FR2357072A1 - Element d'interconnexion a couches multiples et son procede de fabrication - Google Patents
Element d'interconnexion a couches multiples et son procede de fabricationInfo
- Publication number
- FR2357072A1 FR2357072A1 FR7716801A FR7716801A FR2357072A1 FR 2357072 A1 FR2357072 A1 FR 2357072A1 FR 7716801 A FR7716801 A FR 7716801A FR 7716801 A FR7716801 A FR 7716801A FR 2357072 A1 FR2357072 A1 FR 2357072A1
- Authority
- FR
- France
- Prior art keywords
- layer
- signal
- substrate
- conductors
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connection Or Junction Boxes (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Elément d'interconnexion multicouches servant à relier électriquement les différents composants de circuits intégrés. Cet élément d'interconnexion comporte des plans de distribution de signaux 3, 5, 7 et 9 et des plans de reférences 4, 6 et 8 qui sont séparés par des entretoises telles que 11 et 12 et par un diélectrique qui est constitué par l'air. Des trous de connexion réalisés dans les différent plans permettent d'établir une configuration de connexion prédéterminée. Les microplaquettes de circuits intégrés, telles que 13, 14 et 15 sont reliées à un plan de signaux tel que 3. Cet élément d'interconnexion est utilisé dans la technologie des semi-conducteurs.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70144176A | 1976-06-30 | 1976-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2357072A1 true FR2357072A1 (fr) | 1978-01-27 |
FR2357072B1 FR2357072B1 (fr) | 1978-11-03 |
Family
ID=24817392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7716801A Granted FR2357072A1 (fr) | 1976-06-30 | 1977-05-26 | Element d'interconnexion a couches multiples et son procede de fabrication |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5325864A (fr) |
CA (1) | CA1073557A (fr) |
DE (1) | DE2728360A1 (fr) |
FR (1) | FR2357072A1 (fr) |
IT (1) | IT1115527B (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2430094A1 (fr) * | 1978-06-30 | 1980-01-25 | Ibm | Agencement de circuits integres a films minces comportant des lignes a pertes |
FR2479520A1 (fr) * | 1980-03-26 | 1981-10-02 | Thomson Csf | Transducteur composite a adressage electrique |
EP0127377A2 (fr) * | 1983-05-31 | 1984-12-05 | Trw Inc. | Système d'interconnexion à boutons d'une puce et d'une plaque de circuits |
EP0622847A2 (fr) * | 1993-04-27 | 1994-11-02 | International Business Machines Corporation | Boîtier et architecture tri-dimensionnels pour un ordinateur à haute performance |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5811117B2 (ja) * | 1979-03-12 | 1983-03-01 | 富士通株式会社 | 多層印刷配線板の製造方法 |
JPS55123195A (en) * | 1979-03-15 | 1980-09-22 | Fujitsu Ltd | Hollow coaxial structure multilayer printed board |
JPS55153397A (en) * | 1979-05-18 | 1980-11-29 | Fujitsu Ltd | Method of fabricating hollow multilayer printed board |
JPS55156395A (en) * | 1979-05-24 | 1980-12-05 | Fujitsu Ltd | Method of fabricating hollow multilayer printed board |
DE3210826C2 (de) * | 1982-03-24 | 1985-09-26 | Siemens AG, 1000 Berlin und 8000 München | Übertragungsleitung, bestehend aus einer Mehrlagenleiterplatte |
JPS6284973U (fr) * | 1985-11-19 | 1987-05-30 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1136753A (en) * | 1965-10-26 | 1968-12-18 | English Electric Computers Ltd | Improvements relating to electrical connecting arrangements |
-
1977
- 1977-05-25 CA CA279,129A patent/CA1073557A/fr not_active Expired
- 1977-05-26 FR FR7716801A patent/FR2357072A1/fr active Granted
- 1977-06-03 JP JP6496277A patent/JPS5325864A/ja active Pending
- 1977-06-21 IT IT2488977A patent/IT1115527B/it active
- 1977-06-23 DE DE19772728360 patent/DE2728360A1/de active Pending
Non-Patent Citations (1)
Title |
---|
NEANT * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2430094A1 (fr) * | 1978-06-30 | 1980-01-25 | Ibm | Agencement de circuits integres a films minces comportant des lignes a pertes |
FR2479520A1 (fr) * | 1980-03-26 | 1981-10-02 | Thomson Csf | Transducteur composite a adressage electrique |
EP0127377A2 (fr) * | 1983-05-31 | 1984-12-05 | Trw Inc. | Système d'interconnexion à boutons d'une puce et d'une plaque de circuits |
EP0127377A3 (en) * | 1983-05-31 | 1985-04-10 | Trw Inc. | Button board chip interconnection system |
EP0622847A2 (fr) * | 1993-04-27 | 1994-11-02 | International Business Machines Corporation | Boîtier et architecture tri-dimensionnels pour un ordinateur à haute performance |
EP0622847A3 (en) * | 1993-04-27 | 1994-11-23 | Ibm | Three dimensional package and architecture for high performance computer. |
US5495397A (en) * | 1993-04-27 | 1996-02-27 | International Business Machines Corporation | Three dimensional package and architecture for high performance computer |
US5817986A (en) * | 1993-04-27 | 1998-10-06 | International Business Machines Corporation | Three dimensional package and architecture for high performance computer |
Also Published As
Publication number | Publication date |
---|---|
DE2728360A1 (de) | 1978-01-05 |
JPS5325864A (en) | 1978-03-10 |
CA1073557A (fr) | 1980-03-11 |
IT1115527B (it) | 1986-02-03 |
FR2357072B1 (fr) | 1978-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |