GB884964A - Improvements in or relating to manufacturing processes of electric circuits - Google Patents

Improvements in or relating to manufacturing processes of electric circuits

Info

Publication number
GB884964A
GB884964A GB16214/58D GB1621458D GB884964A GB 884964 A GB884964 A GB 884964A GB 16214/58 D GB16214/58 D GB 16214/58D GB 1621458 D GB1621458 D GB 1621458D GB 884964 A GB884964 A GB 884964A
Authority
GB
United Kingdom
Prior art keywords
panel
circuit
recesses
metallization
capacitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB16214/58D
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP DE REVETEMENT CHIMIQUE S
Original Assignee
EUROP DE REVETEMENT CHIMIQUE S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP DE REVETEMENT CHIMIQUE S filed Critical EUROP DE REVETEMENT CHIMIQUE S
Publication of GB884964A publication Critical patent/GB884964A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

884,964. Printed circuits. SOC. EUROPEEUNE DE REVETEMENT CHIMIQUE SEUREC. Aug. 14, 1958 [Aug. 28, 1957], No. 26214/58. Class 37. [Also in Group XXXIX] Printed circuits are manufactured by a process comprising the steps of producing recesses on an insulating panel in the configuration of the desired circuit pattern, coating the raised portions of the panel with a material which inhibits the deposition of metal thereon and finally applying a layer of metallization to the panel, the metallization being effective only in the recesses. Fig. 3 shows the invention applied to the production of the circuit of Fig. 2. The coil 101 comprises two halves on opposite sides of the panel 100 connected through the hole 104. A hole 112 bored in the thickness of the panel makes contact between the terminals 105, the mid-point of the coil at 104 and the common plate 108-109 of the two capacitors. In a modification, Figs. 8 and 9, the circuit is formed on two panels, that bearing the capacitors, Fig. 9, plugging into the other one, Fig. 8. A second circuit to which the invention may be applied comprises a rectangular array of ferrite cores, Fig. 16, the cores being interconnected by printed conductors 302, 303 formed upon the insulating panel 300. The ferrite cores are contained in recesses in the panel 300, being retained in place by washers 305.
GB16214/58D 1957-08-28 1958-08-14 Improvements in or relating to manufacturing processes of electric circuits Expired GB884964A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR884964X 1957-08-28

Publications (1)

Publication Number Publication Date
GB884964A true GB884964A (en) 1961-12-20

Family

ID=31971061

Family Applications (1)

Application Number Title Priority Date Filing Date
GB16214/58D Expired GB884964A (en) 1957-08-28 1958-08-14 Improvements in or relating to manufacturing processes of electric circuits

Country Status (3)

Country Link
CH (1) CH354129A (en)
FR (1) FR1181724A (en)
GB (1) GB884964A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000382A (en) * 1977-06-20 1979-01-04 Knogo Corp Target wafer for use in an electronic theft detection system
GB2126428A (en) * 1982-09-03 1984-03-21 Fluke Mfg Co Inc Molded circuit board and manufacturing method therefor
GB2260024A (en) * 1991-08-19 1993-03-31 Kitagawa Ind Co Ltd Electrical components and methods of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996003851A1 (en) * 1994-07-25 1996-02-08 Minnesota Mining And Manufacturing Company Microridge abrasion for selective metalization

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000382A (en) * 1977-06-20 1979-01-04 Knogo Corp Target wafer for use in an electronic theft detection system
GB2000382B (en) * 1977-06-20 1982-01-20 Knogo Corp Target wafer for use in an electronic theft detection system
GB2126428A (en) * 1982-09-03 1984-03-21 Fluke Mfg Co Inc Molded circuit board and manufacturing method therefor
GB2260024A (en) * 1991-08-19 1993-03-31 Kitagawa Ind Co Ltd Electrical components and methods of manufacturing the same
US5391392A (en) * 1991-08-19 1995-02-21 Kitagawa Industries Co., Ltd. Method for manufacturing electrical components
GB2260024B (en) * 1991-08-19 1995-12-06 Kitagawa Ind Co Ltd Electrical components and methods of manufacturing the same

Also Published As

Publication number Publication date
FR1181724A (en) 1959-06-18
CH354129A (en) 1961-05-15

Similar Documents

Publication Publication Date Title
GB1391038A (en) Photoetched inductor assembly and method of manufacturing same
HK31382A (en) Insulating substrate with metallic coating and method for manufacturing same
GB834181A (en) Improvements in or relating to printed electric circuits
ES8703710A1 (en) Injection molded multi-layer circuit board and method of making same.
FR2296347A1 (en) Multi-ply laminate, printed circuit - mfd. by metallising a base etching a circuit, coating the bared part with dielectric applying conductor lines, and re-coating (NL-300676)
JPS6442809A (en) Manufacture of laminated ceramic capacitor
GB1062636A (en) Electronic circuit element and method of manufacture
GB1239477A (en)
GB884964A (en) Improvements in or relating to manufacturing processes of electric circuits
GB1262245A (en) Production of circuit boards
ES489178A1 (en) Process for manufacturing an electrical thin-film capacitor.
GB1239824A (en) Magnetic circuit element
GB985244A (en) Sheet array of magnetic metal elements and methods of making same
JPS5283070A (en) Production of semiconductor device
GB1014752A (en) Improvements in or relating to thin film magnetic members
GB1385732A (en) Printed circuit boards
CA1000415A (en) Method of manufacturing electrically conductive metal layers on substrates
JPS5786124A (en) Magnetic resistance effect type magnetic head and its manufacture
JPS56154804A (en) Uniting method for triplet strip line
GB1251949A (en)
GB1386344A (en) Manufacture of multiple laminated conductor boards
JPS6424492A (en) Coil device
GB879395A (en) Improvements relating to printed circuits
JPS5680815A (en) Production of magnetic head
JPH02303090A (en) Multilayer board