GB1386344A - Manufacture of multiple laminated conductor boards - Google Patents

Manufacture of multiple laminated conductor boards

Info

Publication number
GB1386344A
GB1386344A GB783672A GB783672A GB1386344A GB 1386344 A GB1386344 A GB 1386344A GB 783672 A GB783672 A GB 783672A GB 783672 A GB783672 A GB 783672A GB 1386344 A GB1386344 A GB 1386344A
Authority
GB
United Kingdom
Prior art keywords
layer
insulating
holes
conductive
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB783672A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hochvakuum Dresden VEB
Original Assignee
Hochvakuum Dresden VEB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hochvakuum Dresden VEB filed Critical Hochvakuum Dresden VEB
Priority to GB783672A priority Critical patent/GB1386344A/en
Publication of GB1386344A publication Critical patent/GB1386344A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

1386344 Printed circuits; inductors HOCHVAKUUM DRESDEN VEB 21 Feb 1972 7836/72 Headings H1R and H1T A multiple laminated conductor board is manufactured by applying alternate conductive and insulating layers to an insulating support element by evaporation or cathodic atomization in a vacuum, connections between adjacent conducting layers being provided through holes in the intervening insulating layer made by masks, programmed removal of the insulating material, charged particle or electromagnetic beam bombardment, electro-erosion or by etching. A conductive layer 3, Fig. 2, is evaporated on to a bonding agent 2 applied to one surface of an insulating support element 1, followed by evaporation of an insulating layer 18 over the conductor layer, any required holes 19 in the insulating layer and any conductor patterns in the conductor layer being formed by masking etching techniques, or by removal of material by charged particle or electromagnetic beam bombardment. Further conductive and insulating layers may be added as required. External components may be connected by inserting connector pins 9, 13 into holes 10, 14 formed in the support 1 and in the multiple laminate, said holes being lined when the last conductor layer to be connected to the component is applied to the laminate. A final insulating layer 12 is applied after soldering the connector pins into place. Single layer and multi-layer components, e.g. coils, capacitors may be formed in the conductive layers.
GB783672A 1972-02-21 1972-02-21 Manufacture of multiple laminated conductor boards Expired GB1386344A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB783672A GB1386344A (en) 1972-02-21 1972-02-21 Manufacture of multiple laminated conductor boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB783672A GB1386344A (en) 1972-02-21 1972-02-21 Manufacture of multiple laminated conductor boards

Publications (1)

Publication Number Publication Date
GB1386344A true GB1386344A (en) 1975-03-05

Family

ID=9840711

Family Applications (1)

Application Number Title Priority Date Filing Date
GB783672A Expired GB1386344A (en) 1972-02-21 1972-02-21 Manufacture of multiple laminated conductor boards

Country Status (1)

Country Link
GB (1) GB1386344A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485866A1 (en) * 1980-06-30 1981-12-31 Sharp Kk THIN CABLING SUBSTRATE
US4962287A (en) * 1988-04-14 1990-10-09 Alps Electric Co., Ltd. Flexible printed wire board
US5378858A (en) * 1991-10-31 1995-01-03 U.S. Philips Corporation Two-layer or multilayer printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2485866A1 (en) * 1980-06-30 1981-12-31 Sharp Kk THIN CABLING SUBSTRATE
US4962287A (en) * 1988-04-14 1990-10-09 Alps Electric Co., Ltd. Flexible printed wire board
US5378858A (en) * 1991-10-31 1995-01-03 U.S. Philips Corporation Two-layer or multilayer printed circuit board

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee