NL8103541A - Inrichting met geintegreerde schakelingen en met een metalen verbindingsnetwerk, en een werkwijze voor het vervaardigen van deze inrichting. - Google Patents
Inrichting met geintegreerde schakelingen en met een metalen verbindingsnetwerk, en een werkwijze voor het vervaardigen van deze inrichting. Download PDFInfo
- Publication number
- NL8103541A NL8103541A NL8103541A NL8103541A NL8103541A NL 8103541 A NL8103541 A NL 8103541A NL 8103541 A NL8103541 A NL 8103541A NL 8103541 A NL8103541 A NL 8103541A NL 8103541 A NL8103541 A NL 8103541A
- Authority
- NL
- Netherlands
- Prior art keywords
- conductors
- metal
- supply
- network
- type
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 42
- 239000002184 metal Substances 0.000 title claims description 42
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims description 69
- 239000011810 insulating material Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8025860 | 1980-12-05 | ||
| FR8025860A FR2495835A1 (fr) | 1980-12-05 | 1980-12-05 | Dispositif a circuits integres a reseau metallique d'interconnexion, et procede de fabrication de ce dispositif |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8103541A true NL8103541A (nl) | 1982-07-01 |
Family
ID=9248719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8103541A NL8103541A (nl) | 1980-12-05 | 1981-07-27 | Inrichting met geintegreerde schakelingen en met een metalen verbindingsnetwerk, en een werkwijze voor het vervaardigen van deze inrichting. |
Country Status (6)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS594050A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | 半導体装置 |
| JPH0290651A (ja) * | 1988-09-28 | 1990-03-30 | Nec Corp | 半導体集積回路 |
| GB2263018B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Static random access memories |
| GB2254487B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Full CMOS type static random access memories |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3312871A (en) * | 1964-12-23 | 1967-04-04 | Ibm | Interconnection arrangement for integrated circuits |
| DE2165844C2 (de) * | 1971-12-31 | 1983-02-17 | Elena Vadimovna Moskva Chrenova | Integrierte Schaltung |
| JPS50134385A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-04-09 | 1975-10-24 | ||
| DE2822011C3 (de) * | 1978-05-19 | 1987-09-10 | Fujitsu Ltd., Kawasaki, Kanagawa | Halbleiteranordnung und Verfahren zu deren Herstellung |
-
1980
- 1980-12-05 FR FR8025860A patent/FR2495835A1/fr active Granted
-
1981
- 1981-07-23 GB GB8122774A patent/GB2089121B/en not_active Expired
- 1981-07-27 NL NL8103541A patent/NL8103541A/nl not_active Application Discontinuation
- 1981-11-05 JP JP56177773A patent/JPS57113259A/ja active Pending
- 1981-12-03 DE DE19813147948 patent/DE3147948A1/de not_active Ceased
- 1981-12-03 IT IT25429/81A patent/IT1139897B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2495835B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-04-12 |
| GB2089121B (en) | 1985-02-27 |
| DE3147948A1 (de) | 1982-07-08 |
| IT8125429A0 (it) | 1981-12-03 |
| FR2495835A1 (fr) | 1982-06-11 |
| GB2089121A (en) | 1982-06-16 |
| JPS57113259A (en) | 1982-07-14 |
| IT1139897B (it) | 1986-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A85 | Still pending on 85-01-01 | ||
| BA | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| BC | A request for examination has been filed | ||
| BV | The patent application has lapsed |