстановлении водородом окислов, как минимум, двух различных металлов.
4. Способ по, как минимум, одному пп.1-3, отличающийся тем, что в качестве защитной жидкости используют гексан, гептан, толуол или их смеси.
5. Способ по, как минимум, одному пп.1-4, отличающийся тем, что защитная жидкость содержит восковой компонент.
6. Способ по, как минимум, одному пп.1-5, отличающийся тем, что в качестве металлического композиционного порошка используют вольфрам-медный или молибден-медный композиционный порошок.
7. Способ по п.6, отличающийся тем, что стадию спекания, необходимую при изготовлении деталей литьем под давлением порошка, осуществляют при температуре от 1090 до 1300°С.
8. Способ по, как минимум, одному пп.1-7, отличающийся тем, что первичные металлические зерна металлического композиционного порошка имеют преобладающие размеры <2 мкм и содержание кислорода <0,8 вес.%.
9. Молибден-медный или вольфрам-медный композиционный порошок, отличающийся тем, что его первичные металлические зерна имеют преобладающие размеры <2 мкм и содержание кислорода <0,8 вес.%, предпочтительно, <0,5 вес.%, особенно предпочтительно, <0,3 вес.%.
10. Композиционный порошок по п.9, отличающийся тем, что композиционный порошок содержит керамический компонент.
11. Способ получения молибден-медного или вольфрам-медного композиционного порошка по п.9, отличающийся тем, что окислы молибдена или вольфрама и меди смешивают, перемалывают в сухом виде и восстанавливают при температуре от 800 до 1050°С сухим водородом.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10041194A DE10041194A1 (de) | 2000-08-23 | 2000-08-23 | Verfahren zur Herstellung von Verbundbauteilen durch Pulver-Spritzgießen und dazu geeignete Verbundpulver |
| DE10041194.0 | 2000-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2003107922A true RU2003107922A (ru) | 2004-09-20 |
Family
ID=7653400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2003107922/02A RU2003107922A (ru) | 2000-08-23 | 2001-08-10 | Способ изготовления композиционных деталей литьем под давлением порошка и пригодные для этого композиционные порошки |
Country Status (14)
| Country | Link |
|---|---|
| US (2) | US6562290B2 (ru) |
| EP (1) | EP1313581B1 (ru) |
| JP (1) | JP2004506815A (ru) |
| KR (1) | KR100832930B1 (ru) |
| CN (3) | CN1247372C (ru) |
| AT (1) | ATE347957T1 (ru) |
| AU (1) | AU2001293754A1 (ru) |
| CA (1) | CA2420262A1 (ru) |
| DE (2) | DE10041194A1 (ru) |
| DK (1) | DK1313581T3 (ru) |
| MX (1) | MXPA03001603A (ru) |
| RU (1) | RU2003107922A (ru) |
| TW (1) | TW539587B (ru) |
| WO (1) | WO2002016063A2 (ru) |
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| JP4146119B2 (ja) * | 2001-12-04 | 2008-09-03 | Ｊｆｅミネラル株式会社 | 導電ペースト用銅合金粉 |
| KR100468216B1 (ko) * | 2002-05-06 | 2005-01-26 | 국방과학연구소 | 텅스텐이 코팅된 텅스텐-구리 복합 분말의 제조 방법 및그의 용도 |
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| US7329381B2 (en) | 2002-06-14 | 2008-02-12 | General Electric Company | Method for fabricating a metallic article without any melting |
| US7416697B2 (en) | 2002-06-14 | 2008-08-26 | General Electric Company | Method for preparing a metallic article having an other additive constituent, without any melting |
| KR100490880B1 (ko) * | 2002-11-30 | 2005-05-24 | 국방과학연구소 | 텅스텐-구리 복합재료의 구리 스며나옴 억제 소결법 |
| US6849229B2 (en) * | 2002-12-23 | 2005-02-01 | General Electric Company | Production of injection-molded metallic articles using chemically reduced nonmetallic precursor compounds |
| US7727462B2 (en) * | 2002-12-23 | 2010-06-01 | General Electric Company | Method for meltless manufacturing of rod, and its use as a welding rod |
| US7897103B2 (en) | 2002-12-23 | 2011-03-01 | General Electric Company | Method for making and using a rod assembly |
| DE10331397A1 (de) * | 2003-07-11 | 2005-01-27 | Mtu Aero Engines Gmbh | Verfahren zur Herstellung von Bauteilen einer Gasturbine sowie entsprechendes Bauteil |
| ES2718928T3 (es) * | 2003-11-14 | 2019-07-05 | Wild River Consulting Group Llc | Material compuesto de polímero metálico, un método para su extrusión y artículos conformados a partir del mismo |
| US8841358B2 (en) | 2009-04-29 | 2014-09-23 | Tundra Composites, LLC | Ceramic composite |
| US20110236699A1 (en) * | 2003-11-14 | 2011-09-29 | Tundra Composites, LLC | Work piece comprising metal polymer composite with metal insert |
| US9105382B2 (en) | 2003-11-14 | 2015-08-11 | Tundra Composites, LLC | Magnetic composite |
| US20090127801A1 (en) * | 2003-11-14 | 2009-05-21 | Wild River Consulting Group, Llc | Enhanced property metal polymer composite |
| US7063815B2 (en) | 2003-12-05 | 2006-06-20 | Agency For Science, Technology And Research | Production of composite materials by powder injection molding and infiltration |
| DE102004020404B4 (de) * | 2004-04-23 | 2007-06-06 | H. C. Starck Gmbh & Co. Kg | Trägerplatte für Sputtertargets, Verfahren zu ihrer Herstellung und Einheit aus Trägerplatte und Sputtertarget |
| KR20060008046A (ko) * | 2004-07-23 | 2006-01-26 | 한양대학교 산학협력단 | 나노크기의 금속분말 피드스톡 제조방법 및 이를 이용한소결체 제조방법 |
| US7531021B2 (en) | 2004-11-12 | 2009-05-12 | General Electric Company | Article having a dispersion of ultrafine titanium boride particles in a titanium-base matrix |
| US20060242813A1 (en) * | 2005-04-29 | 2006-11-02 | Fred Molz | Metal injection molding of spinal fixation systems components |
| CN1309547C (zh) * | 2005-05-08 | 2007-04-11 | 北京科技大学 | 一种制备高尺寸精度异型钼零部件的方法 |
| KR101147087B1 (ko) * | 2005-06-28 | 2012-05-17 | 엘지디스플레이 주식회사 | 평판표시소자의 제조방법 |
| CA2641946C (en) * | 2006-02-09 | 2016-01-12 | Wild River Consulting Group, Llc | Metal polymer composite with enhanced viscoelastic and thermal properties |
| CN101460279B (zh) * | 2006-06-08 | 2011-12-28 | 日本钨株式会社 | 点焊用电极 |
| KR100858658B1 (ko) * | 2006-07-31 | 2008-09-16 | 주식회사 쎄타텍 | 텅스텐-구리 방전가공용 전극 제조방법 |
| NO328397B1 (no) * | 2007-07-04 | 2010-02-08 | Yara Int Asa | Fremgangsmate til a produsere keramiske katalysatorer. |
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| CN101942591A (zh) * | 2010-07-31 | 2011-01-12 | 湖南科技大学 | 一种快速制备钼铜合金的方法 |
| CN102921954A (zh) * | 2012-11-13 | 2013-02-13 | 中南大学 | 一种低温制备“壳-核结构”纳米钼铜复合粉末的方法 |
| CN103273055B (zh) * | 2013-05-27 | 2015-04-08 | 费县阳光塑料包装制品有限公司 | 一种拉丝及其制备方法 |
| DE102017115784A1 (de) * | 2017-07-13 | 2019-01-17 | Rolls-Royce Deutschland Ltd & Co Kg | Kriechbeständige Legierung und Verfahren zur Herstellung eines Bauteils aus einer kriechbeständigen Legierung |
| US20210260652A1 (en) * | 2018-06-20 | 2021-08-26 | Desktop Metal, Inc. | Methods and compositions for the preparation of powders for binder-based three-dimensional additive metal manufacturing |
| CN108746630A (zh) * | 2018-06-25 | 2018-11-06 | 长春中科昊融新材料研究有限公司 | 降低烧结温度制备金属注射成形喂料的方法 |
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-
2000
- 2000-08-23 DE DE10041194A patent/DE10041194A1/de not_active Withdrawn
-
2001
- 2001-08-10 DE DE50111650T patent/DE50111650D1/de not_active Expired - Fee Related
- 2001-08-10 EP EP01974159A patent/EP1313581B1/de not_active Expired - Lifetime
- 2001-08-10 CN CNB018144500A patent/CN1247372C/zh not_active Expired - Fee Related
- 2001-08-10 JP JP2002520975A patent/JP2004506815A/ja active Pending
- 2001-08-10 RU RU2003107922/02A patent/RU2003107922A/ru not_active Application Discontinuation
- 2001-08-10 AT AT01974159T patent/ATE347957T1/de not_active IP Right Cessation
- 2001-08-10 WO PCT/EP2001/009253 patent/WO2002016063A2/de active IP Right Grant
- 2001-08-10 CA CA002420262A patent/CA2420262A1/en not_active Abandoned
- 2001-08-10 AU AU2001293754A patent/AU2001293754A1/en not_active Abandoned
- 2001-08-10 MX MXPA03001603A patent/MXPA03001603A/es active IP Right Grant
- 2001-08-10 DK DK01974159T patent/DK1313581T3/da active
- 2001-08-10 KR KR1020037002610A patent/KR100832930B1/ko not_active IP Right Cessation
- 2001-08-10 CN CNA200610005437XA patent/CN1799730A/zh active Pending
- 2001-08-10 CN CNA2006101003962A patent/CN1876286A/zh active Pending
- 2001-08-20 US US09/932,916 patent/US6562290B2/en not_active Expired - Fee Related
- 2001-08-22 TW TW090120571A patent/TW539587B/zh not_active IP Right Cessation
-
2002
- 2002-11-21 US US10/301,168 patent/US6858060B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20020068005A1 (en) | 2002-06-06 |
| EP1313581A2 (de) | 2003-05-28 |
| KR100832930B1 (ko) | 2008-05-27 |
| AU2001293754A1 (en) | 2002-03-04 |
| JP2004506815A (ja) | 2004-03-04 |
| WO2002016063A2 (de) | 2002-02-28 |
| DE10041194A1 (de) | 2002-03-07 |
| TW539587B (en) | 2003-07-01 |
| CN1447729A (zh) | 2003-10-08 |
| CN1876286A (zh) | 2006-12-13 |
| KR20030023766A (ko) | 2003-03-19 |
| DE50111650D1 (de) | 2007-01-25 |
| US6858060B2 (en) | 2005-02-22 |
| US6562290B2 (en) | 2003-05-13 |
| US20030075018A1 (en) | 2003-04-24 |
| CN1799730A (zh) | 2006-07-12 |
| EP1313581B1 (de) | 2006-12-13 |
| DK1313581T3 (da) | 2007-02-26 |
| MXPA03001603A (es) | 2003-09-10 |
| CA2420262A1 (en) | 2002-02-28 |
| WO2002016063A3 (de) | 2002-09-06 |
| ATE347957T1 (de) | 2007-01-15 |
| CN1247372C (zh) | 2006-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA92 | Acknowledgement of application withdrawn (lack of supplementary materials submitted) |
Effective date: 20051029 |