PL2679332T3 - Folia samoprzylepna - Google Patents

Folia samoprzylepna

Info

Publication number
PL2679332T3
PL2679332T3 PL13173636T PL13173636T PL2679332T3 PL 2679332 T3 PL2679332 T3 PL 2679332T3 PL 13173636 T PL13173636 T PL 13173636T PL 13173636 T PL13173636 T PL 13173636T PL 2679332 T3 PL2679332 T3 PL 2679332T3
Authority
PL
Poland
Prior art keywords
pressure
sensitive adhesive
adhesive film
film
sensitive
Prior art date
Application number
PL13173636T
Other languages
English (en)
Inventor
Kenta Yamashita
Mitsushi Yamamoto
Donald Pinxten
Bert Cryns
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=48672479&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2679332(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of PL2679332T3 publication Critical patent/PL2679332T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J107/00—Adhesives based on natural rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PL13173636T 2012-06-25 2013-06-25 Folia samoprzylepna PL2679332T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012141996A JP6075978B2 (ja) 2012-06-25 2012-06-25 粘着フィルム
EP13173636.5A EP2679332B1 (en) 2012-06-25 2013-06-25 Pressure-sensitive adhesive film

Publications (1)

Publication Number Publication Date
PL2679332T3 true PL2679332T3 (pl) 2021-07-05

Family

ID=48672479

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13173636T PL2679332T3 (pl) 2012-06-25 2013-06-25 Folia samoprzylepna

Country Status (8)

Country Link
US (2) US9302344B2 (pl)
EP (1) EP2679332B1 (pl)
JP (1) JP6075978B2 (pl)
CN (1) CN103509478B (pl)
BR (1) BR102013016336A2 (pl)
CA (1) CA2820680A1 (pl)
ES (1) ES2864768T3 (pl)
PL (1) PL2679332T3 (pl)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
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MX2016012962A (es) * 2014-04-03 2016-12-07 3M Innovative Properties Co Pelicula segmentada y metodo para fabricar la misma.
JP6274707B2 (ja) * 2014-05-22 2018-02-07 株式会社デンソー 光硬化性接着剤
EP3012288A1 (en) * 2014-10-21 2016-04-27 Nitto Denko Corporation Pressure-sensitive adhesive film for laser beam cutting applications
EP3031606A1 (de) 2014-12-11 2016-06-15 Mondi Gronau GmbH Oberflächenschutzfolie sowie Verwendung der Oberflächenschutzfolie zum temporären Schutz eines Gegenstandes während seiner Verarbeitung
EP3072879A1 (en) 2015-03-26 2016-09-28 Nitto Europe N.V Method for prevention of premature polymerization
CN108473822B (zh) 2015-12-30 2021-11-12 3M创新有限公司 双阶段结构粘结粘合剂
CN108430699B (zh) 2015-12-30 2023-06-23 3M创新有限公司 磨料制品和相关方法
WO2017116941A1 (en) * 2015-12-30 2017-07-06 3M Innovative Properties Company Infrared absorbing adhesive films and related methods
WO2017117356A1 (en) 2015-12-30 2017-07-06 3M Innovative Properties Company Abrasive article
WO2017188168A1 (ja) * 2016-04-28 2017-11-02 日本ゼオン株式会社 光学フィルムの製造方法
JP6844180B2 (ja) * 2016-09-30 2021-03-17 日本ゼオン株式会社 複合パネル及びその製造方法
JP7105222B2 (ja) * 2017-03-03 2022-07-22 日東電工株式会社 粘着フィルム
JP6403911B1 (ja) * 2017-05-23 2018-10-10 株式会社きもと 積層遮光フィルム、並びに、これを用いた光学機器用遮光リング、レンズユニット及びカメラモジュール
JP6913521B2 (ja) 2017-06-09 2021-08-04 株式会社アズ 機能性布帛およびその製造方法
CN109536061B (zh) * 2017-07-28 2022-01-25 东丽先端材料研究开发（中国）有限公司 一种粘合薄膜
JP7058096B2 (ja) * 2017-09-27 2022-04-21 日東電工株式会社 粘着フィルム
JP7260993B2 (ja) * 2017-12-07 2023-04-19 住友化学株式会社 積層フィルムの切断方法及び製造方法
CN108841335B (zh) * 2018-05-30 2021-03-26 宁波科莱恩新材料科技有限公司 一种黑黑遮光胶带及其制备方法
JP7074333B2 (ja) * 2018-06-01 2022-05-24 みかど化工株式会社 レーザ加工可能な農業用フィルム及び農業用フィルムのレーザ加工方法
JP7318652B2 (ja) * 2018-08-20 2023-08-01 日本ゼオン株式会社 カットフィルムの製造方法及びカットフィルム
JP7215872B2 (ja) * 2018-10-22 2023-01-31 日東電工株式会社 粘着シート
JP7300619B2 (ja) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 積層構造体、ドライフィルム、その硬化物および電子部品
CN110136865B (zh) * 2019-04-29 2020-12-18 华中科技大学 一种基于激光焊接的大面积纳米柔性电极制备方法及产品
DE102020208059A1 (de) 2020-06-29 2021-12-30 Tesa Se Lagerstabiles reaktives haftklebeband
CN112793270A (zh) * 2020-12-30 2021-05-14 大连大富塑料彩印有限公司 一种适用于激光切割的薄膜
TWI759044B (zh) * 2020-12-30 2022-03-21 環球晶圓股份有限公司 碳化矽晶片的雷射雕刻方法
CN116348565B (zh) * 2021-03-31 2024-03-12 株式会社寺冈制作所 粘合组合物和粘合带
CN113540313B (zh) * 2021-06-18 2023-05-19 泉州三安半导体科技有限公司 一种led芯片及其制造方法、半导体发光器件及显示装置
JP2024049602A (ja) * 2022-09-29 2024-04-10 日東電工株式会社 粘着シート
CN115746736A (zh) * 2022-12-08 2023-03-07 襄阳三沃航天薄膜材料有限公司 一种用于光学镜片激光切割的保护膜及制备方法

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JPH03146285A (ja) * 1989-11-02 1991-06-21 Toshiba Corp レーザ加工制御装置
DE4433626A1 (de) 1994-02-25 1995-08-31 Poli Film Verwaltungs Gmbh Leitfähige mehrschichtige Kunststoffolie
EP1184437A3 (en) 2000-09-01 2002-03-13 3M Innovative Properties Company Use of a pressure-sensitive adhesive tape for providing a skid-resistant surface
JP4886937B2 (ja) * 2001-05-17 2012-02-29 リンテック株式会社 ダイシングシート及びダイシング方法
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
WO2004061031A1 (ja) 2002-12-27 2004-07-22 Lintec Corporation 粘着シートおよびその製造方法
JP4595284B2 (ja) 2003-01-28 2010-12-08 三菱瓦斯化学株式会社 炭酸ガスレーザーによる孔あけ用補助シート
EP1634673A4 (en) * 2003-04-25 2009-04-08 Nitto Denko Corp METHOD FOR PRODUCING A LASER-TREATED PRODUCT AND AN ADHESIVE SHEET FOR A LASER TREATMENT USED FOR THIS PRODUCT
JP2005343908A (ja) * 2004-05-31 2005-12-15 Lintec Corp 粘着シートおよびその製造方法
JP5322373B2 (ja) * 2006-04-17 2013-10-23 日東電工株式会社 粘着テープ又はシート用基材、反射性及び／又は遮光性を有する粘着テープ又はシート、および液晶表示装置
JP5570269B2 (ja) 2010-03-29 2014-08-13 リンテック株式会社 粘着シート
DE102010003817B4 (de) 2010-04-09 2013-04-11 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Werkstückschutzfolie und damit folienbeschichtetes Werkstück
JP5249290B2 (ja) 2010-07-20 2013-07-31 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
FR2967365A1 (fr) 2010-11-15 2012-05-18 Pascal Lutz Utilisation d'un film de protection temporaire pour proteger une surface metallique lors de la decoupe par faisceau laser
JP2013018964A (ja) 2011-06-17 2013-01-31 Nitto Denko Corp 粘着フィルム

Also Published As

Publication number Publication date
CN103509478B (zh) 2017-07-14
EP2679332B1 (en) 2021-03-10
US9302344B2 (en) 2016-04-05
JP2014005372A (ja) 2014-01-16
CN103509478A (zh) 2014-01-15
CA2820680A1 (en) 2013-12-25
US10293435B2 (en) 2019-05-21
US20160168426A1 (en) 2016-06-16
BR102013016336A2 (pt) 2016-09-27
EP2679332A1 (en) 2014-01-01
ES2864768T3 (es) 2021-10-14
JP6075978B2 (ja) 2017-02-08
US20130344326A1 (en) 2013-12-26

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