IT1139897B - Dispositivo a circuito integrati a rete metallica di interconnnessione e procedimento di fabbricazione di tale dispositivo - Google Patents
Dispositivo a circuito integrati a rete metallica di interconnnessione e procedimento di fabbricazione di tale dispositivoInfo
- Publication number
- IT1139897B IT1139897B IT25429/81A IT2542981A IT1139897B IT 1139897 B IT1139897 B IT 1139897B IT 25429/81 A IT25429/81 A IT 25429/81A IT 2542981 A IT2542981 A IT 2542981A IT 1139897 B IT1139897 B IT 1139897B
- Authority
- IT
- Italy
- Prior art keywords
- interconnection
- integrated circuit
- manufacturing procedure
- network integrated
- metallic network
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8025860A FR2495835A1 (fr) | 1980-12-05 | 1980-12-05 | Dispositif a circuits integres a reseau metallique d'interconnexion, et procede de fabrication de ce dispositif |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8125429A0 IT8125429A0 (it) | 1981-12-03 |
IT1139897B true IT1139897B (it) | 1986-09-24 |
Family
ID=9248719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT25429/81A IT1139897B (it) | 1980-12-05 | 1981-12-03 | Dispositivo a circuito integrati a rete metallica di interconnnessione e procedimento di fabbricazione di tale dispositivo |
Country Status (6)
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS594050A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | 半導体装置 |
JPH0290651A (ja) * | 1988-09-28 | 1990-03-30 | Nec Corp | 半導体集積回路 |
GB2263018B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Static random access memories |
GB2254487B (en) * | 1991-03-23 | 1995-06-21 | Sony Corp | Full CMOS type static random access memories |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3312871A (en) * | 1964-12-23 | 1967-04-04 | Ibm | Interconnection arrangement for integrated circuits |
DE2165844C2 (de) * | 1971-12-31 | 1983-02-17 | Elena Vadimovna Moskva Chrenova | Integrierte Schaltung |
JPS50134385A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-04-09 | 1975-10-24 | ||
DE2822011C3 (de) * | 1978-05-19 | 1987-09-10 | Fujitsu Ltd., Kawasaki, Kanagawa | Halbleiteranordnung und Verfahren zu deren Herstellung |
-
1980
- 1980-12-05 FR FR8025860A patent/FR2495835A1/fr active Granted
-
1981
- 1981-07-23 GB GB8122774A patent/GB2089121B/en not_active Expired
- 1981-07-27 NL NL8103541A patent/NL8103541A/nl not_active Application Discontinuation
- 1981-11-05 JP JP56177773A patent/JPS57113259A/ja active Pending
- 1981-12-03 DE DE19813147948 patent/DE3147948A1/de not_active Ceased
- 1981-12-03 IT IT25429/81A patent/IT1139897B/it active
Also Published As
Publication number | Publication date |
---|---|
FR2495835B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-04-12 |
GB2089121B (en) | 1985-02-27 |
NL8103541A (nl) | 1982-07-01 |
DE3147948A1 (de) | 1982-07-08 |
IT8125429A0 (it) | 1981-12-03 |
FR2495835A1 (fr) | 1982-06-11 |
GB2089121A (en) | 1982-06-16 |
JPS57113259A (en) | 1982-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT8120132A0 (it) | Metodo di fabbricazione di un dispositivo semiconduttore e dispositivo semiconduttore fabbricato con l'ausilio di tale metodo. | |
DE3162470D1 (en) | Method of manufacturing semiconductor devices with submicron lines | |
EP0048175A3 (en) | Semiconductor device and method of manufacturing the same | |
DE3262485D1 (en) | Method of manufacturing josephson junction integrated circuit devices | |
IT8323153A0 (it) | Metodo di fabbricazione di un dispositivo semiconduttore e dispositivo semiconduttore fabbricato con l'ausilio di tale metodo. | |
IT1171668B (it) | Dispositivo termoelettrico e metodo di fabbricazione dello stesso | |
IT1150338B (it) | Circuito di protezione integrato | |
DE3270703D1 (en) | Field effect semiconductor device and method of manufacturing such a device | |
IT1135543B (it) | Circuito integrato digitale a semiconduttori e impianto di controllo digitale utilizzante tale circuito | |
IT1139988B (it) | Procedimento per la fabbricazione di un dispositivo a circuito integrato | |
DE3165523D1 (en) | Semiconductor laser device and method of manufacturing the same | |
DE3277393D1 (en) | Semiconductor device with wiring layers and method of manufacturing the same | |
IT1152447B (it) | Bobina multistrato e metodo di fabbricazione della stessa | |
IT1135354B (it) | Dispositivi elettronici incapsluati e composizioni incapsulanti | |
FR2498125B1 (fr) | Stratifie revetu de cuivre et procede de fabrication | |
IT1139897B (it) | Dispositivo a circuito integrati a rete metallica di interconnnessione e procedimento di fabbricazione di tale dispositivo | |
IT1174221B (it) | Metodo di fabbricazione di un dispositivo semiconduttore e dispositivo semiconduttore fabbricato con tale metodo | |
IT7919362A0 (it) | Dispositivo semiconduttore a circuito integrato e metodo di fabbricazione dello stesso. | |
IT1171250B (it) | Dispositivo per la fabbricazione di rete metallica a maglie intrecciate | |
BR8206348A (pt) | Circuito linearizador e metodo de afericao do mesmo | |
IT1139928B (it) | Procedimento per la fabbricazione di un dispositivo a circuito integrato | |
IT7824657A0 (it) | Metodo di fabbricazione di un dispositivo semiconduttore e dispositivo semiconduttore fabbricato con l'ausilio di tale metodo. | |
IT1138586B (it) | Circuito stampato e relativo procedimento di fabbricazione | |
IT1207285B (it) | Circuito elettronico a strato sottile e procedimento per la sua fabbricazione. | |
IT1139738B (it) | Dispositivi a circuito integrato a semiconduttori e procedimento per la sua fabbricazione |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19931220 |