FR2296347A1 - Procede pour fabriquer des panneaux de circuits imprimes a couches multiples - Google Patents
Procede pour fabriquer des panneaux de circuits imprimes a couches multiplesInfo
- Publication number
- FR2296347A1 FR2296347A1 FR7539660A FR7539660A FR2296347A1 FR 2296347 A1 FR2296347 A1 FR 2296347A1 FR 7539660 A FR7539660 A FR 7539660A FR 7539660 A FR7539660 A FR 7539660A FR 2296347 A1 FR2296347 A1 FR 2296347A1
- Authority
- FR
- France
- Prior art keywords
- coating
- conductor lines
- circuit
- foil
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP406775A JPS5210568A (en) | 1974-12-28 | 1974-12-28 | Method of manufacturing multilayered printed wiring substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2296347A1 true FR2296347A1 (fr) | 1976-07-23 |
Family
ID=11574472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7539660A Withdrawn FR2296347A1 (fr) | 1974-12-28 | 1975-12-24 | Procede pour fabriquer des panneaux de circuits imprimes a couches multiples |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5210568A (fr) |
DE (2) | DE2558367A1 (fr) |
FR (1) | FR2296347A1 (fr) |
NL (1) | NL7515090A (fr) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0167344A2 (fr) * | 1984-06-29 | 1986-01-08 | Tektronix, Inc. | Circuit multicouche interconnecté utilisant un diélectrique photosensible |
FR2588146A1 (fr) * | 1985-09-29 | 1987-04-03 | Asahi Chem Res Lab | Procede pour former des circuits electriquement conducteurs sur une plaquette de base. |
FR2593016A1 (fr) * | 1986-01-14 | 1987-07-17 | Asahi Chem Res Lab | Procede pour former des circuits electriques sur une plaquette de base |
NL8702082A (nl) * | 1986-09-30 | 1988-04-18 | Asahi Chem Res Lab | Werkwijze voor het op een basisplaat aanbrengen van elektrisch geleidende schakelingen. |
EP0268781A1 (fr) * | 1986-09-30 | 1988-06-01 | Wilde Membran Impuls Technik GmbH | Structure additive métallisée électriquement conductrice |
EP0278484A2 (fr) * | 1987-02-13 | 1988-08-17 | Aristo Graphic Systeme GmbH & Co KG | Méthode de fabrication d'une plaquette utilisée pour la digitalisation |
EP0278485A2 (fr) * | 1987-02-13 | 1988-08-17 | Aristo Graphic Systeme GmbH & Co KG | Méthode de fabrication d'une plaquette utilisable pour la digitalisation |
EP0322997A2 (fr) * | 1987-12-31 | 1989-07-05 | Jungpoong Products Co., Ltd. | Procédé de fabrication de plaques à circuits imprimés |
FR2630617A1 (fr) * | 1988-04-22 | 1989-10-27 | Nec Corp | Procede de fabrication d'un substrat conducteur multicouche |
EP0375954A1 (fr) * | 1988-11-29 | 1990-07-04 | Nippon Cmk Corporation Limited | Procédé de fabrication d'un panneau à circuit imprimé |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3006117C2 (de) * | 1980-02-19 | 1981-11-26 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen |
US4416914A (en) * | 1980-12-29 | 1983-11-22 | General Electric Company | Electrical conductors arranged in multiple layers and preparation thereof |
EP0062084A1 (fr) * | 1981-04-06 | 1982-10-13 | Herbert Irwin Schachter | Circuit à plusieurs couches et méthode pour fabriquer ce circuit |
DE3137279C2 (de) * | 1981-09-18 | 1986-12-11 | Wilhelm Ruf KG, 8000 München | Verfahren zur Herstellung von Mehrlagen-Leiterplatten sowie nach dem Verfahren hergestellte mehrlagige Leiterplatte |
DE3407799A1 (de) * | 1984-03-02 | 1985-09-05 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zur herstellung einer multilayer-hybridschaltung |
US4724040A (en) * | 1986-01-14 | 1988-02-09 | Asahi Chemical Research Laboratory Co., Ltd. | Method for producing electric circuits on a base boad |
CA1261481A (fr) * | 1986-03-13 | 1989-09-26 | Kazumasa Eguchi | Carte a circuit imprime pouvant faire echec aux parasites electomagnetiques |
DE3733002A1 (de) * | 1986-09-30 | 1988-04-07 | Wilde Membran Impuls Tech | Additiv metallisierte elektrisch leitfaehige struktur |
JPH0724335B2 (ja) * | 1987-04-30 | 1995-03-15 | 三井金属鉱業株式会社 | 多層回路基板の製造法 |
DE3741918A1 (de) * | 1987-12-10 | 1989-06-22 | Heino Pachschwoell | Verfahren zur herstellung einer elektronischen schaltungsvorrichtung |
CN107484358B (zh) * | 2017-07-26 | 2019-06-21 | 江门崇达电路技术有限公司 | 一种无压合无钻孔的多层线路板制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517518B2 (fr) * | 1972-01-28 | 1980-05-12 |
-
1974
- 1974-12-28 JP JP406775A patent/JPS5210568A/ja active Pending
-
1975
- 1975-12-23 DE DE19752558367 patent/DE2558367A1/de active Pending
- 1975-12-24 NL NL7515090A patent/NL7515090A/xx not_active Application Discontinuation
- 1975-12-24 FR FR7539660A patent/FR2296347A1/fr not_active Withdrawn
- 1975-12-24 DE DE19752558744 patent/DE2558744A1/de active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0167344A2 (fr) * | 1984-06-29 | 1986-01-08 | Tektronix, Inc. | Circuit multicouche interconnecté utilisant un diélectrique photosensible |
EP0167344A3 (fr) * | 1984-06-29 | 1987-04-29 | Tektronix, Inc. | Circuit multicouche interconnecté utilisant un diélectrique photosensible |
FR2588146A1 (fr) * | 1985-09-29 | 1987-04-03 | Asahi Chem Res Lab | Procede pour former des circuits electriquement conducteurs sur une plaquette de base. |
FR2593016A1 (fr) * | 1986-01-14 | 1987-07-17 | Asahi Chem Res Lab | Procede pour former des circuits electriques sur une plaquette de base |
EP0268781A1 (fr) * | 1986-09-30 | 1988-06-01 | Wilde Membran Impuls Technik GmbH | Structure additive métallisée électriquement conductrice |
FR2606579A1 (fr) * | 1986-09-30 | 1988-05-13 | Asahi Chem Res Lab | Procede pour fabriquer des circuits electriquement conducteurs sur une microplaquette de base |
NL8702082A (nl) * | 1986-09-30 | 1988-04-18 | Asahi Chem Res Lab | Werkwijze voor het op een basisplaat aanbrengen van elektrisch geleidende schakelingen. |
EP0278484A2 (fr) * | 1987-02-13 | 1988-08-17 | Aristo Graphic Systeme GmbH & Co KG | Méthode de fabrication d'une plaquette utilisée pour la digitalisation |
EP0278485A2 (fr) * | 1987-02-13 | 1988-08-17 | Aristo Graphic Systeme GmbH & Co KG | Méthode de fabrication d'une plaquette utilisable pour la digitalisation |
EP0278484A3 (en) * | 1987-02-13 | 1989-09-20 | Aristo Graphic Systeme Gmbh & Co Kg | Process for making a digitalization board |
EP0278485B1 (fr) * | 1987-02-13 | 1992-12-16 | Aristo Graphic Systeme GmbH & Co KG | Méthode de fabrication d'une plaquette utilisable pour la digitalisation |
EP0322997A2 (fr) * | 1987-12-31 | 1989-07-05 | Jungpoong Products Co., Ltd. | Procédé de fabrication de plaques à circuits imprimés |
EP0322997A3 (fr) * | 1987-12-31 | 1990-04-25 | Jungpoong Products Co., Ltd. | Procédé de fabrication de plaques à circuits imprimés |
FR2630617A1 (fr) * | 1988-04-22 | 1989-10-27 | Nec Corp | Procede de fabrication d'un substrat conducteur multicouche |
EP0375954A1 (fr) * | 1988-11-29 | 1990-07-04 | Nippon Cmk Corporation Limited | Procédé de fabrication d'un panneau à circuit imprimé |
Also Published As
Publication number | Publication date |
---|---|
NL7515090A (nl) | 1976-06-30 |
JPS5210568A (en) | 1977-01-26 |
DE2558744A1 (de) | 1976-07-01 |
DE2558367A1 (de) | 1976-07-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |