NL8702082A - Werkwijze voor het op een basisplaat aanbrengen van elektrisch geleidende schakelingen. - Google Patents

Werkwijze voor het op een basisplaat aanbrengen van elektrisch geleidende schakelingen. Download PDF

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Publication number
NL8702082A
NL8702082A NL8702082A NL8702082A NL8702082A NL 8702082 A NL8702082 A NL 8702082A NL 8702082 A NL8702082 A NL 8702082A NL 8702082 A NL8702082 A NL 8702082A NL 8702082 A NL8702082 A NL 8702082A
Authority
NL
Netherlands
Prior art keywords
layer
circuit
belonging
electrically conductive
circuit belonging
Prior art date
Application number
NL8702082A
Other languages
English (en)
Dutch (nl)
Inventor
Sandai Iwasa
Yoichi Oba
Isao Morooka
Original Assignee
Asahi Chem Res Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23393086A external-priority patent/JPS6387797A/ja
Priority claimed from JP23392986A external-priority patent/JPS6387796A/ja
Priority claimed from JP23392886A external-priority patent/JPS6387795A/ja
Application filed by Asahi Chem Res Lab filed Critical Asahi Chem Res Lab
Publication of NL8702082A publication Critical patent/NL8702082A/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
NL8702082A 1986-09-30 1987-09-03 Werkwijze voor het op een basisplaat aanbrengen van elektrisch geleidende schakelingen. NL8702082A (nl)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP23393086 1986-09-30
JP23393086A JPS6387797A (ja) 1986-09-30 1986-09-30 基板に導電回路を形成する方法
JP23392886 1986-09-30
JP23392986A JPS6387796A (ja) 1986-09-30 1986-09-30 基板に導電回路を形成する方法
JP23392886A JPS6387795A (ja) 1986-09-30 1986-09-30 基板に導電回路を形成する方法
JP23392986 1986-09-30

Publications (1)

Publication Number Publication Date
NL8702082A true NL8702082A (nl) 1988-04-18

Family

ID=27332056

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8702082A NL8702082A (nl) 1986-09-30 1987-09-03 Werkwijze voor het op een basisplaat aanbrengen van elektrisch geleidende schakelingen.

Country Status (6)

Country Link
US (1) US4837050A (https=)
KR (1) KR910001787B1 (https=)
DE (1) DE3730953A1 (https=)
FR (1) FR2606579A1 (https=)
GB (1) GB2197133B (https=)
NL (1) NL8702082A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991014015A1 (en) * 1990-03-05 1991-09-19 Olin Corporation Method and materials for forming multi-layer circuits by an additive process
US5289630A (en) * 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
CA2055148C (en) * 1991-10-25 2002-06-18 Alain Langevin Method of forming an electrically conductive contact on a substrate
GB2320728A (en) * 1996-12-30 1998-07-01 Coates Brothers Plc Depositing a metallic film involving pretreatment
JP4399337B2 (ja) * 2004-09-13 2010-01-13 株式会社フューチャービジョン 平面パターンを有する基板およびそれを用いた表示装置
JP5197156B2 (ja) * 2007-06-19 2013-05-15 キヤノン株式会社 配線基板
DE102011014582A1 (de) * 2011-03-21 2012-09-27 Epcos Ag Überspannungsableiter mit niedriger Ansprechspannung und Verfahren zu dessen Herstellung
KR102341502B1 (ko) * 2019-07-01 2021-12-21 김태현 애완동물용 배변 훈련장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2296347A1 (fr) * 1974-12-28 1976-07-23 Machida Hideo Procede pour fabriquer des panneaux de circuits imprimes a couches multiples
DE2553763A1 (de) * 1975-11-29 1977-06-02 Licentia Gmbh Verfahren zur herstellung einer elektronischen schaltung
FR2382148A1 (fr) * 1977-02-25 1978-09-22 Ruf Kg Wilhelm Procede et dispositif pour la fabrication de plaquettes de circuit imprime garnies d'une ou plusieurs resistances
DE3621667A1 (de) * 1985-06-29 1987-01-08 Toshiba Kawasaki Kk Mit einer mehrzahl von dickfilmen beschichtetes substrat, verfahren zu seiner herstellung und dieses enthaltende vorrichtung
FR2593015A1 (fr) * 1986-01-14 1987-07-17 Asahi Chem Res Lab Procede pour la realisation de circuits electriques sur une plaque de base

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3214827A (en) * 1962-12-10 1965-11-02 Sperry Rand Corp Electrical circuitry fabrication
US3680209A (en) * 1969-05-07 1972-08-01 Siemens Ag Method of forming stacked circuit boards
US3831270A (en) * 1970-09-28 1974-08-27 Mallory & Co Inc P R Electrical conducting means and method of making same
JPS56103260A (en) * 1980-01-22 1981-08-18 Asahi Kagaku Kenkyusho:Kk Conductive paint containing copper powder
DE3020196C2 (de) * 1980-05-28 1982-05-06 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung
CA1183280A (en) * 1981-02-09 1985-02-26 Francis N. Sinnadurai Integrated circuit chip carrier
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2296347A1 (fr) * 1974-12-28 1976-07-23 Machida Hideo Procede pour fabriquer des panneaux de circuits imprimes a couches multiples
DE2553763A1 (de) * 1975-11-29 1977-06-02 Licentia Gmbh Verfahren zur herstellung einer elektronischen schaltung
FR2382148A1 (fr) * 1977-02-25 1978-09-22 Ruf Kg Wilhelm Procede et dispositif pour la fabrication de plaquettes de circuit imprime garnies d'une ou plusieurs resistances
DE3621667A1 (de) * 1985-06-29 1987-01-08 Toshiba Kawasaki Kk Mit einer mehrzahl von dickfilmen beschichtetes substrat, verfahren zu seiner herstellung und dieses enthaltende vorrichtung
FR2593015A1 (fr) * 1986-01-14 1987-07-17 Asahi Chem Res Lab Procede pour la realisation de circuits electriques sur une plaque de base

Also Published As

Publication number Publication date
GB2197133B (en) 1991-01-23
DE3730953C2 (https=) 1989-07-27
US4837050A (en) 1989-06-06
KR910001787B1 (ko) 1991-03-23
GB8722813D0 (en) 1987-11-04
DE3730953A1 (de) 1988-04-28
GB2197133A (en) 1988-05-11
FR2606579A1 (fr) 1988-05-13
KR880004725A (ko) 1988-06-07

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BV The patent application has lapsed