JPS5739559B2 - - Google Patents

Info

Publication number
JPS5739559B2
JPS5739559B2 JP54064329A JP6432979A JPS5739559B2 JP S5739559 B2 JPS5739559 B2 JP S5739559B2 JP 54064329 A JP54064329 A JP 54064329A JP 6432979 A JP6432979 A JP 6432979A JP S5739559 B2 JPS5739559 B2 JP S5739559B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54064329A
Other versions
JPS55156395A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6432979A priority Critical patent/JPS55156395A/ja
Priority to PCT/JP1980/000111 priority patent/WO1980002633A1/ja
Priority to US06/229,594 priority patent/US4368503A/en
Priority to BR8008696A priority patent/BR8008696A/pt
Priority to AU59856/80A priority patent/AU530841B2/en
Priority to DE8080900951T priority patent/DE3072112D1/de
Priority to CA000352692A priority patent/CA1149518A/en
Priority to EP80900951A priority patent/EP0028657B1/en
Publication of JPS55156395A publication Critical patent/JPS55156395A/ja
Priority to ES499461A priority patent/ES8202469A1/es
Priority to ES499462A priority patent/ES499462A0/es
Priority to US06/393,324 priority patent/US4528072A/en
Publication of JPS5739559B2 publication Critical patent/JPS5739559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
JP6432979A 1979-05-24 1979-05-24 Method of fabricating hollow multilayer printed board Granted JPS55156395A (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP6432979A JPS55156395A (en) 1979-05-24 1979-05-24 Method of fabricating hollow multilayer printed board
DE8080900951T DE3072112D1 (en) 1979-05-24 1980-05-23 Hollow multilayer printed wiring board, and method of fabricating same
US06/229,594 US4368503A (en) 1979-05-24 1980-05-23 Hollow multilayer printed wiring board
BR8008696A BR8008696A (pt) 1979-05-24 1980-05-23 Painel de circuito impresso de miltiplas camadas, oco, e processo para fabricacao do mesmo
AU59856/80A AU530841B2 (en) 1979-05-24 1980-05-23 Hollow multilayer printed wiring board, and method of fabricating same
PCT/JP1980/000111 WO1980002633A1 (en) 1979-05-24 1980-05-23 Hollow multilayer printed wiring board,and method of fabricating same
CA000352692A CA1149518A (en) 1979-05-24 1980-05-26 Hollow multilayer printed wiring board and process for manufacturing same
EP80900951A EP0028657B1 (en) 1979-05-24 1980-12-01 Hollow multilayer printed wiring board, and method of fabricating same
ES499461A ES8202469A1 (es) 1979-05-24 1981-02-16 Un procedimiento para fabricar una placa de circuito impresomultiple hueca
ES499462A ES499462A0 (es) 1979-05-24 1981-02-16 Un procedimiento para fabricar una placa de circuito impresomultiple hueca
US06/393,324 US4528072A (en) 1979-05-24 1982-06-29 Process for manufacturing hollow multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6432979A JPS55156395A (en) 1979-05-24 1979-05-24 Method of fabricating hollow multilayer printed board

Publications (2)

Publication Number Publication Date
JPS55156395A JPS55156395A (en) 1980-12-05
JPS5739559B2 true JPS5739559B2 (ja) 1982-08-21

Family

ID=13255083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6432979A Granted JPS55156395A (en) 1979-05-24 1979-05-24 Method of fabricating hollow multilayer printed board

Country Status (7)

Country Link
US (2) US4368503A (ja)
EP (1) EP0028657B1 (ja)
JP (1) JPS55156395A (ja)
CA (1) CA1149518A (ja)
DE (1) DE3072112D1 (ja)
ES (2) ES8202469A1 (ja)
WO (1) WO1980002633A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0510783Y2 (ja) * 1987-12-01 1993-03-16

Families Citing this family (77)

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JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4551747A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
JPS6047495A (ja) * 1983-08-25 1985-03-14 株式会社日立製作所 セラミツク配線基板
DE3412290A1 (de) * 1984-04-03 1985-10-03 System Kontakt Gesellschaft für elektronische Bauelemente mbH, 7107 Bad Friedrichshall Mehrlagige leiterplatte in multilayer- oder stapeltechnik
FR2565760B1 (fr) * 1984-06-08 1988-05-20 Aerospatiale Procede pour la realisation d'un circuit imprime et circuit imprime obtenu par la mise en oeuvre dudit procede
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US9827421B2 (en) 2012-03-12 2017-11-28 Valencia Technologies Corporation Methods and systems for treating a chronic low back pain condition using an implantable electroacupuncture device
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JP6385075B2 (ja) * 2013-04-15 2018-09-05 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
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CN205584642U (zh) * 2013-07-11 2016-09-14 株式会社村田制作所 树脂多层基板
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0510783Y2 (ja) * 1987-12-01 1993-03-16

Also Published As

Publication number Publication date
JPS55156395A (en) 1980-12-05
EP0028657A1 (en) 1981-05-20
ES499461A0 (es) 1982-01-16
EP0028657B1 (en) 1988-08-10
EP0028657A4 (en) 1982-11-08
US4528072A (en) 1985-07-09
DE3072112D1 (en) 1988-09-15
US4368503A (en) 1983-01-11
ES8202470A1 (es) 1982-01-16
ES499462A0 (es) 1982-01-16
WO1980002633A1 (en) 1980-11-27
ES8202469A1 (es) 1982-01-16
CA1149518A (en) 1983-07-05

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