NO970383L - Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate - Google Patents

Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate

Info

Publication number
NO970383L
NO970383L NO970383A NO970383A NO970383L NO 970383 L NO970383 L NO 970383L NO 970383 A NO970383 A NO 970383A NO 970383 A NO970383 A NO 970383A NO 970383 L NO970383 L NO 970383L
Authority
NO
Norway
Prior art keywords
conductor plate
electronic components
plate
soldering
areas
Prior art date
Application number
NO970383A
Other languages
English (en)
Norwegian (no)
Other versions
NO970383D0 (no
Inventor
Ralf-Dieter Busse
Carsen Storbeck
Thomas Lade
Original Assignee
Krone Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19610586A external-priority patent/DE19610586B4/de
Priority claimed from DE1996111631 external-priority patent/DE19611631C1/de
Priority claimed from DE19620340A external-priority patent/DE19620340C1/de
Application filed by Krone Ag filed Critical Krone Ag
Publication of NO970383D0 publication Critical patent/NO970383D0/no
Publication of NO970383L publication Critical patent/NO970383L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Fuses (AREA)
  • Thermistors And Varistors (AREA)
  • Resistance Welding (AREA)
NO970383A 1996-03-18 1997-01-29 Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate NO970383L (no)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19610586A DE19610586B4 (de) 1996-03-18 1996-03-18 Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
DE1996111631 DE19611631C1 (de) 1996-03-25 1996-03-25 Modul mit einem Gehäuse und einer Grundplatte
DE19620340A DE19620340C1 (de) 1996-05-21 1996-05-21 Überspannungs - Schutzstecker

Publications (2)

Publication Number Publication Date
NO970383D0 NO970383D0 (no) 1997-01-29
NO970383L true NO970383L (no) 1997-09-19

Family

ID=27216039

Family Applications (1)

Application Number Title Priority Date Filing Date
NO970383A NO970383L (no) 1996-03-18 1997-01-29 Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate

Country Status (29)

Country Link
US (1) US5999412A (bg)
EP (1) EP0797379B1 (bg)
JP (1) JPH104250A (bg)
KR (1) KR19990008482A (bg)
CN (1) CN1168078A (bg)
AR (1) AR006169A1 (bg)
AT (1) ATE224634T1 (bg)
AU (1) AU713077B2 (bg)
BG (1) BG62425B1 (bg)
BR (1) BR9701324A (bg)
CA (1) CA2199898A1 (bg)
CO (1) CO4560406A1 (bg)
CZ (1) CZ292485B6 (bg)
DE (1) DE59708222D1 (bg)
DK (1) DK0797379T3 (bg)
ES (1) ES2183993T3 (bg)
HU (1) HUP9700597A3 (bg)
ID (1) ID16239A (bg)
IL (1) IL120102A (bg)
NO (1) NO970383L (bg)
NZ (1) NZ314160A (bg)
PL (1) PL182659B1 (bg)
PT (1) PT797379E (bg)
SG (1) SG52925A1 (bg)
SI (1) SI0797379T1 (bg)
TR (1) TR199700165A2 (bg)
UA (1) UA42784C2 (bg)
UY (1) UY24454A1 (bg)
YU (1) YU48977B (bg)

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DE102004046394B4 (de) * 2004-08-24 2007-03-01 Dehn + Söhne Gmbh + Co. Kg Steckbare Überspannungsschutz-Anordnung
DE102004061681B4 (de) 2004-12-22 2006-10-26 Adc Gmbh Kabelsteckverbinder für Leiterplatten
US20070047526A1 (en) * 2005-08-26 2007-03-01 Bryan Kennedy Systems and methods for conecting between telecommunications equipment
US7643631B2 (en) * 2005-08-26 2010-01-05 Adc Telecommunications, Inc. Enclosure for broadband service delivery system
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CN101295570B (zh) * 2007-04-25 2011-11-23 聚鼎科技股份有限公司 保护电路板和其过电流保护元件
DE102007050590B4 (de) * 2007-10-23 2017-04-13 Tyco Electronics Services Gmbh Verteileranschlussmodul
US7946863B2 (en) 2008-04-25 2011-05-24 Adc Telecommunications, Inc. Circuit protection block
US8411404B2 (en) * 2008-05-27 2013-04-02 Adc Telecommunications, Inc. Overvoltage protection plug
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DE102014103419B4 (de) 2014-03-13 2018-05-24 Epcos Ag Überspannungsableiter mit Schutz vor Erwärmung
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Also Published As

Publication number Publication date
BG101319A (bg) 1997-09-30
UY24454A1 (es) 1997-03-04
SG52925A1 (en) 1998-09-28
DK0797379T3 (da) 2003-01-06
CO4560406A1 (es) 1998-02-10
AU713077B2 (en) 1999-11-25
EP0797379A3 (de) 1998-01-07
ES2183993T3 (es) 2003-04-01
CA2199898A1 (en) 1997-09-18
NO970383D0 (no) 1997-01-29
US5999412A (en) 1999-12-07
PL318893A1 (en) 1997-09-29
DE59708222D1 (de) 2002-10-24
KR19990008482A (ko) 1999-02-05
BR9701324A (pt) 1998-09-08
BG62425B1 (bg) 1999-10-29
MX9701909A (es) 1997-09-30
AU1251397A (en) 1997-09-25
AR006169A1 (es) 1999-08-11
EP0797379A2 (de) 1997-09-24
IL120102A (en) 1997-04-15
TR199700165A2 (xx) 1997-10-21
HUP9700597A3 (en) 2000-04-28
CN1168078A (zh) 1997-12-17
HUP9700597A1 (en) 1997-12-29
ATE224634T1 (de) 2002-10-15
JPH104250A (ja) 1998-01-06
UA42784C2 (uk) 2001-11-15
CZ71697A3 (en) 1997-10-15
PL182659B1 (pl) 2002-02-28
NZ314160A (en) 1998-09-24
HU9700597D0 (en) 1997-05-28
YU9197A (sh) 2000-10-30
ID16239A (id) 1997-09-11
YU48977B (sh) 2003-02-28
SI0797379T1 (en) 2003-04-30
CZ292485B6 (cs) 2003-10-15
PT797379E (pt) 2003-02-28
EP0797379B1 (de) 2002-09-18

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