JP6085480B2 - プラズマ重合ポリマーコーティング - Google Patents
プラズマ重合ポリマーコーティング Download PDFInfo
- Publication number
- JP6085480B2 JP6085480B2 JP2012554405A JP2012554405A JP6085480B2 JP 6085480 B2 JP6085480 B2 JP 6085480B2 JP 2012554405 A JP2012554405 A JP 2012554405A JP 2012554405 A JP2012554405 A JP 2012554405A JP 6085480 B2 JP6085480 B2 JP 6085480B2
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- JP
- Japan
- Prior art keywords
- electro
- coating
- substrate
- plasma
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000576 coating method Methods 0.000 title claims description 216
- 239000011248 coating agent Substances 0.000 title claims description 180
- 229920000642 polymer Polymers 0.000 title claims description 95
- 239000000758 substrate Substances 0.000 claims description 98
- 238000000034 method Methods 0.000 claims description 66
- 239000005002 finish coating Substances 0.000 claims description 41
- 239000011810 insulating material Substances 0.000 claims description 25
- 150000005826 halohydrocarbons Chemical class 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000000151 deposition Methods 0.000 claims description 19
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920002050 silicone resin Polymers 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 description 31
- 230000003287 optical effect Effects 0.000 description 28
- 239000000463 material Substances 0.000 description 22
- 239000007789 gas Substances 0.000 description 14
- 239000002243 precursor Substances 0.000 description 14
- 229930195733 hydrocarbon Natural products 0.000 description 13
- 150000002430 hydrocarbons Chemical class 0.000 description 13
- 230000000712 assembly Effects 0.000 description 12
- 238000000429 assembly Methods 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 12
- 239000004215 Carbon black (E152) Substances 0.000 description 11
- 229920002313 fluoropolymer Polymers 0.000 description 11
- 239000004811 fluoropolymer Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 125000001153 fluoro group Chemical group F* 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- 125000005842 heteroatom Chemical group 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 150000001408 amides Chemical group 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000000635 electron micrograph Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- -1 aromatic halohydrocarbons Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000011187 composite epoxy material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- ZYMKZMDQUPCXRP-UHFFFAOYSA-N fluoro prop-2-enoate Chemical compound FOC(=O)C=C ZYMKZMDQUPCXRP-UHFFFAOYSA-N 0.000 description 2
- 239000004446 fluoropolymer coating Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- SFDJOSRHYKHMOK-UHFFFAOYSA-N nitramide Chemical compound N[N+]([O-])=O SFDJOSRHYKHMOK-UHFFFAOYSA-N 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000003831 tetrazolyl group Chemical group 0.000 description 2
- DQJCHOQLCLEDLL-UHFFFAOYSA-N tricyclazole Chemical compound CC1=CC=CC2=C1N1C=NN=C1S2 DQJCHOQLCLEDLL-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- OOLUVSIJOMLOCB-UHFFFAOYSA-N 1633-22-3 Chemical group C1CC(C=C2)=CC=C2CCC2=CC=C1C=C2 OOLUVSIJOMLOCB-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- XPBBUZJBQWWFFJ-UHFFFAOYSA-N fluorosilane Chemical compound [SiH3]F XPBBUZJBQWWFFJ-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- 238000010952 in-situ formation Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 125000002346 iodo group Chemical group I* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- KXCAEQNNTZANTK-UHFFFAOYSA-N stannane Chemical compound [SnH4] KXCAEQNNTZANTK-UHFFFAOYSA-N 0.000 description 1
- 229910000080 stannane Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/16—Chemical modification with polymerisable compounds
- C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- General Chemical & Material Sciences (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Polymerisation Methods In General (AREA)
- Non-Insulated Conductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Led Device Packages (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB1003067.4A GB201003067D0 (en) | 2010-02-23 | 2010-02-23 | Plasma-polymerized polymer coating |
GB1003067.4 | 2010-02-23 | ||
PCT/GB2011/000238 WO2011104500A1 (en) | 2010-02-23 | 2011-02-21 | Plasma-polymerized polymer coating |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013527973A JP2013527973A (ja) | 2013-07-04 |
JP2013527973A5 JP2013527973A5 (pt) | 2014-03-06 |
JP6085480B2 true JP6085480B2 (ja) | 2017-02-22 |
Family
ID=42114258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012554405A Active JP6085480B2 (ja) | 2010-02-23 | 2011-02-21 | プラズマ重合ポリマーコーティング |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP2539392A1 (pt) |
JP (1) | JP6085480B2 (pt) |
KR (1) | KR101778820B1 (pt) |
CN (2) | CN102791779A (pt) |
BR (1) | BR112012021172A2 (pt) |
GB (1) | GB201003067D0 (pt) |
TW (1) | TWI547221B (pt) |
WO (1) | WO2011104500A1 (pt) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5693515B2 (ja) * | 2012-01-10 | 2015-04-01 | エイチズィーオー・インコーポレーテッド | 内部耐水性被覆を備える電子デバイス |
EP2822705B1 (en) * | 2012-03-06 | 2016-09-07 | Semblant Limited | Coated electrical assembly |
GB2510213A (en) * | 2012-08-13 | 2014-07-30 | Europlasma Nv | Forming a protective polymer coating on a component |
US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
GB201305500D0 (en) * | 2013-03-26 | 2013-05-08 | Semblant Ltd | Coated electrical assembly |
US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
CN103701963B (zh) * | 2013-12-30 | 2017-05-10 | 惠州Tcl移动通信有限公司 | 一种移动终端的防水处理方法及移动终端 |
KR20160145062A (ko) | 2014-04-09 | 2016-12-19 | 코닝 인코포레이티드 | 디바이스 변경된 기판 물품 및 제조 방법 |
CN104320920B (zh) * | 2014-10-13 | 2017-05-10 | 北京卫星制造厂 | 一种基于低内应力的电子产品涂覆方法 |
JP2018524201A (ja) | 2015-05-19 | 2018-08-30 | コーニング インコーポレイテッド | シートをキャリアと結合するための物品および方法 |
AU2016275277A1 (en) * | 2015-06-09 | 2018-02-01 | P2I Ltd | Coating |
GB2539231B (en) * | 2015-06-10 | 2017-08-23 | Semblant Ltd | Coated electrical assembly |
WO2016209897A1 (en) | 2015-06-26 | 2016-12-29 | Corning Incorporated | Methods and articles including a sheet and a carrier |
GB201601221D0 (en) * | 2016-01-22 | 2016-03-09 | Semblant Ltd | Coated electrical assembly |
JP6750252B2 (ja) * | 2016-02-29 | 2020-09-02 | 日亜化学工業株式会社 | 発光装置の製造方法 |
TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
TWI810161B (zh) | 2016-08-31 | 2023-08-01 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
GB201621177D0 (en) * | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
CN110720131B (zh) | 2017-07-03 | 2022-05-31 | 京瓷Avx元器件公司 | 固体电解质电容器组件 |
US11257628B2 (en) | 2017-07-03 | 2022-02-22 | KYOCERA AVX Components Corporation | Solid electrolytic capacitor containing a nanocoating |
CN107587119B (zh) * | 2017-08-23 | 2018-11-13 | 江苏菲沃泰纳米科技有限公司 | 一种复合结构高绝缘硬质纳米防护涂层的制备方法 |
CN107587120B (zh) * | 2017-08-23 | 2018-12-18 | 江苏菲沃泰纳米科技有限公司 | 一种具有调制结构的高绝缘纳米防护涂层的制备方法 |
US11389825B2 (en) | 2017-08-23 | 2022-07-19 | Jiangsu Favored Nanotechnology Co., LTD | Methods for preparing nano-protective coating with a modulation structure |
CN107686986B (zh) * | 2017-08-23 | 2018-12-18 | 江苏菲沃泰纳米科技有限公司 | 一种调制结构的有机硅纳米防护涂层的制备方法 |
CN109686672A (zh) * | 2017-10-18 | 2019-04-26 | 上海稷以科技有限公司 | 在物体表面形成保护层的方法及表面形成有保护层的产品 |
WO2019118660A1 (en) | 2017-12-15 | 2019-06-20 | Corning Incorporated | Method for treating a substrate and method for making articles comprising bonded sheets |
CN109686802A (zh) * | 2018-11-09 | 2019-04-26 | 惠州凯珑光电有限公司 | 一种电子元器件和模组的封装工艺 |
CN110665768B (zh) * | 2019-07-26 | 2022-04-26 | 江苏菲沃泰纳米科技股份有限公司 | 防水纳米膜及其制备方法、应用和产品 |
KR102362271B1 (ko) * | 2019-10-16 | 2022-02-14 | 이정훈 | 회로 기판용 보호 코팅 조성물 |
KR20230021125A (ko) * | 2020-06-09 | 2023-02-13 | 지앙수 페이보레드 나노테크놀로지 컴퍼니., 리미티드 | 보호 코팅 및 그 제조 방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63311793A (ja) * | 1987-06-12 | 1988-12-20 | Sumitomo Electric Ind Ltd | フレキシブル配線板の製造方法 |
JPS6489389A (en) * | 1987-09-29 | 1989-04-03 | Sumitomo Electric Industries | Manufacture of flexible printed wiring board |
JPH06244316A (ja) * | 1993-02-19 | 1994-09-02 | Sony Corp | 半導体装置、その製造方法及びその製造装置 |
FR2726151B1 (fr) * | 1994-10-25 | 1996-11-29 | Europ Composants Electron | Procede et dispositif de protection hermetique de circuit electronique |
DE10114897A1 (de) * | 2001-03-26 | 2002-10-24 | Infineon Technologies Ag | Elektronisches Bauteil |
CN1770340A (zh) * | 2004-11-05 | 2006-05-10 | 力毅国际有限公司 | 电子元件本体的绝缘结构及其形成方法 |
GB0703172D0 (en) * | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
CN105744750B (zh) * | 2008-08-18 | 2019-06-18 | 赛姆布兰特有限公司 | 卤代烃聚合物涂层 |
GB2462824A (en) * | 2008-08-18 | 2010-02-24 | Crombie 123 Ltd | Printed circuit board encapsulation |
-
2010
- 2010-02-23 GB GBGB1003067.4A patent/GB201003067D0/en not_active Ceased
-
2011
- 2011-02-21 KR KR1020127024623A patent/KR101778820B1/ko active IP Right Grant
- 2011-02-21 WO PCT/GB2011/000238 patent/WO2011104500A1/en active Application Filing
- 2011-02-21 CN CN2011800107855A patent/CN102791779A/zh active Pending
- 2011-02-21 BR BR112012021172A patent/BR112012021172A2/pt not_active Application Discontinuation
- 2011-02-21 EP EP11705228A patent/EP2539392A1/en not_active Withdrawn
- 2011-02-21 JP JP2012554405A patent/JP6085480B2/ja active Active
- 2011-02-21 CN CN201610837103.2A patent/CN106916331A/zh active Pending
- 2011-02-23 TW TW100106073A patent/TWI547221B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101778820B1 (ko) | 2017-09-14 |
WO2011104500A1 (en) | 2011-09-01 |
JP2013527973A (ja) | 2013-07-04 |
TW201204203A (en) | 2012-01-16 |
GB201003067D0 (en) | 2010-04-07 |
BR112012021172A2 (pt) | 2016-05-17 |
EP2539392A1 (en) | 2013-01-02 |
CN102791779A (zh) | 2012-11-21 |
TWI547221B (zh) | 2016-08-21 |
CN106916331A (zh) | 2017-07-04 |
KR20120129993A (ko) | 2012-11-28 |
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