JPS5325864A - Multilayer substrate package - Google Patents

Multilayer substrate package

Info

Publication number
JPS5325864A
JPS5325864A JP6496277A JP6496277A JPS5325864A JP S5325864 A JPS5325864 A JP S5325864A JP 6496277 A JP6496277 A JP 6496277A JP 6496277 A JP6496277 A JP 6496277A JP S5325864 A JPS5325864 A JP S5325864A
Authority
JP
Japan
Prior art keywords
multilayer substrate
substrate package
package
multilayer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6496277A
Other languages
English (en)
Inventor
Yan Doo Ben
Fuu Fuan Furanku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5325864A publication Critical patent/JPS5325864A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP6496277A 1976-06-30 1977-06-03 Multilayer substrate package Pending JPS5325864A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70144176A 1976-06-30 1976-06-30

Publications (1)

Publication Number Publication Date
JPS5325864A true JPS5325864A (en) 1978-03-10

Family

ID=24817392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6496277A Pending JPS5325864A (en) 1976-06-30 1977-06-03 Multilayer substrate package

Country Status (5)

Country Link
JP (1) JPS5325864A (ja)
CA (1) CA1073557A (ja)
DE (1) DE2728360A1 (ja)
FR (1) FR2357072A1 (ja)
IT (1) IT1115527B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120198A (en) * 1979-03-12 1980-09-16 Fujitsu Ltd Multilayer printed circuit board and method of fabricating same
JPS55123195A (en) * 1979-03-15 1980-09-22 Fujitsu Ltd Hollow coaxial structure multilayer printed board
JPS55153397A (en) * 1979-05-18 1980-11-29 Fujitsu Ltd Method of fabricating hollow multilayer printed board
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4210885A (en) * 1978-06-30 1980-07-01 International Business Machines Corporation Thin film lossy line for preventing reflections in microcircuit chip package interconnections
FR2479520A1 (fr) * 1980-03-26 1981-10-02 Thomson Csf Transducteur composite a adressage electrique
DE3210826C2 (de) * 1982-03-24 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Übertragungsleitung, bestehend aus einer Mehrlagenleiterplatte
DE3480984D1 (de) * 1983-05-31 1990-02-08 Trw Inc Verbindungseinrichtung mit knoepfen fuer einen chip und eine schaltungsplatte.
JPS6284973U (ja) * 1985-11-19 1987-05-30
US5495397A (en) * 1993-04-27 1996-02-27 International Business Machines Corporation Three dimensional package and architecture for high performance computer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120198A (en) * 1979-03-12 1980-09-16 Fujitsu Ltd Multilayer printed circuit board and method of fabricating same
JPS5811117B2 (ja) * 1979-03-12 1983-03-01 富士通株式会社 多層印刷配線板の製造方法
JPS55123195A (en) * 1979-03-15 1980-09-22 Fujitsu Ltd Hollow coaxial structure multilayer printed board
JPS55153397A (en) * 1979-05-18 1980-11-29 Fujitsu Ltd Method of fabricating hollow multilayer printed board
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
JPS5739559B2 (ja) * 1979-05-24 1982-08-21

Also Published As

Publication number Publication date
DE2728360A1 (de) 1978-01-05
FR2357072B1 (ja) 1978-11-03
IT1115527B (it) 1986-02-03
FR2357072A1 (fr) 1978-01-27
CA1073557A (en) 1980-03-11

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