JP5345924B2 - Copper foil for printed wiring boards - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board which is excellent in both bondability with an insulated substrate and etching performance, suitable for fine pitch, and small in environmental load. <P>SOLUTION: The copper foil for a printed wiring board includes a copper foil base material and a coating layer, and the coating layer is composed of an intermediate layer made of a metal alone or an alloy and a Ti layer in order from a surface of the copper foil base material, the coating layer containing Ti by 15 to 100 &mu;g/dm<SP>2</SP>in terms of coating amount, and satisfying &int;h(x)dx/(&int;f(x)dx+&int;g(x)dx+&int;h(x)dx+&int;i(x)dx+&int;j(x)dx+&int;k(x)dx)&le;10% and &int;f<SB>2</SB>(x)dx/(&int;f(x)dx+&int;g(x)dx+&int;h(x)dx+&int;i(x)dx+&int;j(x)dx+&int;k(x)dx)&ge;15% in a section [0, 1.0] and 0.1&le;&int;f<SB>1</SB>(x)dx/&int;f<SB>2</SB>(x)dx&le;2.5 in a section [1.0, 2.5], where f<SB>1</SB>(x) represents an atomic concentration (%) of metal titanium in a depth direction obtained through depth-direction analysis from the surface by XPS (x: unit nm), f<SB>2</SB>(x) an atomic concentration (%) of titanium oxide, f(x) an atomic concentration (%) of all titanium, or (f(x)=f<SB>1</SB>(x)+f<SB>2</SB>(x)), g(x) an atomic concentration (%) of nickel, h(x) an atomic concentration (%) of copper, i(x) an atomic concentration (%) of oxygen, j(x) an atomic concentration (%) of carbon, and k(x) the total of atomic concentrations of other metals. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a copper foil for a printed wiring board, and more particularly to a copper foil for a flexible printed wiring board.

  Printed wiring boards have made great progress over the last half century and are now used in almost all electronic devices. In recent years, with the increasing needs for miniaturization and higher performance of electronic equipment, higher density mounting of components and higher frequency of signals have progressed. Response is required.

  Generally, a printed wiring board is manufactured through a process in which an insulating substrate is bonded to a copper foil to form a copper-clad laminate, and then a conductor pattern is formed on the copper foil surface by etching. Therefore, the copper foil for printed wiring boards is required to have adhesiveness and etching properties with an insulating substrate.

  As a technique for improving adhesiveness with an insulating substrate, a surface treatment for forming irregularities on a copper foil surface called a roughening treatment is generally performed. For example, by using a copper sulfate acidic plating bath on the M surface (rough surface) of the electrolytic copper foil, a large number of copper is electrodeposited in a dendritic or small spherical shape to form fine irregularities, and the adhesion is improved by the anchoring effect. There is. After the roughening treatment, a chromate treatment, a treatment with a silane coupling agent, or the like is generally performed in order to further improve the adhesive properties.

  Also known is a method of forming a metal layer or alloy layer of tin, chromium, copper, iron, cobalt, zinc, nickel or the like on a smooth copper foil surface that has not been roughened.

  Since polyimide is often used for the insulating substrate to be bonded to the copper foil, a method of coating the copper foil surface with chromium having high adhesive strength with polyimide is common. This is performed by wet processing (chromate processing) or dry processing (sputtering or the like).

  A method of coating a copper foil surface with a metal other than chromium is also known. Patent Document 1 describes a method of coating nickel or titanium by physical vapor deposition. Patent Document 2 describes a method of coating a copper foil surface with a titanium alkoxide or a titanium coupling agent.

JP 2008-297569 A JP 2006-245303 A

  In the various prior arts described above, from the viewpoint of fine pitch circuit formation, a method for improving adhesiveness by roughening treatment is disadvantageous. That is, when the conductor interval is narrowed by fine pitch, the roughened portion may remain on the insulating substrate after the circuit is formed by etching, which may cause insulation deterioration. In order to prevent this, if an attempt is made to etch the entire roughened surface, a long etching time is required, and a predetermined wiring width cannot be maintained.

  From the viewpoint of adhesive strength, the method of laminating polyimide on the smooth copper foil surface is disadvantageous compared to the method of laminating polyimide on the roughened surface. This is because the anchoring effect is obtained by the anchor effect on the roughened surface, but the anchor effect is not obtained when the roughening treatment is not performed, and further, the Cu atoms diffuse into the polyimide, and the vicinity of the interface. This is because the polyimide layer becomes brittle and the part becomes a starting point of peeling.

  Further, the surface treatment using chromium having good adhesive strength with polyimide has a large environmental load because chromium is eluted into the etching solution during circuit formation.

  In addition, the method of providing a Ti layer by dry processing can obtain a relatively high adhesive strength at room temperature. It diffuses and penetrates into the polyimide layer, and the adhesive strength deteriorates. On the other hand, if the Ti layer is thick enough to prevent diffusion of Cu atoms, the etching property of the surface treatment layer is poor. This is a phenomenon called “etching residue” in which Ti remains on the insulating substrate after performing an etching process for forming a circuit pattern.

  In addition, since the surface treatment layer described in Patent Document 2 does not have sufficient coverage of Ti that functions as an adhesive component with polyimide, the adhesive strength with polyimide can be obtained simply by coating with titanium alkoxide or a titanium coupling agent. Not enough.

  Therefore, an object of the present invention is to provide a copper foil for a printed wiring board that has a low environmental load, is excellent in both adhesiveness and etching with an insulating substrate, and is suitable for fine pitch.

  Conventionally, it was generally understood that the adhesive strength decreases when the coating layer is thinned. However, as a result of intensive studies, the present inventors have been able to obtain excellent adhesion to an insulating substrate when the Ti layer is uniformly provided with an ultrathin thickness on the order of nanometers. By making the thickness extremely thin, the amount of Ti having low etching property is reduced, and the coating layer is uniform, which is advantageous for etching property. Further, by providing a layer for preventing the diffusion of Cu atoms directly under the Ti, it is possible to provide a copper-clad laminate that can withstand harsh usage environments.

The present invention completed on the basis of the above knowledge is, in one aspect, a copper foil for a printed wiring board provided with a copper foil substrate and a coating layer covering at least a part of the surface of the copper foil substrate, The coating layer is composed of an intermediate layer made of a simple metal or an alloy and a Ti layer laminated in order from the surface of the copper foil base material, and Ti is present in a coating amount of 15 to 100 μg / dm ^{2 in} the coating layer, The atomic concentration (%) of titanium metal in the depth direction (x: unit nm) obtained from the depth direction analysis by XPS is f ₁ (x), and the atomic concentration (%) of titanium oxide is f ₂ (x), the atomic concentration (%) of total titanium as f (x) (f (x) = f ₁ (x) + f ₂ (x)), and the atomic concentration (%) of nickel as g (x ), The atomic concentration (%) of copper is h (x), the atomic concentration (%) of oxygen is i (x), the atomic concentration (%) of carbon is j (x), and other metal atoms Total concentration If (x), in the interval [0, 1.0], ∫h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 10% or less, ∫f ₂ (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 15% or more, and in the interval [1.0, 2.5], 0.1 ≦ ∫f ₁ (x ) dx / ∫f ₂ (x) Copper foil for printed wiring board satisfying dx ≦ 2.5.

In one embodiment of the copper foil for printed wiring board according to the present invention, Ti is present at a coating amount of ²⁰ to 70 μg / dm ² .

In another embodiment of the copper foil for printed wiring boards according to the present invention, Ti is present in a covering amount of 25 to 60 μg / dm ² .

  In still another embodiment of the copper foil for printed wiring board according to the present invention, the intermediate layer contains at least one of Ni, Mo, Zn, Co, V, Sn, Mn, and Cr.

In yet another embodiment of the copper foil for printed wiring board according to the present invention, the coating layer is composed of any one of Ni, Mo, Zn, and Co laminated in order from the copper foil base material surface. The intermediate layer is composed of a Ti layer, and any one of Ni, Mo, Zn and Co is present in the intermediate layer in a coating amount of 15 to 1030 μg / dm ² .

In still another embodiment of the copper foil for printed wiring board according to the present invention, the intermediate layer has Ni of 15 to 440 μg / dm ² , Mo of 25 to 1030 μg / dm ² , and Zn of 15 to 750 μg / dm ^2. Or Co is present at a coverage of 25-1030 μg / dm ² .

In yet another embodiment of the copper foil for printed wiring board according to the present invention, the coating layer is at least one of Ni, Zn, V, Sn, Cr, Mn, and Cu laminated in order from the copper foil base material surface. Or an intermediate layer composed of two kinds of alloys, and a Ti layer. In the intermediate layer, any one of Ni, Zn, V, Sn, Cr and Mn is 20 to 1700 μg / dm ² . Present in coverage.

  In yet another embodiment of the copper foil for printed wiring board according to the present invention, the intermediate layer is composed of Ni and a Ni alloy composed of any one of Zn, V, Sn, Mn, and Cr. Yes.

In yet another embodiment of the copper foil for printed wiring board according to the present invention, the intermediate layer comprises a Ni—Zn alloy comprising Ni having a coating amount of 15 to 1000 μg / dm ² and Zn having a coating amount of 5 to 750 μg / dm ^2. , Ni-V alloy total coverage consists of Ni and ^{V 20~600μg / dm 2, Ni-} Sn alloy total coverage consists of Ni and Sn in 18~450μg / dm ^2, the amount of coating 20～440Myug / Ni-Mn alloy composed of Ni and 5~200μg / dm ² of Mn dm ^2, is composed of a Ni-Cr alloy coating amount is made of 20~440μg / dm ² of Ni and 5~110μg / dm ² of Cr Yes.

  In yet another embodiment of the copper foil for printed wiring board according to the present invention, the intermediate layer is made of Cu and a Cu alloy composed of any one or two of Zn and Ni.

In yet another embodiment of the copper foil for printed wiring board according to the present invention, the intermediate layer is a Cu—Zn alloy having a Zn coating amount of 15 to 750 μg / dm ² , and a Ni coating amount of 15 to 440 μg / It is composed of a Cu—Ni alloy that is dm ² or a Cu—Ni—Zn alloy that has a Ni coating amount of 15 to 1000 μg / dm ² and a Zn coating amount of 5 to 750 μg / dm ² .

  In yet another embodiment of the copper foil for printed wiring board according to the present invention, the maximum thickness is 0.5 to 12 nm when the cross section of the coating layer is observed with a transmission electron microscope, and the minimum thickness is the maximum thickness. 80% or more.

In yet another embodiment of the copper foil for printed wiring boards according to the present invention, when heat treatment equivalent to polyimide curing is performed, the depth direction (x: unit) obtained from the depth direction analysis from the surface by XPS nm) the atomic concentration (%) of titanium metal is f ₁ (x), the atomic concentration (%) of titanium oxide is f ₂ (x), and the atomic concentration (%) of all titanium is f (x). (F (x) = f ₁ (x) + f ₂ (x)), nickel atomic concentration (%) is g (x), copper atomic concentration (%) is h (x), oxygen atoms If the concentration (%) is i (x), the atomic concentration of carbon (%) is j (x), and the total atomic concentration of other metals is k (x), the interval [0, 1.0] , ∫h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx ) Is less than 10%, ∫f ₂ (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 15% or more, and the interval [1.0, 2.. 5], 0.1 ≦ ∫f ₁ (x) dx / ∫f ₂ (x) dx ≦ 2.5 is satisfied.

In yet another embodiment of the copper foil for printed wiring board according to the present invention, the copper foil for printed wiring board is subjected to a heat treatment equivalent to polyimide curing, and is obtained from a depth direction analysis from the surface by XPS. The atomic concentration (%) of metallic titanium in the depth direction (x: unit nm) is f ₁ (x), the atomic concentration (%) of titanium oxide is f ₂ (x), and the total titanium atomic concentration (%) Is f (x) (f (x) = f ₁ (x) + f ₂ (x)), nickel atomic concentration (%) is g (x), and copper atomic concentration (%) is If h (x), oxygen atomic concentration (%) is i (x), carbon atomic concentration (%) is j (x), and the total atomic concentration of other metals is k (x), In the interval [0, 1.0], ∫h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x ) dx + ∫k (x) dx) is 10% or less, ∫f ₂ (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x ) dx + ∫j (x) dx + ∫k (x) dx) is 15% Thus, in the interval [1.0, 2.5], 0.1 ≦ ∫f ₁ (x) dx / ２．５f ₂ (x) dx ≦ 2.5 is satisfied.

In yet another embodiment of the copper foil for printed wiring board according to the present invention, the copper foil for printed wiring board on which the insulating substrate is formed via the coating layer, after the insulating substrate is peeled from the coating layer When the surface of the coating layer is analyzed, the atomic concentration (%) of metal titanium in the depth direction (x: unit nm) obtained from the depth direction analysis from the surface by XPS is f ₁ (x), and the oxide The atomic concentration (%) of titanium is f ₂ (x), the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ (x) + f ₂ (x)), The atomic concentration (%) is g (x), the copper atomic concentration (%) is h (x), the oxygen atomic concentration (%) is i (x), and the carbon atomic concentration (%) is j ( x), the sum of the atomic concentrations of the other metals is k (x), and the distance from the surface layer where the concentration of titanium metal is maximum is F. In the interval [0, F], 0.1 ≦ ∫f _{1 (x) dx / ∫f 2} (x) dx ≦ 1. ∫h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) satisfies 10% or less.

  In yet another embodiment of the copper foil for printed wiring board according to the present invention, the copper foil base material is a rolled copper foil.

  In another embodiment of the copper foil for printed wiring boards according to the present invention, the printed wiring board is a flexible printed wiring board.

  In another aspect, the present invention is a copper clad laminate comprising the copper foil according to the present invention.

  In one embodiment of the copper clad laminate according to the present invention, the copper foil has a structure bonded to polyimide.

  In yet another aspect, the present invention is a printed wiring board made of the copper clad laminate according to the present invention.

  According to the present invention, it is possible to obtain a copper foil for a printed wiring board which is excellent in both adhesion to an insulating substrate and etching property and suitable for fine pitch.

It is a TEM photograph (cross section) of the copper foil (after film formation) of Example 2. It is a depth profile by XPS of the copper foil of Example 2 (after heat treatment equivalent to polyimide varnish curing).

(Copper foil base material)
Although there is no restriction | limiting in particular in the form of the copper foil base material which can be used for this invention, Typically, it can use with the form of rolled copper foil or electrolytic copper foil. In general, the electrolytic copper foil is produced by electrolytic deposition of copper from a copper sulfate plating bath onto a drum of titanium or stainless steel, and the rolled copper foil is produced by repeating plastic working and heat treatment with a rolling roll. Rolled copper foil is often used for applications that require flexibility.
In addition to high-purity copper such as tough pitch copper and oxygen-free copper, which are usually used as conductor patterns for printed wiring boards, for example, Sn-containing copper, Ag-containing copper, Cr, Zr or Mg are added as the copper foil base material. It is also possible to use a copper alloy such as a copper alloy, a Corson copper alloy to which Ni, Si and the like are added. In addition, when the term “copper foil” is used alone in this specification, a copper alloy foil is also included.

  There is no restriction | limiting in particular also about the thickness of the copper foil base material which can be used for this invention, What is necessary is just to adjust to the thickness suitable for printed wiring boards suitably. For example, it can be set to about 5 to 100 μm. However, for the purpose of forming a fine pattern, it is 30 μm or less, preferably 20 μm or less, and typically about 5 to 20 μm.

  The copper foil substrate used in the present invention is preferably not roughened. Conventionally, the surface roughening treatment is performed by applying irregularities of the order of μm on the surface by special plating, and the adhesion to the resin is given by the physical anchor effect. On the other hand, fine pitch and high frequency electrical characteristics are considered to be smooth foils, and roughened foils work in a disadvantageous direction. Further, since the roughening process is omitted, there is an effect of improving economy and productivity. Therefore, the foil used in the present invention is a foil that is not specially roughened.

(Coating layer)
A coating layer is formed on at least a part of the surface of the copper foil base material. Although there is no restriction | limiting in particular in the location to coat | cover, Generally it is set as the location where adhesion | attachment with an insulated substrate is planned. Adhesion with the insulating substrate is improved by the presence of the coating layer. The coating layer is composed of an intermediate layer and a Ti layer laminated in order from the surface of the copper foil base material. The intermediate layer preferably contains at least one of Ni, Mo, Zn, Co, V, Sn, Mn, and Cr. The intermediate layer may be composed of a single metal, for example, preferably composed of any one of Ni, Mo, Zn, and Co. The intermediate layer may be made of an alloy, for example, preferably made of an alloy of at least any two of Ni, Zn, V, Sn, Cr, Mn, and Cu. The intermediate layer may be made of a Ni alloy composed of Ni and any one of Zn, V, Sn, Mn and Cr, and any one or two of Cu, Zn and Ni. You may be comprised with Cu alloy which consists of. In general, the adhesive force between a copper foil and an insulating substrate tends to decrease when placed in a high temperature environment, which is considered to be caused by thermal diffusion of copper to the surface and reaction with the insulating substrate. In the present invention, the thermal diffusion of copper can be prevented by providing the intermediate layer excellent in preventing copper diffusion in advance on the copper foil base material. Here, among various intermediate layers provided for preventing diffusion of copper, the Cu alloy layer contains copper that is not desired to be diffused to the surface. However, since copper is alloyed, There is no diffusion, good adhesion, and no adverse effect on etching properties.
Moreover, the adhesiveness with an insulated substrate can further be improved by providing on the intermediate | middle layer the Ti layer which was excellent in the adhesiveness with an insulated substrate rather than the said intermediate | middle layer. Since the thickness of the Ti layer can be reduced by virtue of the presence of the intermediate layer, the adverse effect on the etching property can be reduced. In addition, the adhesiveness as used in the field of this invention also refers to adhesiveness (heat resistance) after being placed under high temperature and adhesiveness (humidity resistance) after being placed under high humidity, in addition to normal adhesiveness. .

  In the copper foil for printed wiring boards according to the present invention, the coating layer is extremely thin and has a uniform thickness. The reason why the adhesiveness with the insulating substrate has been improved by such a configuration is not clear, but a Ti single layer coating having excellent adhesiveness with the resin as the outermost surface was formed on the intermediate layer. Thus, it is presumed that the single layer coating structure having high adhesiveness is maintained even after high temperature heat treatment during imidization (about 350 ° C. for about 30 minutes to several hours). Further, it is considered that the etching property is improved by making the coating layer extremely thin and reducing the amount of Ti used as a two-layer structure of the intermediate layer and the Ti layer.

  Specifically, the intermediate layer according to the present invention has the following configuration.

(1) Identification of coating layer In the present invention, at least a part of the surface of the copper foil material is coated in the order of the intermediate layer and the Ti layer. These coating layers can be identified by sputtering argon from the surface layer with a surface analyzer such as XPS or AES, performing chemical analysis in the depth direction, and identifying the intermediate layer and the Ti layer by the presence of each detection peak. Moreover, the order of covering from the position of each detection peak can be confirmed.

(2) Amount of adhesion On the other hand, since these intermediate layer and Ti layer are very thin, it is difficult to evaluate the thickness accurately with XPS and AES. For this reason, in the present invention, the thickness of the intermediate layer and the Ti layer is evaluated by the weight of the coated metal per unit area. In the coating layer according to the present invention, the Ti layer is present at a coating amount of 15 to 100 μg / dm ² . When Ti is less than 15 μg / dm ² , sufficient peel strength cannot be obtained, and when Ti exceeds 100 μg / dm ² , the etching property tends to be significantly reduced. The coating amount of Ti is preferably 20 to 70 μg / dm ² , more preferably 25 to 60 μg / dm ² .
Further, when the intermediate layer is composed of any one of Ni, Mo, Zn, and Co, the intermediate layer includes any one of Ni, Mo, Zn, and Co in the range of 15 to 1030 μg / dm ^2. It is preferable that it exists in the coating amount. At this time, if the coating amount is less than 15 μg / dm ² , sufficient peel strength cannot be obtained, and if it exceeds 1030 μg / dm ² , the etching property tends to decrease significantly. Furthermore, in this case, Ni is 15~440μg / dm ² in the intermediate layer, Mo is 25~1030μg / dm ^2, Zn is 15~750μg / dm ^2, or, Co is at a coverage of 25~1030μg / dm ² More preferably it is present.
Further, when the intermediate layer is composed of at least any two alloys of Ni, Zn, V, Sn, Cr, Mn and Cu, the intermediate layer includes Ni, Zn, V, Sn, Cr and It is preferable that any two kinds of Mn are present at a coating amount of ²⁰ to 1700 μg / dm ² . At this time, if the coating amount is less than 20 μg / dm ² , sufficient peel strength cannot be obtained, and if it exceeds 1700 μg / dm ² , the etching property tends to be significantly lowered.
Further, when the intermediate layer is made of Ni and a Ni alloy composed of any one of Zn, V, Sn, Mn and Cr, the intermediate layer has a coating amount of 15 to 1000 μg / dm ² . Ni and 5~750μg / dm ² of Ni-Zn alloy consisting of Zn, Ni-V alloy total coverage consists of Ni and V 20~600μg / dm ^2, the total coating amount of 18~450μg / dm ² Ni and Ni-Sn alloy comprising Sn, coverages 20~440μg / dm ² of Ni and 5~200μg / dm Ni-Mn alloy composed of ² of Mn, coverages Ni and 5 of 20~440μg / dm ² It is preferably made of a Ni—Cr alloy made of 110 μg / dm ² of Cr.
Further, when the intermediate layer is composed of Cu and a Cu alloy composed of any one or two of Zn and Ni, the intermediate layer has a Zn coating amount of 15 to 750 μg / dm ² . Cu—Zn alloy, Cu—Ni alloy with Ni coating amount of 15 to 440 μg / dm ² , or Cu—Ni with Ni coating amount of 15 to 1000 μg / dm ² and Zn coating amount of 5 to 750 μg / dm ² It is preferably composed of a Zn alloy.

(3) Observation with a transmission electron microscope (TEM) When the cross section of the coating layer according to the present invention is observed with a transmission electron microscope, the maximum thickness is 0.5 nm to 12 nm, preferably 1.0 to 2.5 nm. The coating layer has a minimum thickness of 80% or more, preferably 85% or more of the maximum thickness, and very little variation. This is because when the coating layer thickness is less than 0.5 nm, the peel strength is greatly deteriorated in the heat resistance test and the moisture resistance test, and when the thickness exceeds 12 nm, the etching property decreases. When the minimum value of the thickness is 80% or more of the maximum value, the thickness of the coating layer is very stable and hardly changes after the heat test. In the TEM observation, it is difficult to find a clear boundary between the intermediate layer and the Ti layer in the coating layer, and it looks like a single layer (see FIG. 1). According to the study results of the present inventors, the coating layer found by TEM observation is considered to be a layer mainly composed of Ti, and the intermediate layer is considered to exist on the copper foil base material side. Therefore, in the present invention, the thickness of the coating layer when observed by TEM is defined as the thickness of the coating layer that looks like a single layer. However, although there may be a part where the boundary of the coating layer is unclear depending on the observation part, such a part is excluded from the thickness measurement part.

  Since the structure of the present invention suppresses the diffusion of Cu, it is considered to have a stable thickness. The copper foil of the present invention adheres to the polyimide film, and even after the resin is peeled off after undergoing a heat resistance test (standing at 168 hours in a high temperature environment at 150 ° C. in an air atmosphere), the thickness of the coating layer is almost the same. Without change, the maximum thickness is 0.5-12 nm, and it is possible to maintain 80% of the maximum thickness even at the minimum thickness.

(4) Oxidation state of coating layer surface First, in order to increase the adhesive strength, it is desirable that the inner copper is not diffused on the outermost surface of the coating layer (in the range of 0 to 1.0 nm from the surface). Therefore, in the copper foil for printed wiring boards according to the present invention, the atomic concentration (%) of metal titanium in the depth direction (x: unit nm) obtained from the depth direction analysis from the surface by XPS is expressed as f ₁ (x ), The atomic concentration (%) of titanium oxide is f ₂ (x), and the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ (x) + f ₂ (x )), The atomic concentration (%) of nickel is g (x), the atomic concentration (%) of copper is h (x), the atomic concentration (%) of oxygen is i (x), and the atomic concentration of carbon ( %) J (x) and the total atomic concentration of other metals is k (x), in the interval [0, 1.0], ∫h (x) dx / (に お い て f (x) dx + It is preferable that ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 10% or less.

In addition, when heat treatment equivalent to polyimide curing was performed, the atomic concentration (%) of metallic titanium in the depth direction (x: unit nm) obtained from the depth direction analysis from the surface by XPS was defined as f ₁ (x). The atomic concentration (%) of titanium oxide is f ₂ (x), and the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ (x) + f ₂ (x)) The atomic concentration (%) of nickel is g (x), the atomic concentration (%) of copper is h (x), the atomic concentration (%) of oxygen is i (x), and the atomic concentration of carbon (%) Is j (x), and the total atomic concentration of other metals is k (x), 区間 h (x) dx / (∫f (x) dx + ∫g in the interval [0, 1.0] (x) dx +) h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is preferably 10% or less.

In addition, when analyzing the surface of the coating layer after peeling the insulating substrate from the coating layer on the copper foil for a printed wiring board on which the insulating substrate is formed via the coating layer, depth direction analysis from the surface by XPS The atomic concentration (%) of metallic titanium in the depth direction (x: unit nm) obtained from the above is defined as f ₁ (x), and the atomic concentration (%) of titanium oxide is defined as f ₂ (x). The atomic concentration (%) is f (x) (f (x) = f ₁ (x) + f ₂ (x)), the atomic concentration (%) of nickel is g (x), and the atomic concentration of copper (% ) Is h (x), oxygen atomic concentration (%) is i (x), carbon atomic concentration (%) is j (x), and the total atomic concentration of other metals is k (x). If the distance from the surface layer where the concentration of titanium metal is maximum is F, in the interval [0, F], ∫h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx +) i (x) dx + ∫j (x) dx + ∫k (x) dx) is preferably 10% or less.

In addition, on the outermost surface of the coating layer, both titanium and titanium oxide are present. However, although titanium is more desirable from the viewpoint of preventing the diffusion of copper inside and ensuring adhesive strength, Titanium oxide is desirable for obtaining a good etching property. Therefore, in order to achieve both etching properties and adhesive strength, the atomic concentration (%) of metal titanium in the depth direction (x: unit nm) obtained from the depth direction analysis from the surface by XPS is expressed as f ₁ (x ), The atomic concentration (%) of titanium oxide is f ₂ (x), and the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ (x) + f ₂ (x )), The atomic concentration (%) of nickel is g (x), the atomic concentration (%) of copper is h (x), the atomic concentration (%) of oxygen is i (x), and the atomic concentration of carbon ( %) J (x) and the total atomic concentration of other metals is k (x), in the interval [0, 1.0], ∫f ₂ (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + dj (x) dx + ∫k (x) dx) is 15% or more, and the interval [1.0, 2. 5], it is preferable that 0.1 ≦ ∫f ₁ (x) dx / ∫f ₂ (x) dx ≦ 2.5 is satisfied.

In addition, when heat treatment equivalent to polyimide curing was performed, the atomic concentration (%) of metallic titanium in the depth direction (x: unit nm) obtained from the depth direction analysis from the surface by XPS was defined as f ₁ (x). The atomic concentration (%) of titanium oxide is f ₂ (x), and the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ (x) + f ₂ (x)) The atomic concentration (%) of nickel is g (x), the atomic concentration (%) of copper is h (x), the atomic concentration (%) of oxygen is i (x), and the atomic concentration of carbon (%) Is j (x), and the total atomic concentration of other metals is k (x), 区間 f ₂ (x) dx / (∫f (x) dx + ∫ in the interval [0, 1.0] g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 15% or more and interval [1.0, 2.5] In this case, it is preferable that 0.1 ≦ ∫f ₁ (x) dx / ∫f ₂ (x) dx ≦ 2.5 is satisfied.

Moreover, it is the copper foil for printed wiring boards by which the heat processing equivalent to a polyimide hardening was performed, Comprising: The atomic concentration (x: unit nm) of titanium metal obtained from the depth direction analysis from the surface by XPS ( %) Is f ₁ (x), the atomic concentration (%) of titanium oxide is f ₂ (x), and the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ ( x) + f ₂ (x)), the atomic concentration (%) of nickel is g (x), the atomic concentration (%) of copper is h (x), and the atomic concentration (%) of oxygen is i (x) Where the atomic concentration (%) of carbon is j (x), and the total atomic concentration of other metals is k (x), in the interval [0, 1.0], ∫f ₂ (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) In [1.0, 2.5], it is desirable to satisfy 0.1 ≦ ∫f ₁ (x) dx / ∫f ₂ (x) dx ≦ 2.5.

The titanium concentration and the oxygen concentration are respectively calculated from the peak intensities of the Ti2p orbit and O1s orbit obtained from the depth direction analysis from the surface by XPS. The distance in the depth direction (x: unit nm) is a distance calculated from the sputtering rate in terms of SiO ₂ . The titanium concentration is the total value of the oxide titanium concentration and the metal titanium concentration, and can be analyzed by separating the titanium oxide concentration and the metal titanium concentration.

(Method for producing copper foil according to the present invention)
The copper foil for printed wiring boards according to the present invention can be formed by a sputtering method. That is, an intermediate layer having a thickness of 0.25 to 5.0 nm, preferably 0.3 to 4.0 nm, more preferably 0.5 to 3.0 nm is formed on at least a part of the copper foil base material surface by sputtering. It can be manufactured by sequentially coating with a Cr layer having a thickness of 0.25 to 2.5 nm, preferably 0.4 to 2.0 nm, more preferably 0.5 to 1.0 nm. When such an extremely thin film is laminated by electroplating, the thickness varies, and the peel strength tends to decrease after the heat and humidity resistance test.
The thickness here is not the thickness determined by the XPS or TEM described above, but the thickness derived from the film formation rate of sputtering. The deposition rate under a certain sputtering condition can be measured from the relationship between the sputtering time and the sputtering thickness by performing sputtering of 0.1 μm (100 nm) or more. Once the deposition rate under the sputtering conditions can be measured, the sputtering time is set according to the desired thickness. Sputtering may be performed continuously or batchwise, and the coating layer can be uniformly laminated with a thickness as defined in the present invention. Examples of the sputtering method include a direct current magnetron sputtering method.

(Manufacture of printed wiring boards)
A printed wiring board (PWB) can be manufactured according to a conventional method using the copper foil according to the present invention. Below, the example of manufacture of a printed wiring board is shown.

  First, a copper-clad laminate is manufactured by bonding a copper foil and an insulating substrate. The insulating substrate on which the copper foil is laminated is not particularly limited as long as it has characteristics applicable to a printed wiring board. For example, paper base phenolic resin, paper base epoxy resin, synthetic fiber for rigid PWB Use cloth base epoxy resin, glass cloth / paper composite base epoxy resin, glass cloth / glass non-woven composite base epoxy resin, glass cloth base epoxy resin, etc., use polyester film, polyimide film, etc. for FPC I can do things.

  In the case of the rigid PWB, a prepreg is prepared by impregnating a base material such as a glass cloth with a resin and curing the resin to a semi-cured state. It can be carried out by superposing and heating and pressing the surfaces having the prepreg and the copper foil coating layer.

  In the case of a flexible printed wiring board (FPC), a surface having a polyimide film or polyester film and a copper foil coating layer can be bonded using an epoxy or acrylic adhesive (three-layer structure). In addition, as a method without using an adhesive (two-layer structure), a polyimide varnish (polyamic acid varnish), which is a polyimide precursor, is applied to a surface having a coating layer of copper foil, and imidized by heating. And a lamination method in which a thermoplastic polyimide is applied on a polyimide film, a surface having a copper foil coating layer is superimposed thereon, and heated and pressed. In the casting method, it is also effective to apply an anchor coating material such as thermoplastic polyimide in advance before applying the polyimide varnish.

  The effect of the copper foil according to the present invention is prominent when an FPC is produced by adopting a casting method. That is, when the copper foil and the resin are to be bonded without using an adhesive, the copper foil is particularly required to adhere to the resin, but the copper foil according to the present invention is bonded to the resin, particularly to the polyimide. It can be said that it is suitable for the production of a copper clad laminate by a casting method.

  The copper-clad laminate according to the present invention can be used for various printed wiring boards (PWB) and is not particularly limited. For example, from the viewpoint of the number of layers of the conductor pattern, single-sided PWB, double-sided PWB, multilayer It can be applied to PWB (3 layers or more), and can be applied to rigid PWB, flexible PWB (FPC), and rigid flex PWB from the viewpoint of the type of insulating substrate material.

  The process for producing a printed wiring board from a copper clad laminate may be performed by a method well known to those skilled in the art. For example, an etching resist is applied only to a necessary portion as a conductor pattern on the copper foil surface of the copper clad laminate, and an etching solution By spraying on the copper foil surface, the unnecessary copper foil can be removed to form a conductor pattern, and then the etching resist can be peeled and removed to expose the conductor pattern.

  EXAMPLES Examples of the present invention will be described below, but these are provided for better understanding of the present invention and are not intended to limit the present invention.

(Example 1: Examples 1 to 40)
As copper foil base materials of Examples 1 to 5 and 7 to 40, a rolled copper foil (C1100 made by Nikko Metal) having a thickness of 18 μm was prepared. The surface roughness (Rz) of the rolled copper foil was 0.7 μm. In addition, as a copper foil base material of Example 6, a non-roughened electrolytic copper foil having a thickness of 18 μm was prepared. The surface roughness (Rz) of the electrolytic copper foil was 1.5 μm.

  Various simple substances (a to e) used for sputtering were those having a purity of 3N. Further, various alloys (f to k) were produced by the following procedure. First, an element having the composition shown in Table 1 (alloy component [mass%] of the sputtering target) is added to electrolytic copper or nickel, and an ingot is cast in a high-frequency melting furnace, and hot rolling is performed at 600 to 900 ° C. gave. Furthermore, after homogenizing annealing at 500-850 degreeC for 3 hours, the surface oxide layer was removed and it used as a sputtering target.

On the one side of this copper foil, the thin oxide film adhering to the copper foil base material surface in advance under the following conditions is removed by reverse sputtering, and the intermediate layer is formed by sputtering a to k and Ti single layer targets. And Ti layer was formed in order. The thickness of the coating layer was changed by adjusting the film formation time.
-Equipment: Batch type sputtering equipment (ULVAC, Model MNS-6000)
・ Achieving vacuum: 1.0 × 10 ⁻⁵ Pa
・ Sputtering pressure: 0.2 Pa
・ Reverse sputtering power: 100W
·target:
Intermediate layer = a to k
For Ti layer = Ti (purity 3N)
・ Sputtering power: 50W
Film formation rate: About 0.2 μm of film was formed for each target for a fixed time, the thickness was measured with a three-dimensional measuring device, and the sputtering rate per unit time was calculated.

A polyimide film was bonded to the copper foil provided with the coating layer by the following procedure.
(1) Using an applicator on a copper foil of 7 cm × 7 cm, Ube Industries-made U varnish-A (polyimide varnish) was applied to a dry body to a thickness of 25 μm.
(2) The resin-coated copper foil obtained in (1) is dried at 130 ° C. for 30 minutes in an air dryer.
(3) Imidization at 350 ° C. for 30 minutes in a high-temperature heating furnace with a nitrogen flow rate set to 10 L / min.

  In addition to the polyimide film adhesion test, as a “heat resistance test”, the polyimide film was not bonded to the copper foil provided with the coating layer, and was heated as it was at 350 ° C. for 2 hours in a nitrogen atmosphere.

<Measurement of adhesion amount>
A film on the surface of a copper foil of 50 mm × 50 mm is dissolved in a mixed solution of HNO ₃ (2% by weight) and HCl (5% by weight), and the metal concentration in the solution is measured by an ICP emission spectrometer (SII Nanotechnology). The amount of metal per unit area (μg / dm ² ) was calculated by quantitative determination using SFC-3100). Note that, in the present invention, when Cu alloy is used as a target, the adhesion amount of Cu and other metals is the analysis value when a film is formed on a Ti foil under the same conditions.

<Measurement by XPS>
The operating conditions of XPS when creating the depth profile of the coating layer are shown below.
・ Device: XPS measuring device (ULVAC-PHI, Model 5600MC)
・ Achieving vacuum: 3.8 × 10 ⁻⁷ Pa
X-ray: Monochromatic AlKα or non-monochromatic MgKα, X-ray output 300 W, detection area 800 μmφ, angle between sample and detector 45 °
Ion beam: ion species Ar ⁺ , acceleration voltage 3 kV, sweep area 3 mm × 3 mm, sputtering rate 2.0 nm / min (SiO ₂ conversion)
In the XPS measurement results, separation of titanium oxide and titanium metal was performed using analysis software Multi Pak V7.3.1 manufactured by ULVAC.
-The film | membrane which gave the thermal history (350 degreeC x 120 minutes) of severer conditions than the polyimide hardening conditions (350 degreeC x 30 minutes) at the time of adhesive strength measurement was analyzed.

<Measurement by TEM>
The measurement conditions of TEM when the coating layer is observed by TEM are shown below. The thicknesses shown in the table below are the thicknesses of the entire coating layer reflected in the observation visual field, and the maximum and minimum values of the thickness between 50 nm are measured for one visual field. The maximum value and the minimum value were determined, and the maximum value and the ratio of the minimum value to the maximum value were determined as percentages. In addition, the TEM observation result “after the heat resistance test” in the table means that after the polyimide film is adhered on the coating layer of the test piece by the above procedure, the test piece is placed in the following high-temperature environment, and the test obtained It is a TEM image after peeling a polyimide film from a piece according to 90 degree peeling method (JIS C6471 8.1). In FIG. 1, the observation photograph after film-forming by TEM of Example 2 is shown illustratively. The intermediate layer cannot be confirmed from FIG. This is because the corresponding part is a copper alloy layer and cannot be distinguished from the copper foil of the base material. It is presumed that the Ti layer is confirmed in FIG. In the present invention, the thickness of only the layer whose boundary with the base material is clear was measured.
-Equipment: TEM (Hitachi, Ltd., model H9000NAR)
・ Acceleration voltage: 300 kV
-Magnification: 300,000 times-Observation field: 60 nm x 60 nm

<Adhesion evaluation>
For the copper foil laminated with polyimide as described above, the peel strength was immediately after lamination (normal state), after being left in a high-temperature environment at a temperature of 150 ° C. in an air atmosphere for 168 hours (heat resistance), and at a temperature of 40 ° C. relative The measurement was performed under three conditions: after being allowed to stand for 96 hours in a high humidity environment with a humidity of 95% air (humidity resistance). The peel strength was measured according to the 90 ° peeling method (JIS C 6471 8.1).

<Etching evaluation>
A white tape was applied to the coating layer of the copper foil produced as described above, and immersed for 7 minutes in an etching solution (copper chloride dihydrate, ammonium chloride, ammonia water, solution temperature 50 ° C.). Then, the metal component of the etching residue adhering to the tape was quantified with an ICP emission spectroscopic analyzer and evaluated according to the following criteria.
×: etching residue is 95μg / dm ² or more △: etching residues 45 [mu] g / dm ² or more 95μg / dm ² less ○: less than etching residues 45 [mu] g / dm ²

(Example 2: Comparative Examples 1 to 28)
The sputtering time was changed on one side of the rolled copper foil base material used in Example 1 to form a film having the thickness shown in the table below. A polyimide film was bonded to the copper foil provided with the coating layer by the same procedure as in Example 1.

  Each measurement result of Examples 1 and 2 is shown in Tables 2-7.

Examples 1-2, 5-30, and 32-40 all have good peel strength and etching properties. In Examples 3, 4, and 31, the etching properties were slightly inferior to those in the previous examples, but the peel strength was good.
FIG. 2 shows the XPS depth profile of the copper foil of Example 2 (after heat treatment equivalent to polyimide varnish curing). In the Ti layer, an oxide Ti layer is present on the surface layer, and a metal Ti layer is present immediately below the oxide Ti layer. Since the distances from the surface layer where the concentrations of the oxide Ti and the metal Ti are maximum are different from each other, it can be said that they are separated into two layers. Within the range of 1 nm from the surface layer, unlike the electroplating, the atomic concentration ratio of the oxide Ti exceeded 15%. In other examples, the atomic concentration ratio of the oxide Ti exceeded 15% in the vicinity of the surface layer. In any of the examples, no diffusion of Cu atoms was observed up to the surface layer. This is presumed to be an effect of providing an intermediate layer for preventing diffusion of Cu atoms directly under the Ti layer.

In Comparative Example 1, the coating amount of Ti was less than 15 μg / dm ² and the peel strength was poor.
In Comparative Example 2, the coating amount of Ti was more than 100 μg / dm ² and the etching property was poor.
In Comparative Examples 3 to 26, the coating amount of Ti was in the range of 15 to 100 μg / dm ² , but various peel strengths or etching properties were poor due to the coating amounts of various elements used in the intermediate layer. Met.
In Comparative Example 27, heat resistance and moisture resistance peel strength were poor. This is presumably because Cu atoms diffused to the bonding interface due to the thermal history because no intermediate layer preventing Cu diffusion was provided.
In Comparative Example 28, an intermediate layer was not provided, but since the coating amount of Ti was 110 μg / dm ² , various peel strengths were good, but etching properties were poor.

Claims (20)

A copper foil for a printed wiring board comprising a copper foil substrate and a coating layer covering at least a part of the surface of the copper foil substrate,
The coating layer is composed of an intermediate layer and a Ti layer made of a single metal or an alloy laminated in order from the surface of the copper foil base material,
In the coating layer, Ti is present at a coating amount of 15 to 100 μg / dm ² ,
The atomic concentration (%) of titanium metal in the depth direction (x: unit nm) obtained from the depth direction analysis by XPS is f ₁ (x), and the atomic concentration (%) of titanium oxide is f ₂ (x), the atomic concentration (%) of total titanium as f (x) (f (x) = f ₁ (x) + f ₂ (x)), and the atomic concentration (%) of nickel as g (x ), The atomic concentration (%) of copper is h (x), the atomic concentration (%) of oxygen is i (x), the atomic concentration (%) of carbon is j (x), and other metal atoms Assuming that the total concentration is k (x), in the interval [0, 1.0], ∫h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 10% or less, ∫f ₂ (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + + j (x) dx + ∫k (x) dx) is 15% or more, and in the interval [1.0, 2.5], 0.1 ≦ Copper foil for printed wiring board satisfying ∫f ₁ (x) dx / ∫f ₂ (x) dx ≦ 2.5. The copper foil for printed wiring boards according to claim 1, wherein Ti is present at a coating amount of ²⁰ to 70 μg / dm ² . The copper foil for printed wiring boards according to claim ² , wherein Ti is present at a coating amount of 25 to 60 μg / dm ² .   The copper foil for printed wiring boards according to any one of claims 1 to 3, wherein the intermediate layer contains at least one of Ni, Mo, Zn, Co, V, Sn, Mn, and Cr. The coating layer is composed of an intermediate layer composed of any one of Ni, Mo, Zn, and Co, and a Ti layer, which are sequentially laminated from the surface of the copper foil base material. Copper foil for printed wiring boards according to any one of claims 1 to 4, wherein any one of Zn, Co, and Co is present at a coating amount of 15 to 1030 µg / dm ² . Claim the intermediate layer, Ni is 15~440μg / dm ^2, Mo is 25~1030μg / dm ^2, Zn is 15~750μg / dm ^2, or, where Co is present at a coverage of 25~1030μg / dm ² 5. Copper foil for printed wiring boards according to 5. The coating layer is composed of an intermediate layer composed of at least any two alloys of Ni, Zn, V, Sn, Cr, Mn, and Cu, and a Ti layer, which are sequentially laminated from the surface of the copper foil base material. The copper foil for printed wiring boards according to claim 4, wherein any one of Ni, Zn, V, Sn, Cr and Mn is present in the intermediate layer at a coating amount of ²⁰ to 1700 µg / dm ² .   The copper foil for printed wiring boards according to claim 7, wherein the intermediate layer is made of Ni and an Ni alloy composed of any one of Zn, V, Sn, Mn, and Cr. The intermediate layer, the coating amount of Ni-Zn alloy consisting of Ni of 15~1000μg / dm ² and 5~750μg / dm ² of Zn, the total coating amount is from Ni and V 20~600μg / dm ² Ni-V alloy, the total coating weight of Ni-Sn alloy of Ni and Sn in 18~450μg / dm ^2, Ni-Mn alloy coating amount is made of Ni and 5~200μg / dm ² of Mn 20~440μg / dm ^2, The copper foil for printed wiring boards of Claim 8 comprised with the Ni-Cr alloy which the coating amount consists of 20-440 microgram / dm < ² > Ni and 5-110 microgram / dm < ² > Cr.   The copper foil for printed wiring boards according to claim 7, wherein the intermediate layer is composed of Cu and a Cu alloy made of any one or two of Zn and Ni. The intermediate layer is a Cu—Zn alloy with a Zn coating amount of 15 to 750 μg / dm ² , a Ni coating amount of 15 to 440 μg / dm ² , or a Ni coating amount of 15 to 1000 μg / dm 2. ^The copper foil for printed wiring boards of Claim 10 comprised with the Cu-Ni-Zn alloy whose ² and Zn coating amount are 5-750 microgram / dm < ² >.   The printed wiring according to claim 1, wherein when the cross section of the coating layer is observed with a transmission electron microscope, the maximum thickness is 0.5 to 12 nm, and the minimum thickness is 80% or more of the maximum thickness. Copper foil for plates. When heat treatment equivalent to polyimide curing is performed, the atomic concentration (%) of titanium metal in the depth direction (x: unit nm) obtained from the depth direction analysis from the surface by XPS is f ₁ (x), and oxidation The atomic concentration (%) of titanium is f ₂ (x), the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ (x) + f ₂ (x)), nickel G (x) is the atomic concentration (%) of copper, h (x) is the atomic concentration (%) of copper, i (x) is the atomic concentration (%) of oxygen, and j is the atomic concentration (%) of carbon. In the interval [0, 1.0], ∫h (x) dx / (∫f (x) dx + ∫g (x ) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 10% or less, and ∫f ₂ (x) dx / (∫f (x ) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 15% or more, and the interval [1.0, in 2.5], claim 1 that satisfies _{0.1 ≦ ∫f 1 (x) dx} / ∫f 2 (x) dx ≦ 2.5 Copper foil for printed wiring boards according to any one of 12. Copper foil for printed wiring board that has undergone a heat treatment equivalent to polyimide curing, and the atomic concentration (%) of titanium metal in the depth direction (x: unit nm) obtained from the depth direction analysis from the surface by XPS Is f ₁ (x), the atomic concentration (%) of titanium oxide is f ₂ (x), and the atomic concentration (%) of all titanium is f (x) (f (x) = f ₁ (x) + f ₂ (x)), nickel atomic concentration (%) as g (x), copper atomic concentration (%) as h (x), oxygen atomic concentration (%) as i (x), Assuming that the atomic concentration (%) of carbon is j (x) and the total atomic concentration of other metals is k (x), in the interval [0, 1.0], に お い て h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 10% or less, and ∫f ₂ ( x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) is 15% Thus, in the interval [1.0, 2.5], 0.1 ≦ ∫f ₁ (x) dx / ∫f ₂ (x) d The copper foil for printed wiring boards according to claim 1, wherein x ≦ 2.5 is satisfied. When analyzing the surface of the coating layer after peeling the insulating substrate from the coating layer on the copper foil for a printed wiring board on which the insulating substrate was formed via the coating layer, it was obtained from the depth direction analysis from the surface by XPS. The atomic concentration (%) of metallic titanium in the depth direction (x: unit nm) is f ₁ (x), the atomic concentration (%) of titanium oxide is f ₂ (x), and the total titanium atomic concentration (%) Is f (x) (f (x) = f ₁ (x) + f ₂ (x)), nickel atomic concentration (%) is g (x), and copper atomic concentration (%) is h (x), oxygen atomic concentration (%) is i (x), carbon atomic concentration (%) is j (x), and the total atomic concentration of other metals is k (x). Assuming that the distance from the surface layer where the concentration of titanium is maximum is F, in the interval [0, F], 0.1 ≦ ∫f ₁ (x) dx / ∫f ₂ (x) dx ≦ 1.0, h (x) dx / (∫f (x) dx + ∫g (x) dx + ∫h (x) dx + ∫i (x) dx + ∫j (x) dx + ∫k (x) dx) Copper foil for printed wiring boards according to any one of claims 1 to 14, satisfying 0% or less.   A copper foil base material is a rolled copper foil, The copper foil for printed wiring boards in any one of Claims 1-15.   A printed wiring board is a flexible printed wiring board, Copper foil for printed wiring boards in any one of Claims 1-16.   The copper clad laminated board provided with the copper foil in any one of Claims 1-17.   The copper clad laminate according to claim 18, wherein the copper foil has a structure bonded to polyimide.   A printed wiring board made of the copper-clad laminate according to claim 18.