BR112012021172A2 - revestimento de polímero polímerizado de plasma - Google Patents

revestimento de polímero polímerizado de plasma

Info

Publication number
BR112012021172A2
BR112012021172A2 BR112012021172A BR112012021172A BR112012021172A2 BR 112012021172 A2 BR112012021172 A2 BR 112012021172A2 BR 112012021172 A BR112012021172 A BR 112012021172A BR 112012021172 A BR112012021172 A BR 112012021172A BR 112012021172 A2 BR112012021172 A2 BR 112012021172A2
Authority
BR
Brazil
Prior art keywords
polymer
plasma
coating
electro
substrate
Prior art date
Application number
BR112012021172A
Other languages
English (en)
Inventor
Mark Robson Humphries
Rodney Edward Smith
Timothy Von Werne
Original Assignee
Semblant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semblant Ltd filed Critical Semblant Ltd
Publication of BR112012021172A2 publication Critical patent/BR112012021172A2/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • C08J7/16Chemical modification with polymerisable compounds
    • C08J7/18Chemical modification with polymerisable compounds using wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/28Treatment by wave energy or particle radiation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872Insulating conformal coating

Abstract

revestimento de polímerizado de plasma. conjunto eletro-ótico ou elétrico compreendendo um substrato compreendendo um material isolante, uma pluralidade de faixas condutoras presentes em pelo menos uma superfície do substrato, pelo menos um componente eletro-ótico ou elétrico conectado a pelo menos uma faixa condutora, e um revestimento contínuo compreendendo um polímero polimerizado de plasma revestindo completamente pelo menos uma superfície do substrato, a pluralidade de faixas condutoras e pelo menos um componente eletro-ótico ou elétrico.
BR112012021172A 2010-02-23 2011-02-21 revestimento de polímero polímerizado de plasma BR112012021172A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB1003067.4A GB201003067D0 (en) 2010-02-23 2010-02-23 Plasma-polymerized polymer coating
PCT/GB2011/000238 WO2011104500A1 (en) 2010-02-23 2011-02-21 Plasma-polymerized polymer coating

Publications (1)

Publication Number Publication Date
BR112012021172A2 true BR112012021172A2 (pt) 2016-05-17

Family

ID=42114258

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012021172A BR112012021172A2 (pt) 2010-02-23 2011-02-21 revestimento de polímero polímerizado de plasma

Country Status (8)

Country Link
EP (1) EP2539392A1 (pt)
JP (1) JP6085480B2 (pt)
KR (1) KR101778820B1 (pt)
CN (2) CN102791779A (pt)
BR (1) BR112012021172A2 (pt)
GB (1) GB201003067D0 (pt)
TW (1) TWI547221B (pt)
WO (1) WO2011104500A1 (pt)

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JP5693515B2 (ja) * 2012-01-10 2015-04-01 エイチズィーオー・インコーポレーテッド 内部耐水性被覆を備える電子デバイス
WO2015157202A1 (en) 2014-04-09 2015-10-15 Corning Incorporated Device modified substrate article and methods for making
ES2597167T3 (es) * 2012-03-06 2017-01-16 Semblant Limited Conjunto eléctrico revestido
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
GB201305500D0 (en) * 2013-03-26 2013-05-08 Semblant Ltd Coated electrical assembly
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
CN103701963B (zh) * 2013-12-30 2017-05-10 惠州Tcl移动通信有限公司 一种移动终端的防水处理方法及移动终端
CN104320920B (zh) * 2014-10-13 2017-05-10 北京卫星制造厂 一种基于低内应力的电子产品涂覆方法
KR102573207B1 (ko) 2015-05-19 2023-08-31 코닝 인코포레이티드 시트와 캐리어의 결합을 위한 물품 및 방법
EP3307832A1 (en) * 2015-06-09 2018-04-18 P2i Ltd Coating
GB2539231B (en) * 2015-06-10 2017-08-23 Semblant Ltd Coated electrical assembly
CN107810168A (zh) 2015-06-26 2018-03-16 康宁股份有限公司 包含板材和载体的方法和制品
GB201601221D0 (en) * 2016-01-22 2016-03-09 Semblant Ltd Coated electrical assembly
JP6750252B2 (ja) * 2016-02-29 2020-09-02 日亜化学工業株式会社 発光装置の製造方法
TW201825623A (zh) 2016-08-30 2018-07-16 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
EP3649660A4 (en) 2017-07-03 2021-04-21 AVX Corporation ASSEMBLY FORMING A SOLID ELECTROLYTE CAPACITOR
US11257628B2 (en) 2017-07-03 2022-02-22 KYOCERA AVX Components Corporation Solid electrolytic capacitor containing a nanocoating
CN107686986B (zh) * 2017-08-23 2018-12-18 江苏菲沃泰纳米科技有限公司 一种调制结构的有机硅纳米防护涂层的制备方法
CN107587120B (zh) * 2017-08-23 2018-12-18 江苏菲沃泰纳米科技有限公司 一种具有调制结构的高绝缘纳米防护涂层的制备方法
CN107587119B (zh) * 2017-08-23 2018-11-13 江苏菲沃泰纳米科技有限公司 一种复合结构高绝缘硬质纳米防护涂层的制备方法
US11389825B2 (en) 2017-08-23 2022-07-19 Jiangsu Favored Nanotechnology Co., LTD Methods for preparing nano-protective coating with a modulation structure
CN109686672A (zh) * 2017-10-18 2019-04-26 上海稷以科技有限公司 在物体表面形成保护层的方法及表面形成有保护层的产品
WO2019118660A1 (en) 2017-12-15 2019-06-20 Corning Incorporated Method for treating a substrate and method for making articles comprising bonded sheets
CN109686802A (zh) * 2018-11-09 2019-04-26 惠州凯珑光电有限公司 一种电子元器件和模组的封装工艺
CN110665768B (zh) * 2019-07-26 2022-04-26 江苏菲沃泰纳米科技股份有限公司 防水纳米膜及其制备方法、应用和产品
KR102362271B1 (ko) * 2019-10-16 2022-02-14 이정훈 회로 기판용 보호 코팅 조성물
EP4163417A1 (en) * 2020-06-09 2023-04-12 Jiangsu Favored Nanotechnology Co., Ltd. Protective coating and preparation method therefor

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JPS63311793A (ja) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd フレキシブル配線板の製造方法
JPS6489389A (en) * 1987-09-29 1989-04-03 Sumitomo Electric Industries Manufacture of flexible printed wiring board
JPH06244316A (ja) * 1993-02-19 1994-09-02 Sony Corp 半導体装置、その製造方法及びその製造装置
FR2726151B1 (fr) * 1994-10-25 1996-11-29 Europ Composants Electron Procede et dispositif de protection hermetique de circuit electronique
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BRPI0917289A8 (pt) * 2008-08-18 2019-09-17 Semblant Global Ltd revestimento polimérico de halo-hidrocarboneto

Also Published As

Publication number Publication date
CN106916331A (zh) 2017-07-04
CN102791779A (zh) 2012-11-21
WO2011104500A1 (en) 2011-09-01
GB201003067D0 (en) 2010-04-07
JP6085480B2 (ja) 2017-02-22
TW201204203A (en) 2012-01-16
TWI547221B (zh) 2016-08-21
KR101778820B1 (ko) 2017-09-14
EP2539392A1 (en) 2013-01-02
JP2013527973A (ja) 2013-07-04
KR20120129993A (ko) 2012-11-28

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Legal Events

Date Code Title Description
B25G Requested change of headquarter approved

Owner name: SEMBLANT LIMITED (GB)

B06F Objections, documents and/or translations needed after an examination request according art. 34 industrial property law
B06T Formal requirements before examination
B07A Technical examination (opinion): publication of technical examination (opinion)
B09B Decision: refusal
B09B Decision: refusal

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