PH12015501137B1 - Copper plating bath composition - Google Patents
Copper plating bath compositionInfo
- Publication number
- PH12015501137B1 PH12015501137B1 PH12015501137A PH12015501137A PH12015501137B1 PH 12015501137 B1 PH12015501137 B1 PH 12015501137B1 PH 12015501137 A PH12015501137 A PH 12015501137A PH 12015501137 A PH12015501137 A PH 12015501137A PH 12015501137 B1 PH12015501137 B1 PH 12015501137B1
- Authority
- PH
- Philippines
- Prior art keywords
- plating bath
- copper
- copper plating
- bath composition
- present
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
- H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
- H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
- H10W20/0261—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the filling method or the material of the conductive fill
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12194261.9A EP2735627A1 (en) | 2012-11-26 | 2012-11-26 | Copper plating bath composition |
| PCT/EP2013/073629 WO2014079737A2 (en) | 2012-11-26 | 2013-11-12 | Copper plating bath composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PH12015501137A1 PH12015501137A1 (en) | 2015-08-03 |
| PH12015501137B1 true PH12015501137B1 (en) | 2015-08-03 |
Family
ID=47226032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12015501137A PH12015501137B1 (en) | 2012-11-26 | 2015-05-21 | Copper plating bath composition |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9551080B2 (https=) |
| EP (2) | EP2735627A1 (https=) |
| JP (1) | JP6279598B2 (https=) |
| KR (1) | KR102193485B1 (https=) |
| CN (1) | CN104854265B (https=) |
| PH (1) | PH12015501137B1 (https=) |
| TW (1) | TWI600802B (https=) |
| WO (1) | WO2014079737A2 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2865787A1 (en) * | 2013-10-22 | 2015-04-29 | ATOTECH Deutschland GmbH | Copper electroplating method |
| EP3034650B1 (en) * | 2014-12-16 | 2017-06-21 | ATOTECH Deutschland GmbH | Plating bath compositions for electroless plating of metals and metal alloys |
| EP3286358B1 (en) * | 2015-04-20 | 2019-03-20 | ATOTECH Deutschland GmbH | Electrolytic copper plating bath compositions and a method for their use |
| KR102457077B1 (ko) | 2015-08-31 | 2022-10-19 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 수성 구리 도금 조 및 구리 또는 구리 합금을 기판 상에 침착시키는 방법 |
| EP3135709B1 (en) | 2015-08-31 | 2018-01-10 | ATOTECH Deutschland GmbH | Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions |
| ES2681836T3 (es) | 2015-09-10 | 2018-09-17 | Atotech Deutschland Gmbh | Composición de baño para chapado de cobre |
| CN109072438B (zh) | 2016-05-04 | 2021-08-13 | 德国艾托特克公司 | 沉积金属或金属合金到衬底表面及包括衬底表面活化的方法 |
| KR102381803B1 (ko) | 2016-08-15 | 2022-04-01 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 전해 구리 도금용 산성 수성 조성물 |
| EP3360988B1 (en) * | 2017-02-09 | 2019-06-26 | ATOTECH Deutschland GmbH | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths |
| ES2881029T3 (es) | 2018-01-09 | 2021-11-26 | Atotech Deutschland Gmbh | Aditivo de ureileno, su uso y un método para su preparación |
| EP3901331A1 (en) | 2020-04-23 | 2021-10-27 | ATOTECH Deutschland GmbH | Acidic aqueous composition for electrolytically depositing a copper deposit |
| EP3933073B1 (en) * | 2020-06-29 | 2023-11-29 | Atotech Deutschland GmbH & Co. KG | Copper electroplating bath |
| CN112899736A (zh) * | 2021-01-15 | 2021-06-04 | 深圳中科利尔科技有限公司 | 一种pcb高纵横通孔电镀铜添加剂及其制备方法 |
| EP4032930B1 (en) | 2021-01-22 | 2023-08-30 | Atotech Deutschland GmbH & Co. KG | Biuret-based quaternized polymers and their use in metal or metal alloy plating baths |
| EP4063533A1 (en) | 2021-03-25 | 2022-09-28 | Atotech Deutschland GmbH & Co. KG | A process for electrochemical deposition of copper with different current densities |
| KR102339862B1 (ko) * | 2021-07-06 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물 |
| KR102339861B1 (ko) * | 2021-07-26 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 금속박 형성용 전기도금 조성물 |
| KR102339866B1 (ko) * | 2021-08-04 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물 |
| CN118812171A (zh) * | 2023-04-17 | 2024-10-22 | 财团法人工业技术研究院 | 贯穿玻璃的通孔的铜金属化方法和由此制造的玻璃制品 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3012168A1 (de) * | 1980-03-27 | 1981-10-01 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Verfahren zur galvanischen abscheidung von kupferniederschlaegen |
| DE4126502C1 (https=) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| DE4344387C2 (de) | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
| DE19545231A1 (de) | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| US6387229B1 (en) * | 1999-05-07 | 2002-05-14 | Enthone, Inc. | Alloy plating |
| JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| WO2002090623A1 (fr) | 2001-05-09 | 2002-11-14 | Ebara-Udylite Co., Ltd. | Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain |
| CN1410601A (zh) | 2001-09-27 | 2003-04-16 | 长春石油化学股份有限公司 | 用于铜集成电路内连线的铜电镀液组合物 |
| JP4083171B2 (ja) | 2002-12-25 | 2008-04-30 | 日鉱金属株式会社 | 特定骨格を有する四級アミン化合物重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
| CN1806067B (zh) | 2003-07-29 | 2010-06-16 | 日矿金属株式会社 | 含有具有特定骨架的含二烷基氨基的聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔 |
| DE602005022650D1 (de) * | 2004-04-26 | 2010-09-16 | Rohm & Haas Elect Mat | Verbessertes Plattierungsverfahren |
| DE102005060030A1 (de) * | 2005-12-15 | 2007-06-21 | Coventya Gmbh | Quervernetzte Polymere, diese enthaltende Galvanisierungsbäder sowie deren Verwendung |
| EP2292679B1 (de) * | 2009-09-08 | 2020-03-11 | ATOTECH Deutschland GmbH | Polymere mit Aminoendgruppen und deren Verwendung als Additive für galvanische Zink- und Zinklegierungsbäder |
| DE102011008836B4 (de) * | 2010-08-17 | 2013-01-10 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten |
| EP2518187A1 (en) * | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Aqueous acidic bath for electrolytic deposition of copper |
| EP2865787A1 (en) * | 2013-10-22 | 2015-04-29 | ATOTECH Deutschland GmbH | Copper electroplating method |
-
2012
- 2012-11-26 EP EP12194261.9A patent/EP2735627A1/en not_active Withdrawn
-
2013
- 2013-11-06 TW TW102140324A patent/TWI600802B/zh active
- 2013-11-12 WO PCT/EP2013/073629 patent/WO2014079737A2/en not_active Ceased
- 2013-11-12 KR KR1020157016894A patent/KR102193485B1/ko active Active
- 2013-11-12 EP EP13792639.0A patent/EP2922985B1/en active Active
- 2013-11-12 JP JP2015543389A patent/JP6279598B2/ja active Active
- 2013-11-12 US US14/646,739 patent/US9551080B2/en active Active
- 2013-11-12 CN CN201380061184.6A patent/CN104854265B/zh active Active
-
2015
- 2015-05-21 PH PH12015501137A patent/PH12015501137B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6279598B2 (ja) | 2018-02-14 |
| TWI600802B (zh) | 2017-10-01 |
| KR20150088307A (ko) | 2015-07-31 |
| CN104854265A (zh) | 2015-08-19 |
| EP2922985B1 (en) | 2016-09-14 |
| EP2735627A1 (en) | 2014-05-28 |
| CN104854265B (zh) | 2017-08-08 |
| JP2016503461A (ja) | 2016-02-04 |
| PH12015501137A1 (en) | 2015-08-03 |
| US9551080B2 (en) | 2017-01-24 |
| EP2922985A2 (en) | 2015-09-30 |
| KR102193485B1 (ko) | 2020-12-22 |
| WO2014079737A2 (en) | 2014-05-30 |
| WO2014079737A3 (en) | 2014-09-12 |
| TW201422854A (zh) | 2014-06-16 |
| US20150299883A1 (en) | 2015-10-22 |
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