NO834009L - Fremgangsmaate og apparatur for fremstilling av flersjikts kretskort - Google Patents

Fremgangsmaate og apparatur for fremstilling av flersjikts kretskort

Info

Publication number
NO834009L
NO834009L NO834009A NO834009A NO834009L NO 834009 L NO834009 L NO 834009L NO 834009 A NO834009 A NO 834009A NO 834009 A NO834009 A NO 834009A NO 834009 L NO834009 L NO 834009L
Authority
NO
Norway
Prior art keywords
conductive
layer
substrate
printed circuit
circuit pattern
Prior art date
Application number
NO834009A
Other languages
English (en)
Norwegian (no)
Inventor
Peter P Pelligrino
Original Assignee
Economics Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Economics Lab filed Critical Economics Lab
Publication of NO834009L publication Critical patent/NO834009L/no

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0152Temporary metallic carrier, e.g. for transferring material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0726Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Burglar Alarm Systems (AREA)
NO834009A 1982-03-04 1983-11-03 Fremgangsmaate og apparatur for fremstilling av flersjikts kretskort NO834009L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35473682A 1982-03-04 1982-03-04

Publications (1)

Publication Number Publication Date
NO834009L true NO834009L (no) 1983-11-03

Family

ID=23394704

Family Applications (1)

Application Number Title Priority Date Filing Date
NO834009A NO834009L (no) 1982-03-04 1983-11-03 Fremgangsmaate og apparatur for fremstilling av flersjikts kretskort

Country Status (8)

Country Link
EP (1) EP0103627A4 (enrdf_load_html_response)
JP (1) JPS59500341A (enrdf_load_html_response)
CA (1) CA1222574A (enrdf_load_html_response)
DK (1) DK502783A (enrdf_load_html_response)
IN (1) IN158376B (enrdf_load_html_response)
IT (1) IT1163136B (enrdf_load_html_response)
NO (1) NO834009L (enrdf_load_html_response)
WO (1) WO1983003065A1 (enrdf_load_html_response)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0154564A3 (en) * 1984-03-09 1986-08-20 Cirtel Inc. Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions
GB2177851A (en) * 1985-06-05 1987-01-28 Spence Bate Laminated low power circuitry components
US4927477A (en) * 1985-08-26 1990-05-22 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits
US4875966A (en) * 1988-09-12 1989-10-24 General Dynamics Corp., Pomona Div. Pressure transfer plate assembly for a heat bonding apparatus
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
KR102326101B1 (ko) 2014-07-18 2021-11-12 미츠비시 가스 가가쿠 가부시키가이샤 적층체 및 반도체 소자 탑재용 기판, 그리고 그들의 제조 방법
EP3007526A1 (en) * 2014-10-08 2016-04-13 T-Kingdom Co., Ltd. Manufacturing method and structure of circuit board with very fine conductive circuit lines
US10332832B2 (en) 2017-08-07 2019-06-25 General Electric Company Method of manufacturing an electronics package using device-last or device-almost last placement
WO2019098043A1 (ja) 2017-11-16 2019-05-23 三菱瓦斯化学株式会社 パターニングされた金属箔付き積層体の製造方法及びパターニングされた金属箔付き積層体
JP7153242B2 (ja) 2017-12-14 2022-10-14 三菱瓦斯化学株式会社 絶縁性樹脂層付き銅箔
US11877396B2 (en) 2018-08-30 2024-01-16 Mitsubishi Gas Chemical Company, Inc. Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same
JP7479596B2 (ja) 2019-03-29 2024-05-09 三菱瓦斯化学株式会社 絶縁性樹脂層付き銅箔、並びに、これを用いた積層体及び積層体の製造方法
CN113891797A (zh) 2019-05-31 2022-01-04 三菱瓦斯化学株式会社 带绝缘性树脂层的基材、以及使用其的层叠体和层叠体的制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3219749A (en) * 1961-04-21 1965-11-23 Litton Systems Inc Multilayer printed circuit board with solder access apertures
GB964349A (en) * 1961-08-31 1964-07-22 Rogers Corp Improvements in printed circuit and method of making the same
US3350250A (en) * 1962-03-21 1967-10-31 North American Aviation Inc Method of making printed wire circuitry
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
GB1259837A (en) * 1968-11-18 1972-01-12 Boeing Co Composite structure and method of making the same
US3627902A (en) * 1970-02-02 1971-12-14 Control Data Corp Interconnections for multilayer printed circuit boards
US3972755A (en) * 1972-12-14 1976-08-03 The United States Of America As Represented By The Secretary Of The Navy Dielectric circuit board bonding
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards

Also Published As

Publication number Publication date
JPS59500341A (ja) 1984-03-01
WO1983003065A1 (en) 1983-09-15
DK502783D0 (da) 1983-11-03
IT8319877A1 (it) 1984-09-03
EP0103627A4 (en) 1985-09-18
IT1163136B (it) 1987-04-08
IT8319877A0 (it) 1983-03-03
CA1222574A (en) 1987-06-02
DK502783A (da) 1983-11-03
IN158376B (enrdf_load_html_response) 1986-11-01
EP0103627A1 (en) 1984-03-28

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