NL7515090A - Werkwijze om neerlaags gedrukte bedradingen te vervaardigen. - Google Patents

Werkwijze om neerlaags gedrukte bedradingen te vervaardigen.

Info

Publication number
NL7515090A
NL7515090A NL7515090A NL7515090A NL7515090A NL 7515090 A NL7515090 A NL 7515090A NL 7515090 A NL7515090 A NL 7515090A NL 7515090 A NL7515090 A NL 7515090A NL 7515090 A NL7515090 A NL 7515090A
Authority
NL
Netherlands
Prior art keywords
procedure
manufacturing printed
printed wires
wires
manufacturing
Prior art date
Application number
NL7515090A
Other languages
English (en)
Original Assignee
Hideo Machida
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hideo Machida filed Critical Hideo Machida
Publication of NL7515090A publication Critical patent/NL7515090A/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
NL7515090A 1974-12-28 1975-12-24 Werkwijze om neerlaags gedrukte bedradingen te vervaardigen. NL7515090A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP406775A JPS5210568A (en) 1974-12-28 1974-12-28 Method of manufacturing multilayered printed wiring substrate

Publications (1)

Publication Number Publication Date
NL7515090A true NL7515090A (nl) 1976-06-30

Family

ID=11574472

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7515090A NL7515090A (nl) 1974-12-28 1975-12-24 Werkwijze om neerlaags gedrukte bedradingen te vervaardigen.

Country Status (4)

Country Link
JP (1) JPS5210568A (nl)
DE (2) DE2558367A1 (nl)
FR (1) FR2296347A1 (nl)
NL (1) NL7515090A (nl)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3006117C2 (de) * 1980-02-19 1981-11-26 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen
US4416914A (en) * 1980-12-29 1983-11-22 General Electric Company Electrical conductors arranged in multiple layers and preparation thereof
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
DE3137279C2 (de) * 1981-09-18 1986-12-11 Wilhelm Ruf KG, 8000 München Verfahren zur Herstellung von Mehrlagen-Leiterplatten sowie nach dem Verfahren hergestellte mehrlagige Leiterplatte
DE3407799A1 (de) * 1984-03-02 1985-09-05 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zur herstellung einer multilayer-hybridschaltung
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
US4735676A (en) * 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
US4724040A (en) * 1986-01-14 1988-02-09 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electric circuits on a base boad
CA1261481A (en) * 1986-03-13 1989-09-26 Kazumasa Eguchi Printed circuit board capable of preventing electromagnetic interference
AU8107987A (en) * 1986-09-30 1988-04-21 Wilde Membran Impulstechnik G.m.b.H. Electrically conductive structure with applied metallization
DE3733002A1 (de) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Additiv metallisierte elektrisch leitfaehige struktur
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
DE3704498A1 (de) * 1987-02-13 1988-08-25 Aristo Graphic Systeme Verfahren zur herstellung eines digitalisiertabletts
DE3704497A1 (de) * 1987-02-13 1988-08-25 Aristo Graphic Systeme Verfahren zur herstellung eines digitalisiertabletts
JPH0724335B2 (ja) * 1987-04-30 1995-03-15 三井金属鉱業株式会社 多層回路基板の製造法
DE3741918A1 (de) * 1987-12-10 1989-06-22 Heino Pachschwoell Verfahren zur herstellung einer elektronischen schaltungsvorrichtung
KR900005308B1 (ko) * 1987-12-31 1990-07-27 정풍물산 주식회사 인쇄회로기판과 그의 제조방법
JPH0682926B2 (ja) * 1988-04-22 1994-10-19 日本電気株式会社 多層配線基板の製造方法
EP0375954B1 (en) * 1988-11-29 1994-03-16 Nippon Cmk Corporation Limited Method of manufacturing printed circuit board
CN107484358B (zh) * 2017-07-26 2019-06-21 江门崇达电路技术有限公司 一种无压合无钻孔的多层线路板制作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517518B2 (nl) * 1972-01-28 1980-05-12

Also Published As

Publication number Publication date
DE2558367A1 (de) 1976-07-08
DE2558744A1 (de) 1976-07-01
FR2296347A1 (fr) 1976-07-23
JPS5210568A (en) 1977-01-26

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Legal Events

Date Code Title Description
BV The patent application has lapsed