PH12017000003A1 - Surface-treated copper foil - Google Patents

Surface-treated copper foil

Info

Publication number
PH12017000003A1
PH12017000003A1 PH12017000003A PH12017000003A PH12017000003A1 PH 12017000003 A1 PH12017000003 A1 PH 12017000003A1 PH 12017000003 A PH12017000003 A PH 12017000003A PH 12017000003 A PH12017000003 A PH 12017000003A PH 12017000003 A1 PH12017000003 A1 PH 12017000003A1
Authority
PH
Philippines
Prior art keywords
copper foil
pcnt
atomic
concentration
treated
Prior art date
Application number
PH12017000003A
Inventor
Miki Atsushi
Fukuchi Ryo
Arai Hideta
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12017000003A1 publication Critical patent/PH12017000003A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil having a surface-treated surface, the surface-treated copper foil satisfying one or more of the following conditions (1) to (3): by an XPS measurement at a depth after sputtering from the surface-treated surface for 0.5 min at a rate of 1.1 nm/min (Si02 conversion), (1) the N concentration is from 1.5 to 7.5 atomic pcnt ; ( 2) the C concentration is from 12 to 3 0 atomic pcnt ; and ( 3) the Si concentration is 3.1 atomic pcnt or more and the 0 concentration is from 40 to 48 atomic pcnt .
PH12017000003A 2016-01-04 2017-01-04 Surface-treated copper foil PH12017000003A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016000119 2016-01-04
JP2016230684A JP6854114B2 (en) 2016-01-04 2016-11-28 Surface-treated copper foil

Publications (1)

Publication Number Publication Date
PH12017000003A1 true PH12017000003A1 (en) 2018-07-09

Family

ID=59306830

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017000003A PH12017000003A1 (en) 2016-01-04 2017-01-04 Surface-treated copper foil

Country Status (6)

Country Link
JP (1) JP6854114B2 (en)
KR (1) KR102054044B1 (en)
CN (1) CN107018624B (en)
MY (1) MY190555A (en)
PH (1) PH12017000003A1 (en)
TW (1) TWI623639B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6413039B1 (en) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 Surface treated copper foil and copper clad laminate
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
LU101698B1 (en) 2020-03-18 2021-09-20 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034310B2 (en) * 1976-10-07 1985-08-08 株式会社東芝 Video special effects equipment
JP4295800B2 (en) 2002-05-13 2009-07-15 三井金属鉱業株式会社 Electrolytic copper foil
JP4115293B2 (en) * 2003-02-17 2008-07-09 古河サーキットフォイル株式会社 Copper foil for chip-on-film
JP4548828B2 (en) * 2004-10-29 2010-09-22 Ｄｏｗａホールディングス株式会社 Method for manufacturing metal-coated substrate
TW200626358A (en) * 2004-11-30 2006-08-01 Nippon Steel Chemical Co Copper-clad laminate
JP2006182019A (en) * 2004-11-30 2006-07-13 Nippon Steel Chem Co Ltd Copper-clad laminate
CN102124823B (en) * 2009-06-30 2013-03-06 Jx日矿日石金属株式会社 Copper foil for printed wiring board
JPWO2011039875A1 (en) * 2009-09-30 2013-02-21 Jx日鉱日石金属株式会社 Cu-Ni-Si alloy tin-plated strip with excellent heat-resistant peelability for tin plating
JP5345924B2 (en) 2009-11-27 2013-11-20 Ｊｘ日鉱日石金属株式会社 Copper foil for printed wiring boards
JP5242710B2 (en) 2010-01-22 2013-07-24 古河電気工業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
WO2011138876A1 (en) 2010-05-07 2011-11-10 Jx日鉱日石金属株式会社 Copper foil for printed circuit
JP5932638B2 (en) * 2010-05-19 2016-06-08 三井金属鉱業株式会社 Copper powder for conductive paste and conductive paste
JP5346054B2 (en) * 2011-03-18 2013-11-20 Ｊｘ日鉱日石金属株式会社 Copper foil for printed wiring board and laminated board using the same
MY169065A (en) * 2012-03-29 2019-02-12 Jx Nippon Mining & Metals Corp Surface-treated copper foil
CN104220642B (en) * 2012-03-29 2018-02-02 Jx日矿日石金属株式会社 Surface treatment copper foil
JP5481553B1 (en) * 2012-11-30 2014-04-23 Ｊｘ日鉱日石金属株式会社 Copper foil with carrier
JP6425401B2 (en) * 2013-04-26 2018-11-21 Ｊｘ金属株式会社 Copper foil for high frequency circuit, copper clad laminate for high frequency circuit, printed wiring board for high frequency circuit, copper foil with carrier for high frequency circuit, electronic device, and method of manufacturing printed wiring board
JP5914427B2 (en) * 2013-07-23 2016-05-11 京楽産業．株式会社 Game machine
KR102138676B1 (en) * 2015-04-28 2020-07-28 미쓰이금속광업주식회사 Surface-treated copper foil and its manufacturing method, copper-clad laminate for printed wiring board, and printed wiring board

Also Published As

Publication number Publication date
MY190555A (en) 2022-04-27
KR20170081572A (en) 2017-07-12
TWI623639B (en) 2018-05-11
JP6854114B2 (en) 2021-04-07
TW201726961A (en) 2017-08-01
KR102054044B1 (en) 2019-12-09
CN107018624A (en) 2017-08-04
CN107018624B (en) 2019-05-07
JP2017122274A (en) 2017-07-13

Similar Documents

Publication Publication Date Title
MY186859A (en) Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
PH12016500404A1 (en) Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board
PH12017502362A1 (en) Roughened copper foil, copper-clad laminate and printed wiring board
MY182166A (en) Copper foil, copper foil with carrier foil, and copper-clad laminate
IN2014DN08029A (en)
MY169155A (en) Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
MY186397A (en) Roughened copper foil, copper-clad laminate, and printed wiring board
PH12020551364A1 (en) Surface treated copper foil, copper clad laminate, and printed circuit board
PH12017000003A1 (en) Surface-treated copper foil
MY186451A (en) Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
MY185462A (en) Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3026145A4 (en) Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
WO2011159417A3 (en) Thermal interface material assemblies, and related methods
MY177723A (en) Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board
IN2014DN08075A (en)
MY164343A (en) Solder alloy, solder paste, and electronic circuit board
MY181388A (en) Roughened copper foil, copper clad laminate, and printed circuit board
MY187285A (en) Copper foil provided with carrier foil, copper clad laminate and printed wiring board
MY186266A (en) Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
EP3026144A4 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
WO2012015982A3 (en) Electronics substrate with enhanced direct bonded metal
SG10201805388PA (en) Insulating layer for printed circuit board and printed circuit board
MY180430A (en) Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
MY189234A (en) Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device
MY178787A (en) Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices