NO20080795L - Anordning og fremgangsmate for separasjon og transport av et substrat - Google Patents

Anordning og fremgangsmate for separasjon og transport av et substrat

Info

Publication number
NO20080795L
NO20080795L NO20080795A NO20080795A NO20080795L NO 20080795 L NO20080795 L NO 20080795L NO 20080795 A NO20080795 A NO 20080795A NO 20080795 A NO20080795 A NO 20080795A NO 20080795 L NO20080795 L NO 20080795L
Authority
NO
Norway
Prior art keywords
substrate
separation
gripper
disc
transporting
Prior art date
Application number
NO20080795A
Other languages
English (en)
Inventor
Richard Herter
Konrad Kaltenbach
Original Assignee
Rena Sondermaschinen Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP06026054A external-priority patent/EP1935599B1/de
Application filed by Rena Sondermaschinen Gmbh filed Critical Rena Sondermaschinen Gmbh
Publication of NO20080795L publication Critical patent/NO20080795L/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Ink Jet (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

Oppfinnelsen vedrører spesielt separering og transportering av et skiveformet substrat (102, 202), for eksempel en solcellebrikke. Oppfinnelsen er kjennetegnet ved at separeringen foregår inne i et fluid, og at det mellom en griper (108, 208) og substratet (102, 202) som skal frasepareres på grunn av adhesjonskrefter oppstår en tynn fluidfilm som muliggjør klebing til griperen (108, 208). Ved uttak på tvers av fremføringsretningen (105, 205) eller særlig parallelt med substratets (102, 202) flateaktige utforming er en meget skånsom og effektiv separering av skiveformede substrater (102, 202) med en høy takt mulig.
NO20080795A 2006-07-06 2008-02-13 Anordning og fremgangsmate for separasjon og transport av et substrat NO20080795L (no)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006031629 2006-07-06
EP06026054A EP1935599B1 (de) 2006-12-15 2006-12-15 Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
PCT/EP2007/005968 WO2008003502A1 (de) 2006-07-06 2007-07-05 Vorrichtung und verfahren zum vereinzeln und transportieren von substraten

Publications (1)

Publication Number Publication Date
NO20080795L true NO20080795L (no) 2009-04-06

Family

ID=38476138

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20080795A NO20080795L (no) 2006-07-06 2008-02-13 Anordning og fremgangsmate for separasjon og transport av et substrat

Country Status (8)

Country Link
US (1) US20080213079A1 (no)
JP (1) JP5006880B2 (no)
KR (1) KR100992108B1 (no)
CN (1) CN101356047B (no)
MY (1) MY142778A (no)
NO (1) NO20080795L (no)
RU (1) RU2380305C2 (no)
WO (1) WO2008003502A1 (no)

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* Cited by examiner, † Cited by third party
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WO2008075970A1 (en) * 2006-12-19 2008-06-26 Rec Scanwafer As Method and device for se aration of silicon wafers
EP2238618B1 (en) * 2008-01-24 2015-07-29 Brewer Science, Inc. Method for reversibly mounting a device wafer to a carrier substrate
GB2465592B (en) * 2008-11-21 2011-12-07 Coreflow Ltd Method and device for facilitating separation of sliced wafers
KR101066978B1 (ko) * 2009-03-16 2011-09-23 주식회사 에스에프에이 태양전지용 웨이퍼의 분리 및 이송 장치
GB2476315A (en) * 2009-12-21 2011-06-22 Rec Wafer Norway As Cleaning a stack of thin wafers
JP5585911B2 (ja) * 2010-03-04 2014-09-10 武井電機工業株式会社 ウェハの分離方法及びウェハ分離移載装置
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
JP5646897B2 (ja) * 2010-07-21 2014-12-24 エア・ウォーター株式会社 ウエハの枚葉化方法および装置
CN102180364B (zh) * 2010-07-22 2016-04-13 中钞信用卡产业发展有限公司 卡片送料装置及送料方法
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
DE102010045098A1 (de) * 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
CN102956530A (zh) * 2011-08-31 2013-03-06 日本麦可罗尼克斯股份有限公司 晶片的分离方法及分离装置
JP2013149706A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd ウエハ搬送装置およびウエハ搬送方法
JP5849201B2 (ja) * 2013-05-28 2016-01-27 パナソニックＩｐマネジメント株式会社 切り残し部除去装置
CN104555414B (zh) * 2014-11-28 2017-02-01 芜湖银星汽车零部件有限公司 一种铺设用上料机
TWI780451B (zh) * 2020-07-03 2022-10-11 住華科技股份有限公司 自動化取放片設備以及光學膜的取放方法
CN112125037B (zh) * 2020-09-27 2024-06-25 苏州市金盾自动化系统有限公司 防水胶带出料、转移及贴附装置
CN113428612B (zh) * 2021-06-22 2022-08-30 安徽轰达电源有限公司 一种用于蓄电池的板栅上片装置
CN113394150B (zh) * 2021-07-01 2022-01-11 杭州中为光电技术有限公司 硅片输送分散装置
CN115626488A (zh) * 2022-09-08 2023-01-20 安徽兰迪节能玻璃有限公司 一种真空玻璃生产线取片装置

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Publication number Priority date Publication date Assignee Title
US4042126A (en) * 1976-02-26 1977-08-16 Simplicity Pattern Co. Inc. Methods and apparatus for retrieval of stored articles from a stack
DE4100526A1 (de) * 1991-01-10 1992-07-16 Wacker Chemitronic Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
JP3377161B2 (ja) * 1995-12-25 2003-02-17 株式会社日平トヤマ ウエハの処理システム
JPH10114426A (ja) * 1996-10-11 1998-05-06 Tokyo Seimitsu Co Ltd ウェーハ取出装置
JP3209116B2 (ja) 1996-10-11 2001-09-17 株式会社東京精密 スライスベース剥離装置
JP3582762B2 (ja) * 1997-06-30 2004-10-27 大日本スクリーン製造株式会社 基板保持装置およびこれを利用した基板処理装置
JP3870496B2 (ja) * 1997-08-04 2007-01-17 株式会社東京精密 スライスベース剥離装置
JPH1174164A (ja) * 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
NL1011077C2 (nl) * 1999-01-19 2000-07-20 Meco Equip Eng Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten.
DE19904834A1 (de) * 1999-02-07 2000-08-10 Acr Automation In Cleanroom Vorrichtung zum Ablösen, Vereinzeln und Einlagern von dünnen, bruchempfindlichen scheibenförmigen Substraten
DE19950068B4 (de) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
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DE102005045583A1 (de) * 2005-05-20 2006-11-23 Brain, Bernhard Verfahren zur Vereinzelung von gestapelten, scheibenförmigen Elementen und Vereinzelungsvorrichtung

Also Published As

Publication number Publication date
WO2008003502A1 (de) 2008-01-10
JP5006880B2 (ja) 2012-08-22
JP2009509891A (ja) 2009-03-12
CN101356047A (zh) 2009-01-28
MY142778A (en) 2010-12-31
RU2008115260A (ru) 2009-10-27
RU2380305C2 (ru) 2010-01-27
CN101356047B (zh) 2011-11-09
KR100992108B1 (ko) 2010-11-04
US20080213079A1 (en) 2008-09-04
KR20080038377A (ko) 2008-05-06

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