CN104854265B - 铜镀浴组合物 - Google Patents

铜镀浴组合物 Download PDF

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Publication number
CN104854265B
CN104854265B CN201380061184.6A CN201380061184A CN104854265B CN 104854265 B CN104854265 B CN 104854265B CN 201380061184 A CN201380061184 A CN 201380061184A CN 104854265 B CN104854265 B CN 104854265B
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CN
China
Prior art keywords
aqueous solution
formula
electroplating bath
group
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380061184.6A
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English (en)
Chinese (zh)
Other versions
CN104854265A (zh
Inventor
H·布伦纳
B·洛尔福斯
A·威特恰克
L·科尔曼
O·曼恩
C·奥德
T·班赫特
A·费罗
A·基尔布斯
A·施迈凯尔
D·罗德
S·阿克曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
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Publication of CN104854265A publication Critical patent/CN104854265A/zh
Application granted granted Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0261—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the filling method or the material of the conductive fill

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201380061184.6A 2012-11-26 2013-11-12 铜镀浴组合物 Active CN104854265B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12194261.9A EP2735627A1 (en) 2012-11-26 2012-11-26 Copper plating bath composition
EP12194261.9 2012-11-26
PCT/EP2013/073629 WO2014079737A2 (en) 2012-11-26 2013-11-12 Copper plating bath composition

Publications (2)

Publication Number Publication Date
CN104854265A CN104854265A (zh) 2015-08-19
CN104854265B true CN104854265B (zh) 2017-08-08

Family

ID=47226032

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380061184.6A Active CN104854265B (zh) 2012-11-26 2013-11-12 铜镀浴组合物

Country Status (8)

Country Link
US (1) US9551080B2 (https=)
EP (2) EP2735627A1 (https=)
JP (1) JP6279598B2 (https=)
KR (1) KR102193485B1 (https=)
CN (1) CN104854265B (https=)
PH (1) PH12015501137B1 (https=)
TW (1) TWI600802B (https=)
WO (1) WO2014079737A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
ES2639300T3 (es) * 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
KR102426521B1 (ko) * 2015-04-20 2022-07-27 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 전해 구리 도금 배쓰 조성물 및 그 사용 방법
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
EP3344800B1 (en) * 2015-08-31 2019-03-13 ATOTECH Deutschland GmbH Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
ES2681836T3 (es) 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
JP6926120B2 (ja) 2016-05-04 2021-08-25 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 基板表面の活性化を含む基板表面に金属または金属合金を析出させるための方法
US11035051B2 (en) 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
EP3360988B1 (en) * 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
ES2881029T3 (es) 2018-01-09 2021-11-26 Atotech Deutschland Gmbh Aditivo de ureileno, su uso y un método para su preparación
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
EP3933073B1 (en) * 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112899736A (zh) * 2021-01-15 2021-06-04 深圳中科利尔科技有限公司 一种pcb高纵横通孔电镀铜添加剂及其制备方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
EP4063533A1 (en) 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339861B1 (ko) * 2021-07-26 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 금속박 형성용 전기도금 조성물
KR102339866B1 (ko) * 2021-08-04 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물
CN118812171A (zh) * 2023-04-17 2024-10-22 财团法人工业技术研究院 贯穿玻璃的通孔的铜金属化方法和由此制造的玻璃制品

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419192A (en) * 1980-03-27 1983-12-06 Schering Aktiengesellschaft Method for galvanic deposition of copper
US6387229B1 (en) * 1999-05-07 2002-05-14 Enthone, Inc. Alloy plating
CN1410601A (zh) * 2001-09-27 2003-04-16 长春石油化学股份有限公司 用于铜集成电路内连线的铜电镀液组合物
CN1507505A (zh) * 2001-05-09 2004-06-23 ӡ�����Ƽ��ɷ����޹�˾ 铜镀液及用其镀覆基板的方法
US20040187731A1 (en) * 1999-07-15 2004-09-30 Wang Qing Min Acid copper electroplating solutions
CN1564881A (zh) * 2002-12-25 2005-01-12 株式会社日矿材料 包含具有特定骨架的季铵化合物聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔
CN1806067A (zh) * 2003-07-29 2006-07-19 株式会社日矿材料 含有具有特定骨架的含二烷基氨基的聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔
US20090205969A1 (en) * 2005-12-15 2009-08-20 Coventya Gmbh Crosslinked polymers, galvanization baths comprising them and use thereof
CN102482417A (zh) * 2009-09-08 2012-05-30 阿托特德国有限公司 具有末端氨基的聚合物及其作为锌及锌合金电沉积浴的添加剂的应用
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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DE4126502C1 (https=) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419192A (en) * 1980-03-27 1983-12-06 Schering Aktiengesellschaft Method for galvanic deposition of copper
US6387229B1 (en) * 1999-05-07 2002-05-14 Enthone, Inc. Alloy plating
US20040187731A1 (en) * 1999-07-15 2004-09-30 Wang Qing Min Acid copper electroplating solutions
CN1507505A (zh) * 2001-05-09 2004-06-23 ӡ�����Ƽ��ɷ����޹�˾ 铜镀液及用其镀覆基板的方法
CN1410601A (zh) * 2001-09-27 2003-04-16 长春石油化学股份有限公司 用于铜集成电路内连线的铜电镀液组合物
CN1564881A (zh) * 2002-12-25 2005-01-12 株式会社日矿材料 包含具有特定骨架的季铵化合物聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔
CN1806067A (zh) * 2003-07-29 2006-07-19 株式会社日矿材料 含有具有特定骨架的含二烷基氨基的聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔
US20090205969A1 (en) * 2005-12-15 2009-08-20 Coventya Gmbh Crosslinked polymers, galvanization baths comprising them and use thereof
CN102482417A (zh) * 2009-09-08 2012-05-30 阿托特德国有限公司 具有末端氨基的聚合物及其作为锌及锌合金电沉积浴的添加剂的应用
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper

Also Published As

Publication number Publication date
CN104854265A (zh) 2015-08-19
EP2922985A2 (en) 2015-09-30
EP2735627A1 (en) 2014-05-28
PH12015501137A1 (en) 2015-08-03
KR102193485B1 (ko) 2020-12-22
EP2922985B1 (en) 2016-09-14
US9551080B2 (en) 2017-01-24
WO2014079737A2 (en) 2014-05-30
US20150299883A1 (en) 2015-10-22
PH12015501137B1 (en) 2015-08-03
TWI600802B (zh) 2017-10-01
JP2016503461A (ja) 2016-02-04
WO2014079737A3 (en) 2014-09-12
TW201422854A (zh) 2014-06-16
JP6279598B2 (ja) 2018-02-14
KR20150088307A (ko) 2015-07-31

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