GB1512605A - Microwave integrated printed circuits - Google Patents

Microwave integrated printed circuits

Info

Publication number
GB1512605A
GB1512605A GB3265876A GB3265876A GB1512605A GB 1512605 A GB1512605 A GB 1512605A GB 3265876 A GB3265876 A GB 3265876A GB 3265876 A GB3265876 A GB 3265876A GB 1512605 A GB1512605 A GB 1512605A
Authority
GB
United Kingdom
Prior art keywords
sheet
copper
coated
microwave
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3265876A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB3265876A priority Critical patent/GB1512605A/en
Publication of GB1512605A publication Critical patent/GB1512605A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H01P1/387—Strip line circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10643—Disc shaped leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)

Abstract

1512605 Microwave printed circuits STANDARD TELEPHONES & CABLES Ltd 5 Aug 1976 32658/76 Heading H1R A microwave integrated circuit is fabricated from two sheets 1, 2 of uncoated microwave dielectric, e.g. glass reinforced PTFE, having locating holes (not shown) and elementary through holes 3, 4 into which ferrite elements 5, 6 are push fitted. Sheet 1 is then coated on both sides with films 7, 8 of high temperature bonding material and copper sheets 9, 10; the sandwich being temperature bonded in a press. Thereafter copper sheet 10 is coated with etch resist, and a desired conductor pattern is printed on the coated copper, the required pattern is etched in, and the residual resist washed off. Bonding films 11, 12 are then applied to the second dielectric sheet and a copper sheet is applied to one side, after which it is laid up with the first sheet with the ferrite elements in register and the copper coated side exposed, after which the sandwich is again temperature bonded in a press.
GB3265876A 1976-08-05 1976-08-05 Microwave integrated printed circuits Expired GB1512605A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3265876A GB1512605A (en) 1976-08-05 1976-08-05 Microwave integrated printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3265876A GB1512605A (en) 1976-08-05 1976-08-05 Microwave integrated printed circuits

Publications (1)

Publication Number Publication Date
GB1512605A true GB1512605A (en) 1978-06-01

Family

ID=10342046

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3265876A Expired GB1512605A (en) 1976-08-05 1976-08-05 Microwave integrated printed circuits

Country Status (1)

Country Link
GB (1) GB1512605A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197476A2 (en) * 1985-04-03 1986-10-15 ANT Nachrichtentechnik GmbH Microwave circulator
EP0446107A1 (en) * 1990-03-09 1991-09-11 Tekelec Airtronic Transmission system for electrical energy, in the microwave field, with gyromagnetic effect, such as a circulator, isolator or filter
EP0917197A2 (en) * 1997-11-07 1999-05-19 Nec Corporation High-frequency integrated circuit and method for manufacturing the same
EP1274149A2 (en) * 2001-07-05 2003-01-08 Matsushita Electric Industrial Co., Ltd. Radio frequency circuit manufacturing method and radio frequency circuit
EP1291958A1 (en) * 2001-08-10 2003-03-12 Tyco Electronics Corporation Compact multi-element cascade circulator

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197476A2 (en) * 1985-04-03 1986-10-15 ANT Nachrichtentechnik GmbH Microwave circulator
EP0197476A3 (en) * 1985-04-03 1988-08-31 Ant Nachrichtentechnik Gmbh Microwave circulator
EP0446107A1 (en) * 1990-03-09 1991-09-11 Tekelec Airtronic Transmission system for electrical energy, in the microwave field, with gyromagnetic effect, such as a circulator, isolator or filter
FR2659499A1 (en) * 1990-03-09 1991-09-13 Tekelec Airtronic Sa SYSTEM FOR TRANSMITTING ELECTRIC ENERGY, WITH HYPERFREQUENCIES, WITH GYROMAGNETIC EFFECT, SUCH AS CIRCULATOR, ISOLATOR OR FILTER.
US5153537A (en) * 1990-03-09 1992-10-06 Tekelec Airtronic Electric power transmission system for hyperfrequencies having a gyromagnetic effect
EP0917197A3 (en) * 1997-11-07 2000-09-20 Nec Corporation High-frequency integrated circuit and method for manufacturing the same
EP0917197A2 (en) * 1997-11-07 1999-05-19 Nec Corporation High-frequency integrated circuit and method for manufacturing the same
US6504444B1 (en) 1997-11-07 2003-01-07 Nec Corporation High frequency integrated circuit including an isolator and dielectric filter
EP1274149A2 (en) * 2001-07-05 2003-01-08 Matsushita Electric Industrial Co., Ltd. Radio frequency circuit manufacturing method and radio frequency circuit
EP1274149A3 (en) * 2001-07-05 2003-10-01 Matsushita Electric Industrial Co., Ltd. Radio frequency circuit manufacturing method and radio frequency circuit
EP1291958A1 (en) * 2001-08-10 2003-03-12 Tyco Electronics Corporation Compact multi-element cascade circulator
US6822524B2 (en) 2001-08-10 2004-11-23 Tyco Electronics Corporation Compact multi-element cascade circulator
CN100426585C (en) * 2001-08-10 2008-10-15 泰科电子公司 Compact multi-element cascade cyclic energy transferring device

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee