NO821481L - Trykt krets og fremgangsmaate for fremstilling derav - Google Patents

Trykt krets og fremgangsmaate for fremstilling derav

Info

Publication number
NO821481L
NO821481L NO821481A NO821481A NO821481L NO 821481 L NO821481 L NO 821481L NO 821481 A NO821481 A NO 821481A NO 821481 A NO821481 A NO 821481A NO 821481 L NO821481 L NO 821481L
Authority
NO
Norway
Prior art keywords
conductor
carrier
black
film
network
Prior art date
Application number
NO821481A
Other languages
English (en)
Norwegian (no)
Inventor
Edouard Serras-Paulet
Original Assignee
Serras Paulet Edouard
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9245779&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NO821481(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Serras Paulet Edouard filed Critical Serras Paulet Edouard
Publication of NO821481L publication Critical patent/NO821481L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
NO821481A 1980-09-09 1982-05-05 Trykt krets og fremgangsmaate for fremstilling derav NO821481L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8019462A FR2490059A1 (fr) 1980-09-09 1980-09-09 Circuit imprime et son procede de fabrication

Publications (1)

Publication Number Publication Date
NO821481L true NO821481L (no) 1982-05-05

Family

ID=9245779

Family Applications (1)

Application Number Title Priority Date Filing Date
NO821481A NO821481L (no) 1980-09-09 1982-05-05 Trykt krets og fremgangsmaate for fremstilling derav

Country Status (11)

Country Link
EP (1) EP0059206B1 (it)
JP (1) JPS57501353A (it)
AU (1) AU7537981A (it)
BE (1) BE890272A (it)
CA (1) CA1171549A (it)
DK (1) DK204982A (it)
ES (1) ES505299A0 (it)
FR (1) FR2490059A1 (it)
IT (1) IT1138586B (it)
NO (1) NO821481L (it)
WO (1) WO1982000938A1 (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
IT1224236B (it) * 1988-05-03 1990-09-26 Cisel Spa Circuito elettrico, per macchine elettroniche, stampato serigraficamente su pellicola in poliestere, avente struttura multistrato
IE940943A1 (en) * 1993-12-09 1995-06-14 Methode Electronics Inc Printed plastic circuits and contacts and method for making¹same
IT1396077B1 (it) * 2009-10-16 2012-11-09 Automotive Lighting Italia Spa Dispositivo di illuminazione per veicoli, in particolare autoveicoli, utilizzante diodi led
DE102010040867A1 (de) * 2010-09-16 2012-03-22 Robert Bosch Gmbh Elektronikbauteil mit verbesserter Leitungsstruktur
CN113228834A (zh) 2018-10-25 2021-08-06 捷普有限公司 在图形上多层电路的印刷
CN118039460B (zh) * 2024-04-15 2024-06-28 绵阳新能智造科技有限公司 一种硅晶片增厚的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4876059A (it) * 1972-01-14 1973-10-13
GB1565207A (en) * 1975-09-05 1980-04-16 Sinclair Radionics Printed circuits
DE2724399A1 (de) * 1977-05-28 1978-11-30 Martin Marietta Corp Verfahren zur herstellung einer mehrschichtigen gedruckten schaltungsplatte mit integralen, flexiblen anschlusstuecken, sowie nach diesem verfahren gefertigte schaltungsplatte
DE2831984A1 (de) * 1977-07-21 1979-02-01 Sharp Kk Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen
FR2402379A1 (fr) * 1977-08-31 1979-03-30 Cayrol Pierre Henri Perfectionnements apportes aux circuits imprimes

Also Published As

Publication number Publication date
IT1138586B (it) 1986-09-17
EP0059206A1 (fr) 1982-09-08
WO1982000938A1 (en) 1982-03-18
AU7537981A (en) 1982-04-08
ES8302403A1 (es) 1983-01-01
FR2490059A1 (fr) 1982-03-12
IT8123851A0 (it) 1981-09-09
FR2490059B1 (it) 1984-07-27
BE890272A (fr) 1982-03-08
JPS57501353A (it) 1982-07-29
DK204982A (da) 1982-05-06
CA1171549A (en) 1984-07-24
ES505299A0 (es) 1983-01-01
EP0059206B1 (fr) 1985-07-31

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