GB1511560A - Methods of modifying or repairing printed circuits - Google Patents
Methods of modifying or repairing printed circuitsInfo
- Publication number
- GB1511560A GB1511560A GB4325075A GB4325075A GB1511560A GB 1511560 A GB1511560 A GB 1511560A GB 4325075 A GB4325075 A GB 4325075A GB 4325075 A GB4325075 A GB 4325075A GB 1511560 A GB1511560 A GB 1511560A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- tracks
- etching
- polyimide
- insulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
1511560 Printed circuits INTERNATIONAL COMPUTERS Ltd 18 Oct 1976 [22 Oct 1975] 43250/75 Heading H1R A microwired printed circuit assembly comprises an insulant substrate 2 of, e.g. polyimide on which conductors 3, 4, 5, 6 of, e.g. gold are formed, e.g. by deposition and etching. The circuit is modified or repaired by inserting and bonding to selected conductors a connection member 7 comprising a conductive track 8 overlapping an insulant layer 9 of equivalent width; the projecting ends 10 of the track being, e.g. thermocompression bonded, e.g. to conductors 3, 6 of the assembly and isolated from conductors 4, 5. Subsurface conductors 11 are interconnected with conductors 3, 4, 5, 6 through holes, and the members 7 link tracks 3, 6 to replace faulty connections over tracks 11. Member 7 is formed by depositing electrolessly a conductive track of, e.g. chromium overlaid with gold on polyimide, subdividing it and etching the latter to expose ends. Alternatively (Fig. 3, not shown) plural tracks of similar dimensions to tracks 8 may be deposited on polyimide sheet of the same thickness as layer 9, the ends may be exposed by etching, and the sheet subdivided between the tracks. The insulant layer may be deposited on preformed conductive tracks.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4325075A GB1511560A (en) | 1976-10-18 | 1976-10-18 | Methods of modifying or repairing printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4325075A GB1511560A (en) | 1976-10-18 | 1976-10-18 | Methods of modifying or repairing printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1511560A true GB1511560A (en) | 1978-05-24 |
Family
ID=10427928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4325075A Expired GB1511560A (en) | 1976-10-18 | 1976-10-18 | Methods of modifying or repairing printed circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1511560A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2540328A1 (en) * | 1983-01-31 | 1984-08-03 | Inf Milit Spatiale Aeronaut | |
WO1989006087A1 (en) * | 1987-12-18 | 1989-06-29 | Flowlyne (Uk) Limited | Improvements in or relating to the repair of electrical circuits |
-
1976
- 1976-10-18 GB GB4325075A patent/GB1511560A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2540328A1 (en) * | 1983-01-31 | 1984-08-03 | Inf Milit Spatiale Aeronaut | |
EP0115460A2 (en) * | 1983-01-31 | 1984-08-08 | Compagnie D'informatique Militaire Spatiale Et Aeronautique | Flexible printed circuit card, process for the modification of a printed circuit card, and printed circuit card |
EP0115460A3 (en) * | 1983-01-31 | 1984-08-29 | Compagnie D'informatique Militaire Spatiale Et Aeronautique | Flexible printed circuit card, process for the modification of a printed circuit card, and printed circuit card |
WO1989006087A1 (en) * | 1987-12-18 | 1989-06-29 | Flowlyne (Uk) Limited | Improvements in or relating to the repair of electrical circuits |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19961017 |