BR112012025394A2 - processo para produzir circuitos elétricos em uma determinada superfície - Google Patents

processo para produzir circuitos elétricos em uma determinada superfície

Info

Publication number
BR112012025394A2
BR112012025394A2 BR112012025394A BR112012025394A BR112012025394A2 BR 112012025394 A2 BR112012025394 A2 BR 112012025394A2 BR 112012025394 A BR112012025394 A BR 112012025394A BR 112012025394 A BR112012025394 A BR 112012025394A BR 112012025394 A2 BR112012025394 A2 BR 112012025394A2
Authority
BR
Brazil
Prior art keywords
electrical circuits
produce electrical
given surface
polymer
compound
Prior art date
Application number
BR112012025394A
Other languages
English (en)
Inventor
Fabio Cappelli
Original Assignee
Spf Logica S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spf Logica S R L filed Critical Spf Logica S R L
Publication of BR112012025394A2 publication Critical patent/BR112012025394A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16—Antifouling paints; Underwater paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/67—Particle size smaller than 100 nm
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/68—Particle size between 100-1000 nm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
    • C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
    • C08G2261/3223—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed containing one or more sulfur atoms as the only heteroatom, e.g. thiophene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Details Of Indoor Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

processo para produzir circuitos elétricos em uma determinada superfície. a presente invenção refere-se a um composto (2) e a um processo para polarizá-lo, descritos para formar cursos condutores ou isolantes. o composto compreende um substrato de solvente, e uma dispersão no substrato. a dispersão compreende (i) um polímero (m) com ligação conjugada covalente dupla, o que quer dizer um composto heterocíclico formado de n átomos de carbono e um átomo de um tipo diferente ligado a uma estrutura de circuito; e (ii) elementos funcionalizantes (q1) do polímero, de tal maneira que o estado do polímero mude mude de isolante para condutor e vice-versa, quando tocado por um campo eletromagnético.
BR112012025394A 2010-04-08 2011-04-07 processo para produzir circuitos elétricos em uma determinada superfície BR112012025394A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITBO2010A000212A IT1399315B1 (it) 2010-04-08 2010-04-08 Procedimento per disporre su una qualsiasi superficie verniciabile, dei circuiti conduttori e/o generatori di cariche elettriche e circuiti realizzati con tale procedimento.
PCT/IB2011/051495 WO2011125037A2 (en) 2010-04-08 2011-04-07 Process for producing electric circuits on a given surface

Publications (1)

Publication Number Publication Date
BR112012025394A2 true BR112012025394A2 (pt) 2016-06-28

Family

ID=43034590

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012025394A BR112012025394A2 (pt) 2010-04-08 2011-04-07 processo para produzir circuitos elétricos em uma determinada superfície

Country Status (9)

Country Link
US (1) US20120299441A1 (pt)
EP (1) EP2556731A2 (pt)
JP (1) JP2013531075A (pt)
CN (1) CN102656957A (pt)
BR (1) BR112012025394A2 (pt)
CA (1) CA2777350A1 (pt)
IT (1) IT1399315B1 (pt)
RU (1) RU2012146996A (pt)
WO (1) WO2011125037A2 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2695495A1 (en) * 2011-04-07 2014-02-12 SPF Logica S.r.l. Compound to produce conductive circuits
ITTV20110078A1 (it) * 2011-06-08 2012-12-09 Spf Logica S R L Metodo per tracciare piste conduttive
EP2695494A1 (en) * 2011-04-07 2014-02-12 SPF Logica S.r.l. Process or method for inserting or spreading quartz inside a substrate
ITTV20120142A1 (it) * 2012-07-26 2014-01-27 Spf Logica S R L Migliorato materiale in cui realizzare circuiti conduttori
ITTV20120166A1 (it) * 2012-08-20 2014-02-21 Spf Logica S R L Composto in cui realizzare circuiti conduttori
EP3185658A1 (de) * 2015-12-23 2017-06-28 Voestalpine Stahl GmbH Metallband und coil-coating-verfahren
US20200078352A1 (en) * 2016-12-02 2020-03-12 Neurocrine Biosciences, Inc. Use of Valbenazine for Treating Schizophrenia or Schizoaffective Disorder
WO2019180326A1 (fr) * 2018-03-19 2019-09-26 Jose Buendia L'antifouling electrique
CN111861433B (zh) 2018-03-30 2024-04-02 创新先进技术有限公司 基于区块链的业务执行方法及装置、电子设备
KR102647120B1 (ko) * 2018-06-25 2024-03-14 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체

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DE3714783A1 (de) * 1987-05-04 1988-11-24 Rainer Kuenstler Druckfarbe und verwendung derselben
JPS64792A (en) * 1987-06-23 1989-01-05 Yamaha Corp Manufacture of electronic circuit
JPH0537126A (ja) * 1991-07-30 1993-02-12 Toshiba Corp 金属酸化物を用いた配線基板および情報記録媒体
WO2000061302A2 (en) * 1999-04-14 2000-10-19 E.I. Du Pont De Nemours And Company Electrically conductive coatings applied by internally charged electrostatic sprayers
DE19919261B4 (de) * 1999-04-28 2008-11-06 Plieth, Waldfried, Prof. Dr. Verfahren zur Erzeugung ultradünner kompakter, haftfester und in der elektrischen Leitfähigkeit einstellbarer Polymerschichten auf Oberflächen oxidischer Partikel, damit hergestellte Partikel und deren Verwendung
DE19939199B4 (de) * 1999-08-18 2005-12-15 Sachtleben Chemie Gmbh Verwendung von Lacken auf Polymerbasis
US6228555B1 (en) * 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US20080036241A1 (en) * 2001-02-15 2008-02-14 Integral Technologies, Inc. Vehicle body, chassis, and braking systems manufactured from conductive loaded resin-based materials
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20040185388A1 (en) * 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
JP2005263873A (ja) * 2004-03-16 2005-09-29 Tdk Corp 導電性高分子の形成方法ならびに電解コンデンサの製造方法
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Also Published As

Publication number Publication date
WO2011125037A3 (en) 2012-01-12
US20120299441A1 (en) 2012-11-29
CN102656957A (zh) 2012-09-05
ITBO20100212A1 (it) 2011-10-09
JP2013531075A (ja) 2013-08-01
EP2556731A2 (en) 2013-02-13
RU2012146996A (ru) 2014-05-20
IT1399315B1 (it) 2013-04-16
CA2777350A1 (en) 2011-10-13
WO2011125037A2 (en) 2011-10-13

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]