NL8301586A - Werkwijze en inrichting voor het vervaardigen van geleiderplaten. - Google Patents
Werkwijze en inrichting voor het vervaardigen van geleiderplaten. Download PDFInfo
- Publication number
- NL8301586A NL8301586A NL8301586A NL8301586A NL8301586A NL 8301586 A NL8301586 A NL 8301586A NL 8301586 A NL8301586 A NL 8301586A NL 8301586 A NL8301586 A NL 8301586A NL 8301586 A NL8301586 A NL 8301586A
- Authority
- NL
- Netherlands
- Prior art keywords
- holes
- screen printing
- foil
- metal
- base material
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 32
- 238000005530 etching Methods 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000011888 foil Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000011049 filling Methods 0.000 claims description 10
- 238000005253 cladding Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims 3
- 238000005553 drilling Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000007605 air drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000000454 electroless metal deposition Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GJCXHYNLSNVSQZ-UHFFFAOYSA-L [Cu](Cl)Cl.Cl Chemical compound [Cu](Cl)Cl.Cl GJCXHYNLSNVSQZ-UHFFFAOYSA-L 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3217983 | 1982-05-13 | ||
| DE3217983A DE3217983C2 (de) | 1982-05-13 | 1982-05-13 | Verfahren zum Herstellen einer Abdeckmaske |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8301586A true NL8301586A (nl) | 1983-12-01 |
Family
ID=6163461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8301586A NL8301586A (nl) | 1982-05-13 | 1983-05-04 | Werkwijze en inrichting voor het vervaardigen van geleiderplaten. |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS58206192A (sv) |
| CA (1) | CA1196731A (sv) |
| CH (1) | CH659753A5 (sv) |
| DE (1) | DE3217983C2 (sv) |
| DK (1) | DK210983A (sv) |
| GB (1) | GB2120017B (sv) |
| IT (1) | IT1197651B (sv) |
| NL (1) | NL8301586A (sv) |
| SE (1) | SE8302619L (sv) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3514093A1 (de) * | 1985-04-16 | 1986-10-23 | Kaspar 5241 Gebhardshain Eidenberg | Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen |
| US4748742A (en) * | 1986-11-26 | 1988-06-07 | Multitek Corporation | Method for temporarily sealing holes in printed circuit boards |
| US4884337A (en) * | 1986-11-26 | 1989-12-05 | Epicor Technology, Inc. | Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material |
| US6276055B1 (en) * | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| DE10196259T1 (de) | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | Füllverfahren |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| JP2004501513A (ja) | 2000-05-31 | 2004-01-15 | ハネウエル・インターナシヨナル・インコーポレーテツド | 充填方法 |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| CN110557889A (zh) * | 2018-05-30 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | 一种铝片网版塞孔的制作方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1249966B (de) * | 1967-09-14 | Ruwel-Werke, Spezialfabrik für Hochfrequenzbauteile, Inh. Ing. Fritz Stahl, Geldern (RhId.) | Verfahren zum Herstellen von metallisierten Wandungen von Bohrungen in gedruckten Leiterplatten | |
| GB1042234A (en) * | 1965-03-05 | 1966-09-14 | Mullard Ltd | Multilayer printed circuits |
| GB1194853A (en) * | 1967-02-16 | 1970-06-17 | Btr Industries Ltd | A Method of Forming Printed Circuits |
| JPS52118261A (en) * | 1976-03-30 | 1977-10-04 | Matsushita Electric Ind Co Ltd | Method of producing through hole printed circuit board |
| JPS5658797A (en) * | 1979-10-18 | 1981-05-21 | Yashima Denki Kk | Ac power control circuit in induction motor |
| JPS5667985A (en) * | 1979-11-08 | 1981-06-08 | Matsushita Electric Ind Co Ltd | Method of printing ink using metal mask |
-
1982
- 1982-05-13 DE DE3217983A patent/DE3217983C2/de not_active Expired
-
1983
- 1983-05-03 GB GB08312009A patent/GB2120017B/en not_active Expired
- 1983-05-04 NL NL8301586A patent/NL8301586A/nl not_active Application Discontinuation
- 1983-05-06 SE SE8302619A patent/SE8302619L/sv not_active Application Discontinuation
- 1983-05-10 JP JP58083445A patent/JPS58206192A/ja active Pending
- 1983-05-10 CH CH2557/83A patent/CH659753A5/de not_active IP Right Cessation
- 1983-05-11 DK DK210983A patent/DK210983A/da not_active Application Discontinuation
- 1983-05-13 CA CA000428115A patent/CA1196731A/en not_active Expired
- 1983-05-13 IT IT48288/83A patent/IT1197651B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| DK210983A (da) | 1983-11-14 |
| DK210983D0 (da) | 1983-05-11 |
| GB2120017A (en) | 1983-11-23 |
| IT8348288A0 (it) | 1983-05-13 |
| DE3217983A1 (de) | 1983-11-17 |
| CH659753A5 (de) | 1987-02-13 |
| IT1197651B (it) | 1988-12-06 |
| SE8302619L (sv) | 1983-11-14 |
| JPS58206192A (ja) | 1983-12-01 |
| GB2120017B (en) | 1986-02-19 |
| GB8312009D0 (en) | 1983-06-08 |
| CA1196731A (en) | 1985-11-12 |
| SE8302619D0 (sv) | 1983-05-06 |
| DE3217983C2 (de) | 1984-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4529477A (en) | Process for the manufacture of printed circuit boards | |
| DE3146946C2 (de) | Verfahren zur Herstellung eines gehärteten Resistmusters auf einer Substratoberfläche | |
| NL8301586A (nl) | Werkwijze en inrichting voor het vervaardigen van geleiderplaten. | |
| CA1131790A (en) | Toning and solvent washout process for making conductive interconnections | |
| JP2014093523A (ja) | 印刷回路基板の製造方法 | |
| CN116076159A (zh) | 印刷电路板的制造方法 | |
| JP2002525882A (ja) | 多層回路の製造方法 | |
| JPH09288358A (ja) | 導体回路の形成方法 | |
| JP3217381B2 (ja) | 多層配線基板の製造方法 | |
| JP2000275865A (ja) | ドラム状露光装置とその装置を用いたプリント配線板の製造法 | |
| JPH04206677A (ja) | ダブルアクセスフレキシブル印刷配線板の製造方法 | |
| JPH02299287A (ja) | プリント回路基板の洗浄方法 | |
| DE2231614A1 (de) | Verfahren zur herstellung gedruckter schaltungen unter verwendung eines photopolymers sowie einer leitfaehigen viskosen dispersion oder paste als stromleiter und vorrichtung zur durchfuehrung des verfahrens | |
| JPS6361794B2 (sv) | ||
| JPH045888A (ja) | プリント配線基板 | |
| JPH0728124B2 (ja) | 両面回路基板の製造方法 | |
| WO1994017648A1 (en) | Method for drying resist film formed by electrodeposition | |
| JPH0147910B2 (sv) | ||
| JPH09506468A (ja) | プリント回路基板の製造方法 | |
| JPS5858838B2 (ja) | 金属芯を有す印刷配線板の製造法 | |
| JPH05259612A (ja) | プリント配線板の製造方法 | |
| JP4267255B2 (ja) | 回路基板の製造方法 | |
| KR900001224B1 (ko) | 원하는 무늬를 갖는 경화 수지 피복물을 기질의 표면상에 형성시키는 방법 | |
| JPS635917B2 (sv) | ||
| KR910011097A (ko) | 레지스트 막에서의 핀홀 제거방법 및 그 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A85 | Still pending on 85-01-01 | ||
| BV | The patent application has lapsed |