201204203 六、發明說明： 【發明所屬之技術領域】 本發明係關於-經電襞聚合之聚合物被覆層，其用於被 覆電及光電總成及組件’且關於涉及該被覆之方法。 【先前技術】 在電子業界已多年使用保形被覆層以在作業期間保護電 總成在環境中曝冑。-保形被覆層》符合PCB及其組件之 輪廓具有保護漆的-薄型、撓性層。保形被覆層保護電路 免於腐蝕性化學製品(例如鹽、溶劑、汽油、油、酸及環 境污染物）、潮濕/凝結、振動、漏電、電遷移、多枝晶體 生長。當前的保形被覆層典型為25 μηι至2〇〇 4爪厚且一般 係基於環氧樹脂、丙烯酸樹脂或聚矽氧樹脂。此等材料全 部沈積為必須在總成上施覆之液體且接著固化該等液體。 最近亦已使用昂貴的聚對二甲苯作為一保形被覆層。典型 使用熟習此項技術者廣泛瞭解的習知化學氣相沈積技術來 沈積聚對二甲苯。 當則保形被覆層存在許多相關缺點。用於沈積被覆層之 技術要求在被覆之前先遮蔽用以將總成連接至其他裝置之 接觸件，以避免保形被覆層覆蓋接觸件。經被覆之接觸件 不能夠電連接至其他裝置，因為保形被覆層是厚且絕緣 的。 此外’若需要電總成之重新加工則移除當前保形被覆層 非常難且昂貴。在無提前移除的情況下不可能透過被覆層 進行焊接或熔焊。此外’歸因於通常用於沈積此等保形被 154H8.doc 201204203 覆層之液體技術，存在於被覆層中形成缺陷（諸如泡沫）之 趨勢。此等缺陷降低保形被覆層之保護能力。先前技術保 形被覆層之進-步問題在於，歸因於被覆期間使用的液體 技術’難以將被覆層沈積於總成上之組件下方。 【發明内容】 本發明者已驚訝地發現經電漿聚合之聚合物可用於在電 及光電總成上形成極佳的保形被覆層。此等被覆層不僅為 連續及大體上無缺陷，且其等克服上述現存被覆層之問 題。此外，本發明之經電漿聚合之聚合物被覆層易於沈積 於裝置上且相對便宜。 因此’本發明提供一電或光電總成，其包括：一基板， 其包括一絕緣材料；複數個傳導性線路，其等存在於該基 板之至少一個表面；至少一個電或光電組件，其連接至至 J 一個傳導性線路；及一連績被覆層，其包括完全覆蓋該 基板之該至少一個表面、該複數個傳導性線路及該至少一 個電或光電組件的一經電漿聚合之聚合物。 本發明進一步提供一種方法，其包括：（a)提供一電或光 電總成’該電或光電總成包括：一基板’其包括一絕緣材 料；複數個傳導性線路，其等存在於該基板之至少一個表 面，及至少一個電或光電組件，其連接至至少一個傳導性 線路’及（b)藉由電漿聚合沈積一連續被覆層，該連續被覆 層包括聚合物，該聚合物完全覆蓋該基板之該至少一個表 面、該複數個傳導性線路及該至少一個電或光電組件。 本發明進一步提供可藉由上文定義的該方法獲得的一種 154118.doc 201204203 電或光電總成。 本發明進一步提供一種電或光電組件，可用包括一經電 漿聚合之聚合物的一連續被覆層完全覆蓋該電或光電組 件。 本發明進-步提供-種方法，其包括：⑷使上文定義之 一電或光電總成經受一電漿移除程序，使得移除該連續被 覆層，然後（b)視情況重新加工該電或光電總成，然後 視情況藉由電漿聚合而沈積一替代連續被覆層，該替代連 續被覆層包括聚合物，該聚合物完全覆蓋該基板之該至少 一個表面、該複數個傳導性線路及該至少一個電或光電組 件。 本發明進一步提供一種方法，其包括透過上文定義的電 或光電總成之該連續被覆層進行焊接，以在另一電或光電 組件與至少一個傳導性線路間形成一焊接結合，該焊接結 合靠抵該連續被覆層。 本發明進-步提供-種方法，其包括：⑷使_電或光電 總成經受-電漿移除程序使得移除—表面修整被覆層，該 電或光電總成包括：一基板’該基板包括一絕緣材料；複 數個傳導性線路’其等存在於該基板之至少-個表面；該 表面修整被覆層，#包括覆蓋該複數個傳導性線路之至少 -部分的鹵代烴聚合物；及至少一個電或光電組件，其等 透過該表面修整被覆層連接至至少-㈣導性線路，然後 (b)藉由電漿聚合沈積—連續被覆層，該連續被覆層包括上 文定義的聚合物’該聚合物完全覆蓋該基板之該至少一個 154118.doc 201204203 表面、該複數個傳導性線路及該至少一個電或光電組件。 本發明進一步提供—種方法，其包括··（a)使一電或光電 總成經受一電漿移除程序使得移除—表面修整被覆層，該 電或光電總成包括：一基板，該基板包括一絕緣材料；複 數個傳導性線路，其等存在於該基板之至少一個表面；該 表面修整被覆層，其包括覆蓋該複數個傳導性線路之至少 #为的鹵代烴聚合物，接著（b)將一電或光電組件連接至 至少一個傳導性線路，然後（c)藉由電漿聚合沈積一連續被 覆層，該連續被覆層包括如上文定義之聚合物，該聚合物 凡全覆蓋該基板之該至少一個表面、該複數個傳導性線路 及該至少一個電或光電組件。 本發明進一步提供一種電或光電總成，其具有一保形被 覆層’該保形被覆層包括上文定義的一經電漿聚合之聚合 物。 本發明進一步提供上文定義之一經電漿聚合之聚合物作 為用於一電或光電總成之一保形被覆層之用途。 本發明進一步提供一種用於保形被覆一電或光電總成之 方法，該方法包括藉由電漿聚合來沈積上文定義之一聚合 物。 【實施方式】 本發明關注電及光電總成。一電總成典型包括至少一個 電組件。一光電總成典型包括至少一個光電組件，且可視 情況進一步包括至少一個電組件。一電或光電總成較佳為 一印刷電路板。 154118.doc • 6 - 201204203 本發明之連續被覆層包括一經電漿聚合之聚合物。本發 明之連續被覆層可避免對電或光電總成之環境損害。典型 由歸因於大氣成分（例如氧氣S〇2、及/或n〇2)及/或周 圍水分或高溫之腐蝕而引起環境損害。此外，本發明之連 續被覆層可在比當前保形被覆層更大之_溫度·内繼續 保護其所施覆的電及光電總成，當前保形被覆層可能因較 尚溫度而降級。 本發明之連續被覆層較佳為一保形被覆層。 經電漿聚合之聚合物係無法由傳統聚合方法製備的一獨 特類型聚合物。經電漿聚合之聚合物具有高度無序結構且 大體上高度交鍵，其等含有隨機支鏈且保留一些反應性部 位。因此經電漿聚合之聚合物化學上異於由熟習此項技術 者已知的傳統聚合方法製備之聚合物。眾所周知且在例如 Plasma Polymer Filmes, Hynek Biederman, Imperial College Press 20〇4中描述此等化學及物理差異。 典型可藉由一電毅聚合技術獲得一經電讓聚合之聚合 物’下文中進一步加以詳細定義。 經電漿聚合之聚合物典型為電漿聚合烴、_代烴、聚矽 氧、矽氧烷、矽烷、矽氮烷或錫烷。 電漿聚合烴典型為視情況含有環狀基團的直鏈及/或支 鏈聚合物。該等環狀基團較佳為脂族環或芳香環（芳香環 更佳）。較佳而言電漿聚合烴不含有任何環狀基團。較佳 而言電漿聚合烴為支鏈聚合物。 電漿聚合齒代烴典型為視情況含有環狀基團的直鏈及/ I54I18.doc 201204203 或支鏈聚合物。該等環狀基團較佳為脂族環 香環更：)。較佳而言電浆聚合煙不含有任何環狀基團(: 較佳而s電漿聚合鹵代烴為支鏈聚合物。 包括芳香族基團的電漿聚合烴及齒代烴分別為電喂聚人 芳香族烴及芳香族函代烴（諸如芳香族氟代煙）。實例包I 電漿：合聚笨乙烯及電漿聚合聚對二甲苯。電漿聚合聚： 二曱苯尤其較佳。電聚聚合聚對二甲苯可為非取代或用— 個或多個取代基取代1佳取代基包含氟為最佳。 用-個或多個齒素原子取代的聚對二甲苯為齒代二甲苯。 用一個或多個I原子取代的聚對二甲笨為氟代二甲笨。非 取代聚對二甲苯最佳。 電漿聚合烴視情況含有從N、〇、Si&p選擇的異質原 子。然而較佳而言，電漿聚合烴不含有N、〇、8丨及卩異質 原子。 、 電漿聚合鹵代烴視情況含有&N、〇、Si&p選擇的異質 原子。然而較佳而言，電漿聚合函代烴不含有Ν、ο、8丨及 P異質原子。 3氧電漿聚合烴較佳包括羰基，更佳而言含有酯及/或 酿胺基。含氧電漿聚合烴聚合物之—較佳類別為電衆聚合 丙烯酸聚合物。 含氧電漿聚合鹵代烴較佳包括羰基，更佳而言含有酯及/ 或醯胺基。含氧電漿聚合齒代烴聚合物之一較佳類別為電 漿聚合齒代丙烯酸聚合物，例如電漿聚合氟代丙烯酸聚合 物。 154118.doc 201204203 含氮電漿聚合烴較佳包括硝基、胺基、醯胺基、咪唑、 二唑、三唑及/或四唑基團。 含氮電漿聚合i代烴較佳包括硝基、胺基、醯胺基、咪 唑、二唑、三唑及/或四唑基團。 視情況用一個或多個氟原子取代電漿聚合聚矽氧、矽氧 烷、矽烷及矽氮烷。然而，較佳而言聚矽氧、矽氧烷、矽 烷及矽氮烷為非取代。較佳矽氮烷為六甲基二矽氮烷。 較佳而言經電漿聚合之聚合物為電漿聚合函代烴，更佳 而3為電漿聚合氣代烴。最佳而言經電敷聚合聚合物為支 鏈且不含異質原子的電漿聚合氟代烴。 本文中使用的術語^佳為1、氣、漠及破。氟及氯較 佳，氟為最佳。鹵素意義相同。 可藉由電漿聚合沈積聚合物而製備本發明之總成。電漿 聚口通吊為用於沈積薄膜被覆層之—有效技術。通常電毁 聚合提供極佳品質被覆層，因為聚合反應原位發生。因 此合之聚合物通常沈積在正常液體被覆技術在 某些情形中無法接達之小凹口中、組件下方及通孔卜 此外，聚合物之原位形成可提供至施覆被覆層之表面的 :子黏-，因為在沈積期間聚合物通常與表面反應。因 :心某些情形中，經電梁聚合之聚合物可沈積於其他保 形被覆層無法沈積的材料上。 固化沽覆之電漿聚合技術之一進—步優點在於不需要乾燥/ 化牛L |之隨後沈積。被覆之先前技術需要一乾燥/固 驟’此導致形成被覆層表面上之固化/乾燥缺陷。電 154118.doc 201204203 漿聚合避免固4匕/乾燥缺陷之形成。 可在產生氣體電漿的一反應器内實現電漿沈積，該氣體 電漿包括離子化氣態離子、電子、原子及/或中性物質。 -反應器可包括-腔室、—真空系統及—個或多個能源， 但可使用經組態以產生氣體電漿之任何適當類型反應器。 能源可包含經組態以將一個或多個氣體轉換為氣體電漿的 任何CJ適裝置。較佳而s能源包括一加熱器、射頻（RF)產 生器及/或微波產生器。 在某些實施例中，可將一電或光總成放置於一反應器腔 室中且可使用一真空系統將腔室泵抽減壓至10_3爪匕訂至⑺ mbar範圍内的壓力。接著可將—個或多個氣體$抽至腔室 中且此源可產生穩定氣體電漿。接著可將一個或多個前 驅體化s物作為氣體及/或液體導入腔室中之氣體電聚。 在導入氣體電漿中時，可離子化及/或分解前驅體化合物 、在電漿中產生用於聚合以產生聚合物被覆層之活性物質 之一範圍。 較佳可藉由一個或多個前驅體化合物之電漿聚合獲得電. 漿聚合氟代烴，該等一個或多個前驅體化合物為包括氟原 子之烴材料。包括氟原子之較佳烴材料為全氟代烷、全氟 代烯、全氟代炔、氟代烷、氟代烯、氟代炔。實例包含 C3F6及 C4F8。 其他較佳前驅體化合物為氟氣代烷、氟氯代烯及氟氯代 炔。實例包含C2F3C1及C2F4C12。 較佳可藉由電漿聚合聯對二甲苯、亞二曱苯或二甲苯獲 I54118.doc 201204203 得電漿聚合聚對二曱苯。 經電聚聚合之聚合物被覆層之準確性質及成分典型取決 於下列條件一者或多者：⑴所選擇電漿氣體；（ii)使用的 . 特疋刖驅體化合物；（ίΠ)前驅體化合物數量（此可由前驅體 化合物與流動速率之壓力組合決定（iv)前驅體化合物比 率，（v)前驅體化合物次序；（vi)電漿壓力；（νΗ)電漿驅動 頻率；（Wii)脈衝寬度時序；（ix)被覆時間；（χ)電漿功率 (包含峰值及/或平均電漿功率）；（xi)腔室電極配置；及/或 (xii)傳入總成製備。 典型而s電聚驅動頻率為1 kHz至1 GHz。典型而言電聚. 功率為500 W至loooo We典型而言質量流動速率為5 sccm 至2000 seem。典型而言作業壓力為1〇 ^Τοιτ至500 mTorr。典型而言被覆時間為10秒至20分鐘。 亦可使用脈衝電漿系統。 然而’熟練人士將瞭解較佳條件將取決於電漿腔室之大 小及幾何形狀。因此，取決於所使用的特定電漿腔室熟 練人士可有利修改作業條件。 可由前驅體及電漿處理條件冬謹慎選擇控制連續被覆層 ' 之表面能量。取決於特定電漿聚合物，表面可為親水性或 • 疏水性。 一疏水性被覆層較佳展現一大於90度，更佳而言大於 105度之水接觸角度。一疏水性被覆層較佳展現一小於35 達因/厘米且更佳而言小於30達因/厘米之表面能量。在某 些情形中，高度需要該連續被覆層之疏水性屬性，因為其 154118.doc 201204203 等可減少因水分而對一總成損害之可能性。 然而，在一些情形中，可能希望一親水性被覆層。例 如’若要將進一步被覆層或標籤（諸如條碼）施覆於連續被 覆層則可能希望親水性被覆層。通常較易於將額外被覆層 黏合至一親水性被覆層。一親水性被覆層較佳展現一小於 70度’且更佳而言小於55度之水接觸角度。一親水性被覆 層較佳展現一大於45達因/厘米且最佳而言大於50達因/厘 米之表面能量。 本文中使用的「連續」意為被覆層大致上無缺陷。可能 的缺陷包含被覆層中的孔、裂縫及破裂。可使用在一電或 光電總成上原位形成的經電漿聚合之聚合物達成一連續被 覆層。使用下文中描述的電漿聚合方法，可在與電漿氣體 接觸的所有表面上形成一連續被覆層。在被覆高縱橫比特 徵物（諸如典型在一電或光電總成上可見的組件）時此可係 特別有利《使用一電漿聚合方法亦可容許由被覆層將下懸 物（underhang)覆蓋住。 連續被覆層典型具有1 11111至1〇 之一平均厚度，較佳 為I nm至5 μηι，更佳為5 11〇1至5〇〇 nm，更佳為1〇〇打爪至 3 00 nm，且更佳為15〇 11〇1至25〇 nm(例如大約2〇〇打爪）。一 連續被覆層之厚度可大體上均勻或可因點而異。在特定實 施例中，連續被覆層可經沈積使得其符合基板、傳導性線 路及組件的三維表面之形狀。 連續被覆層完全覆蓋一基板之至少一個表面、複數個 傳導性線路及至少-個電或光電組件。較佳而t，一被覆 154H8.doc 12 201204203 層囊封一基板之至少一個表面、複數個傳導性線路及至少 一個電或光電組件的曝露部分。連續被覆層可因此較佳為 一保形被覆層。一保形被覆層可保形被覆一基板之至少— 個表面、複數個傳導性線路及至少一個電或光電組件。為 避免疑問，意欲採取如上文定義的相同意義參考下文中討 命的完全覆蓋其他物件之被覆層。 用連續被覆層完全t蓋的電或光電總成之區域在某些情 勢下可能為一較大電或光電總成之一部分，該較大電或光 電總成之其餘部分可能不受被覆。 一連續被覆層可引起其所施覆之一總成的電及/或光效 能之最小改變。例如，一總成中之一電路電感可僅受被覆 層最小影響。在一些情形中，與典型顯著改變電路屬性 (此可能要求當設計一總成時考慮由其他被覆層引起之總 成屬性改變）之其他保形被覆層相比此可高度有利。在一 些情形中本發明之被覆層可消除此要求。 若要求對電或光電總成要求來自環境之—極高度保護， 則可在起始連續被覆層上施覆經電漿聚合之聚合物之額外 連續被覆層。因此，電或光電總成可進一步包括一第一額 外連續被覆層及視情況之一第二額外連續被覆層，該第一 額外連續被覆層包括完全覆蓋連續被覆層的上文定義之經 電漿聚合之聚合物，該第二額外連續被覆層包括完全覆蓋 該第一額外連續被覆層的上文定義之經電漿聚合之聚合 物。若需要可施覆上文定義的經電發聚合之聚合物之另外 額外連續被覆層（例如第三至第十連續被覆層）。用於各個 154118.doc •13- 201204203 額外連續被覆層之經電漿聚合之聚合物可獨立地與起始連 續被覆層之經電漿聚合之聚合物相同或不同。典型藉由用 於沈積連續被覆層之方法沈積各個額外連續被覆層。起始 連續被覆層之精確性質及任何額外連續被覆層可經選擇以 改良或最佳化經被覆總成要求的效能《例如，可能希望其 具有局度疏水性被覆層作為最初被覆層，以達成良好的防 水性。 本發明之電漿聚合被覆層亦可用於對用另一保形被覆層 被覆的現存電或光電總成提供額外環境保護。此可在需要 一防水外部被覆層之情形中有利。因此，電或光電總成可 進一步包括沈積於經電漿聚合之聚合物之連續被覆層之至 少一部分與一基板、複數個傳導性線路及至少一個電或光 電’、且件之至少一部分間的環氧樹脂、丙稀酸樹脂、聚石夕氧 樹脂或聚對二甲苯之一被覆層。在某些實施例中，可藉由 一化學氣相沈積法沈積聚對二甲苯被覆層。 因此，電或光電總成可包括：一基板，纟包括一絕緣材 料；複數個傳導性線路，其等存在於基板之至少一個表 面，至y個電或光電組件，其連接至至少一個傳導性線 路，在基板之至少一部分上的環氧樹脂、丙烯酸樹脂 '聚 石夕氧樹脂或聚對二甲苯之—被覆層（可藉由傳統化學氣相 沈積方法沈積其等）；及一連續被覆層，其包括一經電漿 聚聚合物’該經電衆聚合之聚合物完全覆蓋基板之該 至少:個表面、複數個傳導性線路、至少-個電或光電組 件及環氧樹脂、丙烯酸樹脂、聚矽氧樹脂或聚對二甲苯之 154118.doc 201204203 被覆層。 較佳而言環氧樹脂、丙烯酸樹脂、聚矽氧樹脂或聚對二 曱苯之被覆層係一保形被覆層，可藉由使一電或光電總成 經受本文中描述的一被覆方法而製備此類配置，該電或光 電總成包括沈積於基板、複數個傳導性線路及至少一個電 或光電組件之至少一部分上的環氧樹脂、丙烯酸樹脂、聚 矽氧樹脂或聚對二甲笨之一被覆層。 亦可將一連續被覆層施覆於攜載如W〇 2008/102113(其 以參考方式併入本文中）中描述的鹵代烴表面修整被覆層 之電或光電總成。因此，一電或米電總成可包括一表面修 整被覆層，s玄表面修整被覆層包括沈積於下列者之間的鹵 代烴聚合物：（a)連續被覆層與（1?)基板之至少一個表面及 複數個傳導性線路，其中表面修整被覆層覆蓋複數個傳導 性線路之至少一部分，且至少一個電或光電組件透過表面 修整被覆層連接至至少—個傳導性線路。較佳而言表面修 整被覆層包括I代烴聚合物，更佳而言為電聚聚合氟代烴 聚合物。 -電或光電總成亦可包括：_基板，其包括—絕緣材 料；複數個傳導性線路’其等存在於基板之至少一個表 面；至少一個電或光電組件，其連接至至少-個傳導性線 路；一表面修整被覆層’其包括沈積於複數個傳導性線路 之至少一部分上的自代烴聚合物；及-連續被覆層，其包 括-經電漿聚合之聚合物，該經電漿聚合之聚合物完全覆 蓋基板之。亥至 >、<固表面、複數個傳導性線路、至少一個 1541l8.doc -15· 201204203 電或光電組件及表面修整被覆層’其中該至少一個電或光 電組件透過表面修整被覆層連接至至少一個傳導性線路。 較佳而言，電或光電組件經由一焊接結合、一溶谭結合 或一線接合結合連接至至少一個傳導性線路，且該等焊接 結合、熔焊結合或線接合結合靠抵表面修整被覆層。 當一總成包含一表面修整被覆層或環氧樹脂、丙烯酸樹 脂或聚矽氧樹脂之一被覆層時，可藉由使具有合適表面修 整被覆層或具有環氧樹脂、丙烯酸樹脂或聚矽氧樹脂之一 被覆層的總成經受上述之一被覆方法來製備該總成。類似 地，典型藉由上述之一被覆方法沈積額外連續被覆層。 電漿聚合被覆層之一進一步優點在於，在一些情形中， 可藉由一電漿移除程序易於移除電漿聚合被覆層。一電漿 移除程序彳包括電衆姓刻被覆層以曝露電或光電總成之下 伏表面。被覆層可具有大約2〇〇 之一厚度。可使用先前 技術中已知方法施覆於—電或光電總成的—傳統保形被覆 層厚度典型介於25 ’與2〇〇㈣之間。由於待移除的大體 積材料’冑用電漿姓亥,j進行的當前保形被覆層之移除可能 時昂貝。因此，上文定義的一電或光電總成可經歷一 電毁移除程序4電|移除程序典型移除大體所有連續被 層&存在的情況下’其可典型移除額外連續被覆層及， 或表面修整被覆層之全部。_電聚移除程序典型包括將電 或光電總成放置於一電漿腔室中，且導入化學及/或物理 轟擊被覆層表面的反應性氣體電漿以移除材料並逐漸蝕刻 返回原始下伏表面。 154118.doc 201204203 此程序可能是快速且便宜的，因此有利。接著可典型il 由進一步增添組件或替換現存組件而重新加工已移除被覆 層之電或光電總成。或者，若透過使用已損害傳導性線路 與組件間之連接，則可重新加工該連接。 一旦完成重新加工，則可視情況藉由電漿聚合沈積包括 聚合物的一替換連續被覆層，該替換連續被覆層完全覆蓋 基板之至少一個表面、複數個傳導性線路及至少一個電或 光電組件。因此，在一些情形中，可易於修復一受損電或 光電總成。 一電漿聚合被覆層之一進一步優點在於可能不需要在重 新加工之則移除被覆層。此係由於在一些情形中可能可透 過被覆層進行焊接。在一些情形中，亦可能可透過一起始 被覆層進行焊接，且在存在的情況τ透過__電或光電總成 之第一及第二額外被覆層及/或一表面修整被覆層以在另 一電或光電組件與至少一個傳導性線路間形成一焊接結 合。焊接結合可靠抵連續被覆層，且在存在情況下靠抵第 一及第二額外被覆層及/或表面修整被覆層。 一進-步應用包括藉由一電漿料程序進行上述之一表 面修整被覆層之移除 隨後為上述一經電漿聚合之聚合物 之沈積。另-應用包括藉由一電漿移除程序進行上述一表 面修整被覆層之移除，接著將電或光電組件連接至傳導性 線路，隨後為上述之經電漿聚合之聚合物沈積。 -電或光電總成可包括複數個傳導性線路，其等可為導 電線路或光導線路。 π 154118.doc 201204203 一導電線路典型包括任何適當導電材料。較佳而言，一 導電線路包括.金、鎢、銅、銀、紹、半導體摻雜區域基 板、傳導性聚合物及/或傳導性墨水。更佳而言，-導電 線路包括：金、鎢、銅、銀或铭。 可藉由熟習此項技術之人士為待定的特定總成選擇用於 傳導性線路的適當形狀及組態。 典型而言，沿基板之完整長度將一導電線路附接至基板 表面。或者’可在兩個或更多個點處將一導電線路附接至 基板。例如’一導電線路可為在兩個或多個點但非沿基板 完整長度處附接至基板之一線。 使用熟習此項技術者已知的任何適當方法在一基板上典 型形成一導電線路。在一較佳方法中，使用一「減除法」 技術在一基板上形成導電線路。在此方法中，典型將一層 金屬（例如銅箔、鋁箔等等）接合至基板之一表面且接著移 除金屬層之不希望部分，留下希望的傳導性線路。典型藉 由化學蝕刻或光蝕刻、碾磨從基板移除金屬層之不希望部 分。在一替代較佳方法中，使用一「增添法」技術（諸如 例如電鍍、使用一反向遮罩之沈積及/或任何幾何形狀受 控沈積程序）在基板上形成傳導性線路。或者，基板可為 一矽晶粒或晶圓，其典型具有作為傳導性線路之摻雜區 域。 ” —光導線路典型包括任何合適光導材料。較佳而言一光 導線路係一光波導，其典型包括將折射率之一改變用於通 過希望路徑傳播電磁輻射之-光透射材料。可例如藉由將 1541l8.doc •18· 201204203 一包層或邊界層應用於光透射材料而產生波導，其中包芦 或邊界層由具有不同折射率之一材料製成。或者，可藉由 摻雜或修改光透射材料以產生可變折射率之區域以產生一 波導。因此波導可為獨立式組件或整合至一基板中的特 徵。典型光透射材料為玻璃、摻雜玻璃及塑膠。 複數個傳導性線路可包括僅導電線路、僅光導線路或導 電線路與視情況之光導線路之一混合物。在存在多個導電 線路的情況下，各個線路可由上文定義的相同材料製成及/ 或具有相同形狀，或者替代地可存在各種線路材料及/或 線路形狀。在存在多個光導線路的情況下，各個線路可由 上文定義的相同材料康成及/或具有相同形狀，或者替代 存在各種線路材料及/或線路形狀。 複數個傳導性線路可進一步包括至少一個外部接觸構 件。連續被覆層較佳完全覆蓋該至少一個外部接觸構件。 外部接觸構件之精確性質可取決於總成性質及需要接觸 之裝置。可由熟習此項技術之人士例行選擇合適接觸件。 典型而言，外部接觸構件為一電或光接觸件。外部接觸構 件可為複數個傳導性線路之—部分H外部接觸構件 可為電或光連接至至少一個傳導性線路之一額外組件。 一電漿聚合被覆層可容許在下列者之間進行一電連接而 不需要連續被覆層之提前移除：（a)一外部接觸構件，其較 佳為一電接觸件，與⑻一外部裝置上之-對應接觸件'。、類 、也 電衆·聚合被覆層可容許在下列者之間進行一“、 接而不需要連續被覆層之提前移除：⑷—外部接：構：連 154118.doc -19- 201204203 較佳為一光接觸件’與（b)一外部裝置上之對應接觸件。因 此’可能在任一情形中皆不需要在電漿聚合被覆層形成之 則遮蔽總成之外部接觸構件。在一些情形中，此可能有 利，因為外部接觸構件之遮蔽可能是耗時且昂貴的。 一電或光電總成可包含一基板，該基板可包括一絕緣材 料《該基板典型包括避免基板使電或光電總成電路短路之 任何適當絕緣材料。因此在一電總成中，基板較佳為電絕 緣。在—光電總成中，I板較佳為電絕緣及光絕緣兩者。 -基板較佳包括環氧薄片材料、人造樹脂接合紙、環氧 樹脂接合玻璃纖維布(ERBGH)、—複合環氧材料(cem)、 PTFE(特氟龍）或其他聚合物材料、酚醛棉紙、矽、玻璃、 陶瓷、紙、紙板、天然及/或人造木材料及/或其他適當紡 織品。基板視情況進一步包括一阻燃劑材料，典型而言為 阻燃劑2(FR_2)及/或阻燃劑4(FR_4)。餘可包括—絕緣材 料之-單-層或具有相同或不同絕緣材料之多個層。其 可為由上文列舉材料之任何一者製 土 (PCB)之板。 者製成的-印刷電路板 -電或光電總成包括至少—個電或光電組件。 -電組件可為具有一電總成之任何適當電路元件。較佳 而言，-電組件為一電阻器、電容器、電晶體、二極體、 放大…線或振盈器。電組件之任何適當數目及/或组 合可連接至電總成。 一’ 一電組件較佳經由一接合連接至一 Α . 導電線路。接合較佳 為一知接—、料結合、—線接合結合、一傳導性點合 1541l8.doc -20- 201204203 結合、一壓接連接或一壓入配合結合。熟習此項技術者已 知用於形成接合的適當焊接、炼焊、線接合、傳導性黏合 及壓入配合技術。更佳而言接合為—焊接結合、—溶焊: 合或一線接合結合，一焊接結合最佳。 :光電組件可為一組件，在該组件中在作用的開關、遽 :皮二调變器、放大器及可切換元件中電控制—電磁信號 (:即-光信號)。或者，一光電組件可為將電磁信號(亦即 先W)轉換為電信號及將電信號轉換為電磁信號的一组 件，諸如發光器、光偵測器及偵測器陣列。因组 件較佳為一發光二極體(LED)' —雷射咖、—光二極 體、一光電晶體、一光倍增器或—光電阻器。 — 熟習此項技術之人士將瞭解到，一光電組件可具有一電 輸入/輸出及一光輸入/輸出。電輸入/輸出可較佳經由上文 定義的一接合連接至—導電線路。光輸人/輸出可較㈣ 由一接合連接至一光導線路。 總成可視情況進一步包括一光組件…光組件可為一被 動組件”皮動組件可包含例如耦合器、分光器、y型分光 器、星型輕合器、光纖及光開關。光組件典型較佳經由一 接合連接至一光導線路。典型完全由—連 組件及存在情況下之接合。 1九 、可透過一主動或被動機械結構達成—光連接，該主動或 被動機械結構將組件與傳導性線路光對準並機械固定此等 在適當位置。或者，可使用黏合劑視情況以經選擇/受控 折射率進行一光連接。或者’可藉由將組件與傳導性線路 I54118.doc 21 · 201204203 溶融在-起而產生-光連接。或者，可例如藉由捧雜新材 料而修改材料之折射率來產生一新連接。或者可應用原位 適當材料增添來產生新的光幾何形狀。 在一個較佳實施例中，一電總成包括：一基板，其包括 —絕緣材料；複數個導電線路，其等存在於該基板之至少 -個表面4 ;至少一個電組件’其較佳藉由上文定義的至 少-個接合連接至至少—個導電線路；及—連續被覆層， 其包括一電槊聚合含氧聚合物，該電毁聚合含氣聚合物完 全覆蓋基板之該至少一個表面、複數個導電線路、至少— 個電，且件及存在情況下的至少—個接合。更佳而言，導電 線路包括至少一個外部接觸構件，料部接觸構件典型為 至少一個電接觸件，且亦由連續被覆層完全覆蓋該至少一 個外部接觸構件。 在另一較佳實施例中，一印刷電路板包括：一基板，其 包括一絕緣材料；複數個導電線路，其等存在於基板之i 少一個表面處，·至少一個電組件，其藉由至少一個焊接結 合、熔焊結合或線接合結合連接至至少一個導電線路；及 -連續被覆層，其包括一電渡聚合含說聚合物，該電毁聚 ;=聚σ物完全覆蓋基板之該至少一個表面、複數個導 至少一外部接觸構件、至少一個電組件及至少一 個焊接結合、炫焊結合或線接合結合。 在又一較佳實施例中，一印刷電路板包括··一基板，其 二括一絕緣材料；複數個導電線路，其等包括至少-個外 錢觸構件1等導電線路存在於基板之至少-個表面 】54n8.doc -22- 201204203 處；至少-個電組件，其藉由至少一個焊接結合、溶焊結 合或線接合結合連接至至少一個導電線路；及一連續被覆 層其包括一電漿聚合含氣聚合物，其包括—電浆聚合含 氟聚合物，該電敷聚合含氟聚合物完全覆蓋基板之該至少 一個表面、複數個導電線路、至少―個電組件及至少一個 焊接結合、熔焊結合或線接合結合。 連續之經電漿聚合之聚合物被覆層可能對被覆電或光 電件有用θ此，可用一連續被覆層完全覆蓋一電或光 電組件，該連續被覆層包括上述用於一電或光電總成的一 經電聚聚合之聚合物。可益+ ^物了#由使組件經受上述__被覆方法 而製備此經被覆組件。-經電浆聚合之聚合物被覆層可為 電或光電組件提供極佳的環境保護，且因此可在高價值組 件的㈣中尤其有用。一較佳實施例為用一連續被覆層完 全覆蓋之一電組件，該連锖姑# 遇、.只破覆層包括一電漿聚合含氟聚 合物。 經被覆之電或光電组件可尤 在不品要先將連續被覆層移除 的情況下連接至-電或光總成之至少—個傳導性線路，业 型而言係在藉由焊接或線接合連接一電組件之情形中。^ 此情!I ’▲大體上所有連續被覆層可保持完整並提供安裝 ，之環，保護，。或者’可藉由一電聚移除程序在一總成之 女裝之刖移除被覆層。 在某些貫施例中，上述之一經電漿聚合之聚合物可用於 保形被覆-電或光電總成或者—電或光電租件。 現將參考_中展示的實施例及參考實例描述本發明之 I54118.doc -23- 201204203 態樣’附圖中相同參考符號指示相同或類似組件。 圖式描述 圖1A展示一電漿聚合含氟聚合物之一 X射線光電光譜分 析結果。此圖顯示電漿聚合含氟聚合物包括一高比例之 CF3、CF及C-CF基團，指示—高度支鏈及交聯。圖1B展示 藉由標準聚合技術獲得的一含氟聚合物（亦即商業可購得 PTFE)之一 X射線光電光譜分析結果。此圖顯示藉由標準 聚合技術獲得的含氟聚合物主要含有CF2基團及可忽略比 例之CF3、CF及C-CF基團，指示極低程度之支鍵及交聯。 實例1中描述獲得此等結果之方法。 圖2A展示本發明之一電漿聚合含氟聚合物被覆層之一電 子顯微鏡影像及該被覆層之光滑物理性質。圖⑶展示藉由 標準聚合技術沈積的一 PTFE被覆層之一電子顯微鏡影 像，該電子顯微鏡影像具有可清楚看到小纖維的一結構。 圖3展示一電總成，其包括：一基板丨，其包括一絕緣材 料；複數個傳導性線路2，其等存在於基板丨之至少一個表 面處；電組件3，其連接至至少一個傳導性線路2 ;及一連 續被覆層4，其包括完全覆蓋基板！之該至少一個表面、複 數個傳導性線路2及電組件3的一經電漿聚合之聚合物。 圖4展示一t總成，其包括一基以，其包括一絕緣材 料；複數個傳導性線路2,其等存在於該基板丨之至少一個 表面處；電組件3，其藉由接合5連接至至少一個傳導性線 路2 ;及—連續被覆層4,其包括完全覆蓋基板丨之該至少 一個表面、複數個傳導性線路2、電組件3及接合5的一經 154118.doc •24· 201204203 電漿聚合之聚合物。 料圖1 展數Γ電總成’其包括：一基板卜纟包括-絕緣材 料，複數個傳導性線路2，其等存在於基板丨之至少一個表 :處；電組件3’其等連接至至少一個傳導性線路2; 一連 :被覆層4,其包括完全覆蓋基板i之該至少一個表面、複 ^個傳導性線路2、電組件3的—經錢聚合之聚合物；及 一第1外連續被覆層7,其包括完全覆蓋連續被覆層4之 一經電漿聚合之聚合物。 圖6展示-電總成’其包括：一基板！，其包括一絕緣材 料；複數個傳導性線路2,其等存在於基…之至少一個表 面處，電組件3，其等連接至至少-個傳導性線路2 ; -連 續被覆層4,其包括完全覆蓋基板r該至少—個表面、複 數個傳導性線路2、電組件3的一經電漿聚合之聚合物；及 一被覆層8,其在連續被覆層4之至少—部分與基板i之至 少一部分之間、複數個傳導性線路2與電組件3之間沈積環 氧樹脂、丙烯酸樹脂或聚矽氧樹脂。 圖7展示一電總成，纟包括—電總成，其包括：一基板 1，其包括一絕緣材料；複數個傳導性線路2，其等存在於 基板1之至少一個表面處；電組件3,其等藉由接合5連接 至至少一個傳導性線路2; —連續被覆層4,其包括完全覆 蓋基板1之該至少一個表面、複數個傳導性線路2、電組件 3的一經電漿聚合之聚合物；及一表面修整被覆層6，其包 括沈積於連續被覆層4與基板之該至少一個表面及複數個 傳導性線路2之間的齒代烴。電組件3透過表面修整被覆層 154118.doc •25- 201204203 6經由一接合5連接至傳導性線路2，該接合5靠抵表面修整 被覆層6。 圖8展示-光電總成，其包括：一基板i，其包括一絕緣 材料；複數個傳導性線路17、18，其等存在於基板丨之至 少一個表面處；光電組件19，其等連接至至少一個傳導性 線路17、18;及一連續被覆層4,其包括完全覆蓋基板 該至少一個表面、複數個傳導性線路丨7、丨8及電或光電組 件1 9之一經電漿聚合之聚合物。傳導性線路〗7為一光導線 路，諸如光纖。傳導性線路18為一導電線路。光互連21附 近之被覆層20之區域的折射率係經控制。 圖9展示一電組件15，用包括一經電漿聚合之聚合物16 之一連續被覆層完全覆蓋該電組件15。 圖10展示一設備之一實例，該設備可用於形成本發明之 經電漿聚合之聚合物被覆層。在此實例中，反應器9具有 連接至一真空系統11及一能源12之一腔室1 〇 ^藉由電漿將 離子化及/或分解前驅體化合物以形成活性物質丨3，接著 該等活性物質13在總成1 4表面反應以形成一連續之經電聚 聚合之聚合物被覆層。 圖11A、圖11B及圖11C係展示上述方法之某些實施例的 流程圖》 實例 實例1:電漿聚合氟代烴之XPS分析 用一電漿聚合氟代烴被覆環氧薄片基板。此薄片經裁剪 以產生大約1平方厘米的一採樣大小且導入至一 Thermo- 154118.doc -26- 201204203201204203 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to an electropolymerized polymer coating layer for coating electrical and photovoltaic assemblies and assemblies' and a method relating to the coating. [Prior Art] The conformal coating has been used for many years in the electronics industry to protect the electrical assembly from exposure in the environment during operation. - conformal coating" conforms to the contour of the PCB and its components with a protective lacquer - a thin, flexible layer. Conformal coating protection circuit Protects against corrosive chemicals (such as salts, solvents, gasoline, oil, acids, and environmental contaminants), moisture/condensation, vibration, electric leakage, electromigration, and multi-branched crystal growth. Current conformal coatings are typically 25 μηι to 2〇〇 4 claw thick and are typically based on epoxy, acrylic or polyoxynoxy resins. These materials are all deposited as a liquid that must be applied to the assembly and then cured. Expensive parylene has also recently been used as a conformal coating. Typical methods are used to deposit parylene using conventional chemical vapor deposition techniques well known to those skilled in the art. There are a number of related disadvantages to the conformal coating. The technique for depositing a coating requires shielding the contacts for attaching the assembly to other devices prior to coating to avoid conformal coating covering the contacts. The coated contacts are not electrically connectable to other devices because the conformal coating is thick and insulating. In addition, it is very difficult and expensive to remove the current conformal coating if reworking of the electrical assembly is required. It is impossible to weld or weld through the coating without prior removal. Furthermore, due to the liquid technology commonly used to deposit such conformal coatings by 154H8.doc 201204203, there is a tendency to form defects (such as foam) in the coating. These defects reduce the protection of the conformal coating. A further problem with prior art conformal coatings is that it is difficult to deposit the coating under the components on the assembly due to the liquid technology used during the coating. SUMMARY OF THE INVENTION The inventors have surprisingly discovered that plasma polymerized polymers can be used to form excellent conformal coatings on electrical and optoelectronic assemblies. These coating layers are not only continuous and substantially defect-free, but they also overcome the problems of the existing coatings described above. Furthermore, the plasma polymerized polymer coating of the present invention is readily deposited on devices and relatively inexpensive. Thus, the present invention provides an electrical or optoelectronic assembly comprising: a substrate comprising an insulating material; a plurality of conductive lines present on at least one surface of the substrate; at least one electrical or optoelectronic component connected Up to J a conductive line; and a continuous coating comprising a plasma polymer polymer that completely covers the at least one surface of the substrate, the plurality of conductive lines, and the at least one electrical or optoelectronic component. The present invention further provides a method comprising: (a) providing an electrical or optoelectronic assembly - the electrical or optoelectronic assembly comprising: a substrate comprising an insulating material; a plurality of conductive lines, the like being present on the substrate At least one surface, and at least one electrical or optoelectronic component coupled to at least one of the conductive traces' and (b) depositing a continuous coating by plasma polymerization, the continuous coating comprising a polymer, the polymer being completely covered The at least one surface of the substrate, the plurality of conductive lines, and the at least one electrical or optoelectronic component. The invention further provides a 154118.doc 201204203 electrical or optoelectronic assembly obtainable by the method as defined above. The invention further provides an electrical or optoelectronic component that can be completely covered by a continuous coating comprising a polymer polymerized by a plasma. The present invention further provides a method comprising: (4) subjecting an electrical or optoelectronic assembly as defined above to a plasma removal procedure such that the continuous coating is removed, and (b) reprocessing the condition as appropriate An electrical or optoelectronic assembly, and then optionally depositing an alternate continuous coating by plasma polymerization, the replacement continuous coating comprising a polymer that completely covers the at least one surface of the substrate, the plurality of conductive lines And the at least one electrical or optoelectronic component. The invention further provides a method comprising soldering through the continuous coating of an electrical or optoelectronic assembly as defined above to form a solder bond between another electrical or optoelectronic component and at least one conductive line, the solder bonding Rely on the continuous coating. The present invention further provides a method comprising: (4) subjecting an electro- or opto-electronic assembly to a plasma removal procedure such that the surface-retouching coating is removed, the electrical or optoelectronic assembly comprising: a substrate Including an insulating material; a plurality of conductive lines 'which are present on at least one surface of the substrate; the surface trimming the coating layer, # including a halogenated hydrocarbon polymer covering at least a portion of the plurality of conductive lines; At least one electrical or optoelectronic component that is connected to the at least-(four) conductive traces through the surface-trimming coating layer, and then (b) deposited by a plasma polymerization-continuous coating layer comprising the polymer defined above The polymer completely covers the at least one 154118.doc 201204203 surface of the substrate, the plurality of conductive lines, and the at least one electrical or optoelectronic component. The present invention further provides a method comprising: (a) subjecting an electrical or optoelectronic assembly to a plasma removal procedure such that the surface-retouching coating is removed, the electrical or optoelectronic assembly comprising: a substrate, the The substrate comprises an insulating material; a plurality of conductive lines are present on at least one surface of the substrate; the surface trimming the coating layer, comprising at least a halogenated hydrocarbon polymer covering the plurality of conductive lines, and then (b) connecting an electrical or optoelectronic component to at least one conductive line, and (c) depositing a continuous coating by plasma polymerization, the continuous coating comprising a polymer as defined above, the polymer being fully covered The at least one surface of the substrate, the plurality of conductive lines, and the at least one electrical or optoelectronic component. The invention further provides an electrical or optoelectronic assembly having a conformal coating layer. The conformal coating layer comprises a plasma polymerized polymer as defined above. The invention further provides the use of a plasma polymerized polymer as one of the conformal coatings for an electrical or optoelectronic assembly. The invention further provides a method for conformal coating of an electrical or optoelectronic assembly, the method comprising depositing a polymer as defined above by plasma polymerization. [Embodiment] The present invention is directed to electrical and optoelectronic assemblies. An electrical assembly typically includes at least one electrical component. An optoelectronic assembly typically includes at least one optoelectronic component, and optionally further includes at least one electrical component. An electrical or optoelectronic assembly is preferably a printed circuit board. 154118.doc • 6 - 201204203 The continuous coating of the present invention comprises a plasma polymerized polymer. The continuous coating of the present invention avoids environmental damage to the electrical or optoelectronic assembly. Environmental damage is typically caused by corrosion due to atmospheric constituents (e.g., oxygen S〇2, and/or n〇2) and/or surrounding moisture or high temperatures. In addition, the continuous coating of the present invention can continue to protect the electrical and optoelectronic assemblies it is applied at a temperature greater than the current conformal coating. The current conformal coating may degrade due to the temperature. The continuous coating layer of the present invention is preferably a conformal coating layer. The plasma polymerized polymer is a unique type of polymer which cannot be prepared by conventional polymerization methods. The plasma polymerized polymer has a highly disordered structure and is substantially highly crosslinked, which contains random branches and retains some reactive sites. Thus, the plasma polymerized polymer is chemically different from the polymer prepared by conventional polymerization methods known to those skilled in the art. Such chemical and physical differences are well known and described, for example, in Plasma Polymer Filmes, Hynek Biederman, Imperial College Press 20〇4. A polymer which is polymerized by electropolymerization is typically obtained by the electropolymerization technique as further detailed below. The plasma polymerized polymer is typically a plasma polymerized hydrocarbon, a hydrocarbon, a polyoxygen, a oxane, a decane, a decane or a stannane. The plasma polymerized hydrocarbon is typically a linear and/or branched polymer which optionally contains a cyclic group. These cyclic groups are preferably an aliphatic ring or an aromatic ring (more preferably an aromatic ring). Preferably, the plasma polymerized hydrocarbon does not contain any cyclic groups. Preferably, the plasma polymerized hydrocarbon is a branched polymer. The plasma polymerized toothed hydrocarbon is typically a linear chain containing a cyclic group as appropriate and / I54I18.doc 201204203 or a branched polymer. Preferably, the cyclic group is an aliphatic cycloaliphatic ring:). Preferably, the plasma polymerization smoke does not contain any cyclic groups (: preferably, the plasma polymerization halogenated hydrocarbon is a branched polymer. The plasma polymerization hydrocarbon and the tooth hydrocarbon including the aromatic group are respectively electric Feeding aromatic aromatic hydrocarbons and aromatic functional hydrocarbons (such as aromatic fluoro-tobacco). Example package I plasma: polystyrene and plasma polymerized parylene. Plasma polymerization polymerization: Diphenylbenzene is especially Preferably, the electropolymerized parylene may be unsubstituted or substituted with one or more substituents. Preferably, the preferred substituent comprises fluorine. Poly(p-xylene) substituted with one or more dentate atoms is a tooth. Substituted xylene. Poly(p-dimethyl phenyl) substituted with one or more I atoms is fluorodimethyl stupid. Unsubstituted polyparaxylene is the best. Plasma polymerized hydrocarbons optionally contain N, 〇, Si & Heterogeneous atoms. However, preferably, the plasma polymerized hydrocarbon does not contain N, 〇, 8 丨 and 卩 heterogeneous atoms. The plasma polymerization halogenated hydrocarbons optionally contain &N, 〇, Si &p selected heteroatoms. Preferably, however, the plasma polymerization of the hydrocarbon does not contain Ν, ο, 8 丨 and P heteroatoms. The hydrocarbon preferably comprises a carbonyl group, more preferably an ester and/or an amine group. The oxygen-containing plasma polymerized hydrocarbon polymer is preferably a polymerized acrylic polymer. The oxygenated plasma polymerized halogenated hydrocarbon is preferred. Including a carbonyl group, more preferably an ester and/or a guanamine group. One of the preferred classes of oxygenated plasma polymerized toothed hydrocarbon polymers is a plasma polymerized toothed acrylic polymer, such as a plasma polymerized fluoroacrylic polymer. 154118.doc 201204203 The nitrogen-containing plasma polymerized hydrocarbon preferably comprises a nitro group, an amine group, a guanamine group, an imidazole, an oxadiazole, a triazole and/or a tetrazole group. The nitrogen-containing plasma polymerization i-generation hydrocarbon preferably comprises a nitro group, an amine group, a guanamine group, an imidazole, a diazole, a triazole and/or a tetrazole group. Optionally, one or more fluorine atoms are used in place of the plasma polymerized polyoxo, oxane, decane and arsenic nitrogen. Preferably, however, the polyoxo, oxane, decane and decane are unsubstituted. Preferably, the decane is hexamethyldioxane. Preferably, the polymer is polymerized by plasma. For the plasma polymerization, the hydrocarbon is better, and 3 is the plasma polymerization gas. Preferably, the polymer is polymerized. Plasma-polymerized fluorinated hydrocarbons with and without heteroatoms. The term ^ used herein is preferably 1, gas, desert and broken. Fluorine and chlorine are preferred, fluorine is the best. Halogen has the same meaning. The assembly of the present invention is prepared by polymer depositing a polymer. The plasma concentrating is an effective technique for depositing a film coating layer. Usually, electro-destruction polymerization provides an excellent quality coating layer because the polymerization reaction occurs in situ. The polymer is usually deposited in a small recess that the normal liquid coating technique cannot reach in some cases, under the component, and through the hole. In addition, the in-situ formation of the polymer can be provided to the surface of the coating layer: - Because the polymer usually reacts with the surface during deposition. Because: In some cases, the polymer polymerized by the electric beam can be deposited on materials that cannot be deposited by other conformal coatings. One advantage is that there is no need for subsequent deposition of the drying/chemical cattle L |. The prior art of coating requires a drying/solidification' which results in the formation of cure/dry defects on the surface of the coating. Electricity 154118.doc 201204203 Slurry polymerization avoids the formation of solid defects/dry defects. Plasma deposition can be achieved in a reactor that produces a gas plasma that includes ionized gaseous ions, electrons, atoms, and/or neutral species. The reactor may comprise a chamber, a vacuum system and one or more energy sources, but any suitable type of reactor configured to produce a gas plasma may be used. The energy source can include any CJ device configured to convert one or more gases into gas plasma. Preferably, the energy source comprises a heater, a radio frequency (RF) generator and/or a microwave generator. In some embodiments, an electrical or optical assembly can be placed in a reactor chamber and a vacuum system can be used to pump the chamber to a pressure of 10 to 3 jaws to a range of (7) mbar. One or more gases $ can then be pumped into the chamber and this source can produce a stable gas plasma. One or more precursors can then be electropolymerized as a gas and/or liquid into the chamber. When introduced into a gas plasma, it is possible to ionize and/or decompose the precursor compound and to produce a range of active materials in the plasma for polymerization to produce a polymer coating. Preferably, the plasma-polymerized fluorinated hydrocarbon is obtained by plasma polymerization of one or more precursor compounds, which are hydrocarbon materials including fluorine atoms. Preferred hydrocarbon materials including fluorine atoms are perfluoroalkanes, perfluoroalkenes, perfluoroalkynes, fluoroalkanes, fluoroalkenes, fluoroalkynes. Examples include C3F6 and C4F8. Other preferred precursor compounds are fluoroalkanes, fluorochloroalkenes and fluorochloroalkynes. Examples include C2F3C1 and C2F4C12. Preferably, plasma-polymerized poly(p-nonylbenzene) can be obtained by plasma polymerization of p-xylene, stilbene or xylene with I54118.doc 201204203. The exact nature and composition of the electropolymerized polymer coating typically depends on one or more of the following conditions: (1) the selected plasma gas; (ii) the used terpene compound; (Π) precursor The amount of compound (this can be determined by the combination of precursor compound and flow rate pressure (iv) precursor compound ratio, (v) precursor compound order; (vi) plasma pressure; (νΗ) plasma drive frequency; (Wii) pulse Width timing; (ix) coating time; (χ) plasma power (including peak and / or average plasma power); (xi) chamber electrode configuration; and / or (xii) incoming assembly preparation. The electropolymer drive frequency is from 1 kHz to 1 GHz. Typically it is electropolymer. Power is 500 W to loooo We typically have a mass flow rate of 5 sccm to 2000 seem. Typically the operating pressure is 1 〇 ^ Τ οιτ to 500 mTorr Typically, the coating time is 10 seconds to 20 minutes. A pulsed plasma system can also be used. However, the skilled person will understand that the preferred conditions will depend on the size and geometry of the plasma chamber. Therefore, depending on the Specific plasma chamber The person can advantageously modify the operating conditions. The surface energy of the continuous coating layer can be carefully controlled by the precursor and plasma treatment conditions. The surface can be hydrophilic or hydrophobic depending on the specific plasma polymer. Preferably, a water contact angle greater than 90 degrees, and more preferably greater than 105 degrees, is preferred. A hydrophobic coating layer preferably exhibits a surface energy of less than 35 dynes/cm and more preferably less than 30 dynes/cm. In some cases, the hydrophobic nature of the continuous coating is highly desirable because it may reduce the likelihood of damage to an assembly due to moisture. However, in some cases, a hydrophilicity may be desirable. Coating layer. For example, a hydrophilic coating layer may be desirable if a further coating or label (such as a bar code) is applied to the continuous coating layer. It is generally easier to bond the additional coating layer to a hydrophilic coating layer. A hydrophilic coating Preferably, the layer exhibits a water contact angle of less than 70 degrees 'and more preferably less than 55 degrees. A hydrophilic coating layer preferably exhibits a maximum of 45 dynes/cm and is optimal. Surface energy greater than 50 dynes/cm. "Continuous" as used herein means that the coating is substantially free of defects. Possible defects include pores, cracks and cracks in the coating. Can be used in an electrical or optoelectronic assembly. The continuously polymerized polymer formed in situ forms a continuous coating layer. A continuous coating layer can be formed on all surfaces in contact with the plasma gas using the plasma polymerization method described hereinafter. This can be particularly advantageous when features such as those typically found on an electrical or optoelectronic assembly. "Using a plasma polymerization process can also allow the underhang to be covered by the coating. Typical continuous coatings. Having an average thickness of from 1 11111 to 1 ,, preferably from 1 nm to 5 μηι, more preferably from 5 11 〇 1 to 5 〇〇 nm, more preferably from 1 〇〇 to 300 00 nm, and even more preferably 15〇11〇1 to 25〇nm (for example, about 2 feet of claws). The thickness of a continuous coating may be substantially uniform or may vary from point to point. In a particular embodiment, the continuous coating layer can be deposited such that it conforms to the shape of the substrate, the conductive circuitry, and the three-dimensional surface of the component. The continuous coating completely covers at least one surface of a substrate, a plurality of conductive lines, and at least one electrical or optoelectronic component. Preferably, t, a coating 154H8.doc 12 201204203 layer encapsulates at least one surface of a substrate, a plurality of conductive lines, and an exposed portion of at least one electrical or optoelectronic component. The continuous coating layer can thus preferably be a conformal coating. A conformal coating layer conforms to cover at least one surface of the substrate, a plurality of conductive lines, and at least one electrical or optoelectronic component. For the avoidance of doubt, it is intended to take the same meaning as defined above with reference to the coating layer completely covering other objects as discussed below. The area of the electrical or optoelectronic assembly fully covered with a continuous coating may in some cases be part of a larger electrical or optoelectronic assembly that may not be covered by the remainder. A continuous coating can cause minimal changes in the electrical and/or optical performance of one of the assemblies it is applied to. For example, one of the circuit inductors in an assembly can be minimally affected only by the cladding. In some cases, this can be highly advantageous compared to other conformal coatings that typically significantly alter circuit properties, which may require changes in the properties of the assembly caused by other cladding layers when designing an assembly. In some cases, the coating of the present invention eliminates this requirement. If it is required to provide an extremely high degree of protection from the environment for the electrical or optoelectronic assembly, an additional continuous coating of the plasma polymerized polymer may be applied to the initial continuous coating. Thus, the electrical or optoelectronic assembly may further comprise a first additional continuous coating layer and optionally a second additional continuous coating layer comprising a plasma as defined above that completely covers the continuous coating layer A polymerized polymer, the second additional continuous coating layer comprising a plasma polymerized polymer as defined above that completely covers the first additional continuous coating layer. Additional additional continuous coatings (e.g., third to tenth continuous coating layers) of the electropolymerized polymer as defined above may be applied if desired. For each of the 154118.doc •13-201204203 plasma-polymerized polymers of the additional continuous coating layer may be independently the same or different from the plasma polymerized polymer of the starting continuous coating layer. Each additional continuous coating layer is typically deposited by a method for depositing a continuous coating. The precise nature of the initial continuous coating and any additional continuous coatings may be selected to improve or optimize the performance required by the coated assembly. For example, it may be desirable to have a hydrophobic coating as the initial coating to achieve Good water resistance. The plasma polymerized coating of the present invention can also be used to provide additional environmental protection for existing electrical or photovoltaic assemblies coated with another conformal coating. This may be advantageous in situations where a waterproof outer coating is required. Accordingly, the electrical or optoelectronic assembly can further include at least a portion of the continuous coating layer deposited on the plasma polymerized polymer and a substrate, a plurality of conductive lines, and at least one electrical or photovoltaic device, and at least a portion of the member One of epoxy resin, acrylic resin, polyoxin or parylene is coated. In some embodiments, the parylene coating layer can be deposited by a chemical vapor deposition process. Thus, an electrical or optoelectronic assembly can include: a substrate comprising: an insulating material; a plurality of conductive traces present on at least one surface of the substrate, to y electrical or optoelectronic components connected to at least one conductivity a circuit, an epoxy resin, an acrylic resin, a poly-xylene oxide or a parylene-coated layer on at least a portion of the substrate (which can be deposited by a conventional chemical vapor deposition method, etc.); and a continuous coating layer And comprising a plasma polymer polymer comprising: the at least one surface, a plurality of conductive lines, at least one electrical or photovoltaic component, and an epoxy resin, an acrylic resin, a polymer矽115.doc 201204203 coating of epoxy resin or parylene. Preferably, the coating of the epoxy resin, the acrylic resin, the polyoxynylene resin or the poly(p-xylylene) is a conformal coating layer by subjecting an electrical or optoelectronic assembly to a coating method as described herein. Preparing such an arrangement, the electrical or optoelectronic assembly comprising epoxy, acrylic, polyoxymethylene or polyparaphenyl condensate deposited on a substrate, a plurality of conductive lines, and at least a portion of at least one electrical or optoelectronic component One of the layers. A continuous coating may also be applied to an electrical or optoelectronic assembly carrying a halogenated hydrocarbon surface conditioning coating as described in WO 2008/102113, which is incorporated herein by reference. Thus, an electrical or metered electrical assembly can include a surface conditioning coating comprising a halogenated hydrocarbon polymer deposited between: (a) a continuous coating and a (1?) substrate. At least one surface and a plurality of conductive traces, wherein the surface trim coating covers at least a portion of the plurality of conductive traces, and the at least one electrical or optoelectronic component is coupled to the at least one conductive trace through the surface finish overlay. Preferably, the surface-modifying coating layer comprises a first-generation hydrocarbon polymer, more preferably an electropolymerized fluorohydrocarbon polymer. The electrical or optoelectronic assembly may also comprise: a substrate comprising: an insulating material; a plurality of conductive lines 'other than at least one surface of the substrate; at least one electrical or optoelectronic component connected to at least one conductivity a surface finishing coating layer comprising: a self-hydrocarbon polymer deposited on at least a portion of a plurality of conductive lines; and a continuous coating layer comprising - a plasma polymerized polymer, the plasma polymerization The polymer completely covers the substrate. Haizhi >, <Solid surface, a plurality of conductive lines, at least one 1541l8.doc -15 201204203 electrical or optoelectronic component and surface conditioning coating layer' wherein the at least one electrical or optoelectronic component is coupled to the at least one conductive line through the surface conditioning coating . Preferably, the electrical or optoelectronic component is coupled to the at least one conductive trace via a solder bond, a tantalum bond or a wire bond bond, and the solder bond, fusion bond or wire bond bond is applied to the surface to condition the cover layer. When an assembly comprises a surface conditioning coating or a coating of epoxy, acrylic or polyoxyl resin, the coating layer can be trimmed by having a suitable surface or having epoxy, acrylic or polyoxyl The assembly of one of the resin coating layers is subjected to one of the above coating methods to prepare the assembly. Similarly, an additional continuous coating layer is typically deposited by one of the above coating methods. A further advantage of the plasma polymerized coating layer is that, in some cases, the plasma polymerized coating layer can be easily removed by a plasma removal procedure. A plasma removal procedure includes the electrical layer being engraved to expose the underlying surface of the electrical or optoelectronic assembly. The cover layer may have a thickness of about 2 Å. The thickness of a conventional conformal coating that can be applied to an electrical or optoelectronic assembly using methods known in the prior art is typically between 25' and 2' (four). Due to the large volume of material to be removed, the current conformal coating removed by j may be abundance. Thus, an electrical or optoelectronic assembly as defined above may undergo an electro-destruction removal procedure. 4 The removal procedure typically removes substantially all of the continuous layers & in the case where it can typically remove an additional continuous coating. And, or surface finish all of the coating. The electropolymerization removal procedure typically involves placing an electrical or optoelectronic assembly in a plasma chamber and introducing a reactive gas plasma that chemically and/or physically bombards the surface of the coating to remove material and gradually etch back to the original Volt surface. 154118.doc 201204203 This program may be fast and inexpensive, so it is advantageous. The electrical or optoelectronic assembly of the removed cladding layer can then be reworked by further adding components or replacing existing components. Alternatively, the connection can be reworked if the connection between the conductive line and the component has been compromised. Once the reworking is complete, a replacement continuous coating comprising the polymer can optionally be deposited by plasma polymerization, the replacement continuous coating completely covering at least one surface of the substrate, the plurality of conductive lines, and the at least one electrical or optoelectronic component. Therefore, in some cases, a damaged electrical or optoelectronic assembly can be easily repaired. A further advantage of a plasma polymerized coating layer is that it may not be necessary to remove the coating layer during rework. This is because welding may be possible through the coating layer in some cases. In some cases, it is also possible to perform soldering through an initial coating layer and, where present, τ through the first and second additional coating layers of the __electric or optoelectronic assembly and/or a surface trim coating layer in another An electrical or optoelectronic component forms a solder bond with at least one of the conductive traces. The weld bond is secure against the continuous coating and, where present, the coating is applied against the first and second additional coating layers and/or surfaces. An advance-step application involves the removal of one of the above surface conditioning coatings by an electrical slurry procedure followed by the deposition of the above-described plasma polymerized polymer. Alternatively - the application comprises the removal of a surface conditioning coating by a plasma removal procedure followed by the attachment of an electrical or optoelectronic component to a conductive line followed by deposition of the plasma polymerized polymer described above. The electrical or optoelectronic assembly may comprise a plurality of conductive lines, which may be conductive or light guiding lines. π 154118.doc 201204203 A conductive line typically includes any suitable electrically conductive material. Preferably, a conductive trace comprises gold, tungsten, copper, silver, a semiconductor doped region substrate, a conductive polymer, and/or a conductive ink. More preferably, the conductive lines include: gold, tungsten, copper, silver or imprint. The appropriate shape and configuration for the conductive line can be selected for a particular assembly to be determined by those skilled in the art. Typically, a conductive trace is attached to the surface of the substrate along the full length of the substrate. Alternatively, a conductive line can be attached to the substrate at two or more points. For example, a conductive line can be attached to one of the substrates at two or more points but not along the full length of the substrate. A conductive line is typically formed on a substrate using any suitable method known to those skilled in the art. In a preferred method, a "deduction" technique is used to form a conductive trace on a substrate. In this method, a layer of metal (e.g., copper foil, aluminum foil, etc.) is typically bonded to one surface of the substrate and then the undesired portions of the metal layer are removed leaving the desired conductive traces. Undesirable portions of the metal layer are typically removed from the substrate by chemical etching or photolithography, milling. In an alternate preferred method, a "additive" technique (such as, for example, electroplating, deposition using a reverse mask, and/or any geometrically controlled deposition procedure) is used to form a conductive trace on the substrate. Alternatively, the substrate can be a germanium die or wafer, typically having a doped region as a conductive trace. - The light guiding line typically comprises any suitable light guiding material. Preferably, a light guiding circuit is an optical waveguide, which typically comprises a light transmissive material that changes one of the refractive indices for propagating electromagnetic radiation through a desired path. Applying a cladding layer or a boundary layer to a light transmissive material to produce a waveguide, wherein the sacrificial or boundary layer is made of a material having a different refractive index. Alternatively, the light may be doped or modified. The material is transmissive to create a region of variable refractive index to create a waveguide. Thus the waveguide can be a freestanding component or a feature integrated into a substrate. Typical light transmissive materials are glass, doped glass, and plastic. Include only a mixture of conductive lines, only light-guiding lines or conductive lines and optionally light-guiding lines. Where multiple conductive lines are present, each line may be made of the same material as defined above and/or have the same shape, or Alternatively, various line materials and/or line shapes may be present. In the presence of multiple light guide lines, each line may be The same materials are defined and/or have the same shape, or instead of various wiring materials and/or line shapes. The plurality of conductive lines may further comprise at least one external contact member. The continuous coating layer preferably completely covers the at least one exterior Contact member The precise nature of the external contact member may depend on the nature of the assembly and the means in which it is desired to be contacted. Suitable contacts may be routinely selected by those skilled in the art. Typically, the external contact member is an electrical or optical contact. The external contact member can be a plurality of conductive lines - the portion H external contact member can be an electrical or optical connection to one of the at least one conductive line. A plasma polymerized coating layer can permit an electrical connection between: The connection does not require the early removal of the continuous coating layer: (a) an external contact member, which is preferably an electrical contact, and (8) a corresponding contact on the external device. The coating layer allows for the early removal of a ", without the need for a continuous coating layer between: (4) - external connection: Even 154118.doc -19- 201204203 optical contact element is preferably a 'and (b) the corresponding contact member of an external device. Therefore, it may not be necessary in any case to shield the outer contact member of the assembly in the case where the plasma polymerized coating layer is formed. In some cases, this may be advantageous because the shading of the external contact members can be time consuming and expensive. An electrical or optoelectronic assembly can include a substrate that can include an insulating material. The substrate typically includes any suitable insulating material that prevents the substrate from shorting the electrical or optoelectronic assembly circuitry. Therefore, in an electrical assembly, the substrate is preferably electrically insulated. In the optoelectronic assembly, the I plate is preferably both electrically and optically insulated. The substrate preferably comprises an epoxy sheet material, an artificial resin bonding paper, an epoxy bonded glass fiber cloth (ERBGH), a composite epoxy material (cem), a PTFE (Teflon) or other polymer material, and a phenolic tissue paper. , enamel, glass, ceramic, paper, cardboard, natural and / or artificial wood materials and / or other suitable textiles. The substrate further includes a flame retardant material, typically flame retardant 2 (FR 2) and/or flame retardant 4 (FR 4), as appropriate. The remainder may include - a single layer of insulating material or multiple layers of the same or different insulating materials. It can be a plate made of any of the materials listed above (PCB). - Printed circuit board - The electrical or optoelectronic assembly comprises at least one electrical or optoelectronic component. The electrical component can be any suitable circuit component having an electrical assembly. Preferably, the electrical component is a resistor, capacitor, transistor, diode, amplifier... line or oscillator. Any suitable number and/or combination of electrical components can be coupled to the electrical assembly. An 'an electrical component is preferably connected to a conductive line via a bond. Preferably, the bonding is a bonding, a material bonding, a wire bonding bonding, a conductive bonding 1541l8.doc -20-201204203 bonding, a crimping connection or a press-fitting bonding. Suitable welding, welding, wire bonding, conductive bonding, and press-fitting techniques for forming joints are known to those skilled in the art. More preferably, the joint is a weld joint, a weld weld: a joint or a one-wire joint, and a weld joint is optimal. The optoelectronic component can be a component in which the electrical control (electromagnetic signal) (ie, the optical signal) is electrically controlled in the active switch, the snubber, the amplifier, and the switchable component. Alternatively, an optoelectronic component can be a group of components that convert electromagnetic signals (i.e., first W) into electrical signals and electrical signals into electromagnetic signals, such as illuminators, photodetectors, and detector arrays. The component is preferably a light emitting diode (LED)' - a laser coffee, a light diode, a photoelectric crystal, a photomultiplier or a photo resistor. - Those skilled in the art will appreciate that an optoelectronic component can have an electrical input/output and an optical input/output. The electrical input/output may preferably be connected to the conductive line via a bond as defined above. The light input/output can be connected to a light guide line by a joint (4). The assembly may further include an optical component... the optical component may be a passive component. The telesurgical component may include, for example, a coupler, a beam splitter, a y-type beam splitter, a star-type light combiner, an optical fiber, and an optical switch. Preferably, it is connected to a light-guiding line via a joint. Typically, it is completely connected by the assembly and the existing condition. 1. The optical connection can be achieved through an active or passive mechanical structure, which combines components and conductivity. The line light is aligned and mechanically fixed in place. Alternatively, an optical connection may be made with a selected/controlled refractive index, as appropriate, or by means of a component and conductive line I54118.doc 21 201204203 is melted in - resulting in a light connection. Alternatively, a new connection can be created by modifying the refractive index of the material, for example, by holding a new material, or applying a suitable material addition in situ to create a new light geometry. In a preferred embodiment, an electrical assembly includes: a substrate including an insulating material; a plurality of conductive lines, etc. present in at least one of the substrates Face 4; at least one electrical component 'which is preferably connected to at least one conductive trace by at least one bond as defined above; and a continuous coating layer comprising an electropolymerized oxygen-containing polymer, the electro-destructive polymerization The gas-containing polymer completely covers the at least one surface of the substrate, the plurality of conductive traces, at least one of the electrical, and at least one of the components and, in the present case, more preferably, the conductive trace includes at least one external contact member. The portion of the contact member is typically at least one electrical contact, and the continuous contact layer also completely covers the at least one external contact member. In another preferred embodiment, a printed circuit board includes: a substrate comprising an insulating material; a plurality of conductive lines, which are present at one surface of the substrate, at least one electrical component connected to the at least one conductive line by at least one solder bond, fusion bond bond or wire bond bond; and - continuous coating layer , comprising a ferropolymer comprising a polymer, the electrical decomposing; = poly σ completely covering the at least one surface of the substrate, the plurality of guiding at least one outer a contact member, at least one electrical component, and at least one solder bond, solder joint or wire bond bond. In still another preferred embodiment, a printed circuit board includes a substrate, which includes an insulating material; Conductive lines, etc., including at least one outer conductive member 1 and other conductive lines present on at least one surface of the substrate 54n8.doc -22- 201204203; at least one electrical component, which is bonded and dissolved by at least one solder a solder bond or wire bond bond to the at least one conductive trace; and a continuous coating layer comprising a plasma polymerized gas-containing polymer comprising a plasma polymerized fluoropolymer, the electrocoat polymerized fluoropolymer completely covered The at least one surface of the substrate, the plurality of electrically conductive lines, the at least one electrical component, and the at least one solder bond, fusion bond bond, or wire bond bond. The continuous plasma polymerized polymer coating layer may be useful for coated electrical or optoelectronic components θ, a continuous coating layer may be used to completely cover an electrical or optoelectronic component, the continuous coating layer comprising the above-mentioned electropolymerization for an electrical or optoelectronic assembly. Compounds.益益^^物# This coated component was prepared by subjecting the assembly to the above-described __ coating method. - The polymerized polymer coating provides excellent environmental protection for electrical or optoelectronic components and is therefore particularly useful in (4) of high value components. A preferred embodiment is to completely cover an electrical component with a continuous coating layer comprising a plasma polymerized fluoropolymer. The coated electrical or optoelectronic component can be connected to at least one conductive line of the -electric or optical assembly, especially if the continuous coating is removed, in the case of welding or wire In the case of joining an electrical component. ^ This situation! I ▲ ▲ In general, all continuous coatings can remain intact and provide installation, ring, protection. Alternatively, the coating layer can be removed by a power gathering removal procedure at the end of the assembly. In some embodiments, one of the above plasma polymerized polymers can be used in conformal coated electrical or optoelectronic assemblies or - electrical or optoelectronic rentals. The same reference numerals will be used to refer to the same or similar components in the drawings. The same reference numerals will be used to refer to the embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1A shows the results of an X-ray photoelectron spectroscopy analysis of a plasma polymerized fluoropolymer. This figure shows that the plasma polymerized fluoropolymer comprises a high proportion of CF3, CF and C-CF groups, indicating - highly branched and crosslinked. Figure 1B shows the results of X-ray photoelectron spectroscopy of one of the fluoropolymers (i.e., commercially available PTFE) obtained by standard polymerization techniques. This figure shows that the fluoropolymer obtained by standard polymerization techniques contains mainly CF2 groups and negligible ratios of CF3, CF and C-CF groups, indicating extremely low degree of bonding and crosslinking. The method of obtaining such results is described in Example 1. Figure 2A shows an electron microscope image of a plasma polymerized fluoropolymer coating of the present invention and the smooth physical properties of the coating. Figure (3) shows an electron microscope image of a PTFE coating deposited by standard polymerization techniques, which has a structure in which small fibers are clearly visible. 3 shows an electrical assembly comprising: a substrate stack comprising an insulating material; a plurality of conductive traces 2 present at at least one surface of the substrate stack; and an electrical component 3 coupled to the at least one conductive Line 2; and a continuous coating 4, which includes a completely covered substrate! The at least one surface, the plurality of conductive lines 2, and a plasma polymerized polymer of the electrical component 3. 4 shows a t-assembly comprising a substrate comprising an insulating material; a plurality of conductive traces 2 present at at least one surface of the substrate stack; and an electrical component 3 connected by a bond 5 And at least one conductive line 2; and a continuous coating layer 4, comprising at least one surface completely covering the substrate, a plurality of conductive lines 2, electrical components 3, and a joint 5 of 154118.doc • 24· 201204203 Slurry polymerized polymer. 1 shows an array of electric assemblies </ RTI> comprising: a substrate comprising: an insulating material, a plurality of conductive lines 2, etc. present in at least one of the substrates: a portion; the electrical component 3' is connected to At least one conductive line 2; a connection: a coating layer 4 comprising: at least one surface completely covering the substrate i, a plurality of conductive lines 2, a polymerized polymer of the electrical component 3; and a first outer A continuous coating layer 7 comprising a polymer that completely covers one of the continuous coating layers 4 by plasma polymerization. Figure 6 shows an electric assembly 'which includes: a substrate! , comprising an insulating material; a plurality of conductive lines 2, which are present at at least one surface of the substrate, an electrical component 3, which is connected to at least one of the conductive lines 2; a continuous coating layer 4, comprising Fully covering the substrate r of the at least one surface, the plurality of conductive lines 2, a plasma polymerized polymer of the electrical component 3; and a coating layer 8 at least in part of the continuous coating layer 4 and at least a portion of the substrate i An epoxy resin, an acrylic resin or a polyoxymethylene resin is deposited between a portion of the plurality of conductive lines 2 and the electrical component 3. 7 shows an electric assembly, including an electric assembly, comprising: a substrate 1 including an insulating material; a plurality of conductive lines 2, which are present at at least one surface of the substrate 1; the electrical component 3 Connected to at least one conductive line 2 by a joint 5; a continuous coating layer 4 comprising a plasma-polymerized layer of the at least one surface, the plurality of conductive lines 2, and the electrical components 3 that completely cover the substrate 1. a polymer; and a surface finish coating layer 6 comprising a toothed hydrocarbon deposited between the continuous coating layer 4 and the at least one surface of the substrate and the plurality of conductive lines 2. The electrical component 3 is through the surface-trimming coating layer 154118.doc • 25- 201204203 6 is connected to the conductive line 2 via a joint 5 which trims the coating layer 6 against the surface. Figure 8 shows a photovoltaic assembly comprising: a substrate i comprising an insulating material; a plurality of conductive lines 17, 18 present at at least one surface of the substrate; an optoelectronic component 19, etc. connected to At least one conductive line 17, 18; and a continuous coating layer 4 comprising a polymer layer that completely covers the substrate, the at least one surface, the plurality of conductive lines 丨7, 丨8, and one of the electrical or optoelectronic components 197 Things. Conductive line 7 is an optical conductor such as an optical fiber. Conductive line 18 is a conductive line. The refractive index of the region of the coating layer 20 in the vicinity of the optical interconnect 21 is controlled. Figure 9 shows an electrical component 15 that completely covers the electrical component 15 with a continuous coating comprising a plasma polymerized polymer 16. Figure 10 shows an example of a device that can be used to form the plasma polymerized polymer coating of the present invention. In this example, the reactor 9 has a chamber 1 connected to a vacuum system 11 and an energy source 12 to ionize and/or decompose the precursor compound by plasma to form an active material 丨3, which is then The active material 13 reacts on the surface of the assembly 14 to form a continuous electropolymerized polymer coating. 11A, 11B, and 11C are flow diagrams showing certain embodiments of the above method. Example 1: XPS analysis of plasma-polymerized fluorinated hydrocarbons A plasma-polymerized fluorohydrocarbon coated epoxy sheet substrate was used. The sheet is cut to produce a sample size of approximately 1 square centimeter and introduced into a Thermo- 154118.doc -26- 201204203
Scientific ESCALAB 250 X射線光電光譜之一採樣腔室 中。 j 將腔室泵抽減壓至1 〇 -1 〇 To r r之一作業壓力且接著將樣本 轉移至分析腔室。一單色X射線光束入射於表面上且收集 並分析樣本發射的光電子。 進行一寬彳5说知描以掘取表面上之全部元件，且接著進 行進一步C1峰值之高解析度掃描以判定峰值之細微結構及 樣本之化學結構》 圖1A中顯示結果。 實例2 :經被覆總成之製備 流程1至流程1 〇中使用下列表1中顯示的前驅體及電锻聚 合條件被覆總成。 流程 前驅體 流量(seem) 功率(kw) 基本壓力(mTorr) 生長時間(分鐘） 1 c3f6 100 0.8 50 7 2 c3f6 100 2.4 50 7 7 3 c3f6 100 4.8 50 4 c3f6 400 0.8 50 7 5 c3f6 400 2.4 50 7 6 c3f6 400 4.8 50 7 7 c4f8 100 2.4 50 in 8 c4f8 100 2.4 50 10 9 c2f3c, 100 2.4 50 10 10 C2F4C12 100 2.4 50 10 表1 實例3:電漿移除程序 將已用一電漿聚合氟代烴被覆的一電總成導入一電聚腔 至中。將腔室栗抽減壓至250 mTorr之一作業壓力且將氧 154118.doc •27- 201204203 氣氣體以2500 seem之一流動速率導入。容許氣體流動通 過腔室30秒並接著以40 kHz之一頻率及3 kw之一功率導通 電漿產生器。總成曝露於活性電漿長達5分鐘之一時段， 此後電漿產生器關閉且腔室恢復至大氣壓力。 從電襞腔室移除總成且使用一 Bruker FTIR光譜驗證電 漿聚合物被覆層之移除。1250 nm處特性c_F拉伸波峰的缺 乏指示已完全移除含氟聚合物。 【圖式簡單說明】 圖1A展示一電漿聚合含氟聚合物之一 X射線光電光譜分 析結果。 圖1B展示藉由標準聚合技術獲得的一含氟聚合物（亦即 商業可購得PTFE)之一 X射線光電光譜分析結果。 圖2 A展示本發明之一電漿聚合含氟聚合物被覆層之一電 子顯微鏡影像及該被覆層之光滑物理性質。 圖2B係藉由標準聚合技術沈積的一 PTFE被覆層之一電 子顯微鏡影像’該電子顯微鏡影像具有可清楚看到小纖維 的一結構。 圖3至圖7展示某些實施例之電總成。 圖8展示一光電總成。 圖9展示一電組件。 圖10展示一設備之一實例，該設備可用於形成本發明之 經電漿聚合之聚合物被覆層。 圖ΠΑ '圖11B及圖11C係流程圖，其等展示所描述方法 之某些實施例。 154118.doc • 28· 201204203 【主要元件符號說明】 1 基板 2 傳導性線路 3 電組件 4 連續被覆層 5 接合 6 表面修整被覆層 7 第一額外連續被覆層 8 被覆層 9 反應器 10 腔室 11 真空系統 12 能源 13 活性物質 14 總成 15 電組件 16 經電漿聚合之聚合物 17 傳導性線路 18 傳導性線路 19 光電總成 20 被覆層 21 光互連 154118.doc -29-Scientific ESCALAB 250 X-ray photoelectron spectroscopy in one of the sampling chambers. j Pump the chamber to a working pressure of 1 〇 -1 〇 To r r and then transfer the sample to the analysis chamber. A monochromatic X-ray beam is incident on the surface and collects and analyzes the photoelectrons emitted by the sample. A wide 彳5 description is made to dig all the components on the surface, and then a high resolution scan of the further C1 peak is performed to determine the fine structure of the peak and the chemical structure of the sample. The results are shown in Fig. 1A. Example 2: Preparation of coated assembly Processes 1 to 1 were used to coat the precursors using the precursors shown in Table 1 below and the electric forging polymerization conditions. Process precursor flow (seem) Power (kw) Base pressure (mTorr) Growth time (minutes) 1 c3f6 100 0.8 50 7 2 c3f6 100 2.4 50 7 7 3 c3f6 100 4.8 50 4 c3f6 400 0.8 50 7 5 c3f6 400 2.4 50 7 6 c3f6 400 4.8 50 7 7 c4f8 100 2.4 50 in 8 c4f8 100 2.4 50 10 9 c2f3c, 100 2.4 50 10 10 C2F4C12 100 2.4 50 10 Table 1 Example 3: Plasma removal procedure A plasma is used to polymerize fluorine An electrical assembly coated with a hydrocarbon is introduced into an electrical polymerization chamber to the middle. The chamber is pumped to a working pressure of 250 mTorr and oxygen gas 154118.doc • 27-201204203 gas is introduced at a flow rate of 2500 seem. The gas flow is allowed to pass through the chamber for 30 seconds and then the plasma generator is turned on at one of 40 kHz and one of 3 kw. The assembly is exposed to the active plasma for a period of up to 5 minutes, after which the plasma generator is turned off and the chamber is returned to atmospheric pressure. The assembly was removed from the chamber and the removal of the plasma polymer coating was verified using a Bruker FTIR spectroscopy. A lack of characteristic c_F stretching peak at 1250 nm indicates that the fluoropolymer has been completely removed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A shows the results of X-ray photoelectron spectroscopy analysis of a plasma-polymerized fluoropolymer. Figure 1B shows the results of X-ray photoelectron spectroscopy analysis of one of the fluoropolymers (i.e., commercially available PTFE) obtained by standard polymerization techniques. Figure 2A shows an electron microscope image of a plasma polymerized fluoropolymer coating of the present invention and the smooth physical properties of the coating. Figure 2B is an electron microscope image of a PTFE coating deposited by standard polymerization techniques. The electron microscope image has a structure in which small fibers are clearly visible. 3 through 7 show an electrical assembly of certain embodiments. Figure 8 shows an optoelectronic assembly. Figure 9 shows an electrical component. Figure 10 shows an example of a device that can be used to form the plasma polymerized polymer coating of the present invention. Figure 11B and Figure 11C are flowcharts showing certain embodiments of the described methods. 154118.doc • 28· 201204203 [Main component symbol description] 1 Substrate 2 Conductive line 3 Electrical component 4 Continuous coating layer 5 Bonding 6 Surface finishing coating layer 7 First additional continuous coating layer 8 Coating layer 9 Reactor 10 Chamber 11 Vacuum system 12 Energy 13 Active material 14 Assembly 15 Electrical component 16 Polymer polymerized by plasma 17 Conductive line 18 Conductive line 19 Photoelectric assembly 20 Coating 21 Optical interconnection 154118.doc -29-