NL192359B - Werkwijze voor het vervaardigen van een LED matrixkop. - Google Patents
Werkwijze voor het vervaardigen van een LED matrixkop.Info
- Publication number
- NL192359B NL192359B NL8901403A NL8901403A NL192359B NL 192359 B NL192359 B NL 192359B NL 8901403 A NL8901403 A NL 8901403A NL 8901403 A NL8901403 A NL 8901403A NL 192359 B NL192359 B NL 192359B
- Authority
- NL
- Netherlands
- Prior art keywords
- top surface
- wiring
- forming
- led component
- recess
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
- G06K15/02—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers
- G06K15/12—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24101—Connecting bonding areas at the same height
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR880016530 | 1988-12-12 | ||
KR1019880016530A KR910006706B1 (ko) | 1988-12-12 | 1988-12-12 | 발광다이오드 어레이 헤드의 제조방법 |
Publications (3)
Publication Number | Publication Date |
---|---|
NL8901403A NL8901403A (nl) | 1990-07-02 |
NL192359B true NL192359B (nl) | 1997-02-03 |
NL192359C NL192359C (nl) | 1997-06-04 |
Family
ID=19280066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8901403A NL192359C (nl) | 1988-12-12 | 1989-06-02 | Werkwijze voor het vervaardigen van een LED matrixkop. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4936808A (nl) |
JP (1) | JPH0644642B2 (nl) |
KR (1) | KR910006706B1 (nl) |
DE (1) | DE3923633C2 (nl) |
FR (1) | FR2641394B1 (nl) |
GB (1) | GB2225897B (nl) |
NL (1) | NL192359C (nl) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3323324B2 (ja) * | 1993-06-18 | 2002-09-09 | 株式会社リコー | 発光ダイオードおよび発光ダイオードアレイ |
JPH07202263A (ja) * | 1993-12-28 | 1995-08-04 | Ricoh Co Ltd | 端面発光型発光ダイオード、アレイ状光源、側面受光型受光素子、受発光素子、端面発光型発光ダイオードアレイ状光源 |
JP3194423B2 (ja) * | 1996-05-30 | 2001-07-30 | キヤノン株式会社 | 画像形成装置 |
US6011575A (en) * | 1996-09-10 | 2000-01-04 | Konica Corporation | Image forming apparatus with line-shaped image exposure means |
GB2329756A (en) | 1997-09-25 | 1999-03-31 | Univ Bristol | Assemblies of light emitting diodes |
US6200134B1 (en) | 1998-01-20 | 2001-03-13 | Kerr Corporation | Apparatus and method for curing materials with radiation |
EP1243025A2 (en) * | 1999-09-30 | 2002-09-25 | Alpha Industries, Inc. | Semiconductor packaging |
US6867499B1 (en) | 1999-09-30 | 2005-03-15 | Skyworks Solutions, Inc. | Semiconductor packaging |
US6415505B1 (en) * | 1999-11-15 | 2002-07-09 | Amkor Technology, Inc. | Micromachine package fabrication method |
US7320593B2 (en) | 2000-03-08 | 2008-01-22 | Tir Systems Ltd. | Light emitting diode light source for curing dental composites |
KR101164758B1 (ko) | 2002-07-25 | 2012-07-12 | 조나단 에스. 담 | 경화용 발광 다이오드를 사용하기 위한 방법 및 장치 |
US7182597B2 (en) | 2002-08-08 | 2007-02-27 | Kerr Corporation | Curing light instrument |
AU2003298561A1 (en) * | 2002-08-23 | 2004-05-13 | Jonathan S. Dahm | Method and apparatus for using light emitting diodes |
EP1420456B1 (en) * | 2002-11-13 | 2013-05-22 | Oki Data Corporation | Monolithic semiconductor component and optical print head |
DE10353679A1 (de) * | 2003-11-17 | 2005-06-02 | Siemens Ag | Kostengünstige, miniaturisierte Aufbau- und Verbindungstechnik für LEDs und andere optoelektronische Module |
MXPA06014522A (es) | 2004-06-15 | 2007-03-23 | Henkel Corp | Montaje electro-optico de diodo electroluminico de gran potencia. |
DE102004047061B4 (de) | 2004-09-28 | 2018-07-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
DE102004050371A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung |
KR101047683B1 (ko) * | 2005-05-17 | 2011-07-08 | 엘지이노텍 주식회사 | 와이어 본딩이 불필요한 발광소자 패키징 방법 |
US8113830B2 (en) * | 2005-05-27 | 2012-02-14 | Kerr Corporation | Curing light instrument |
US8047686B2 (en) * | 2006-09-01 | 2011-11-01 | Dahm Jonathan S | Multiple light-emitting element heat pipe assembly |
DE102008025318A1 (de) * | 2008-05-27 | 2009-12-10 | Setrinx S.A.R.L. | Leuchtchip und Leuchtvorrichtung mit einem solchen |
US9066777B2 (en) | 2009-04-02 | 2015-06-30 | Kerr Corporation | Curing light device |
US9072572B2 (en) | 2009-04-02 | 2015-07-07 | Kerr Corporation | Dental light device |
US20110089531A1 (en) * | 2009-10-16 | 2011-04-21 | Teledyne Scientific & Imaging, Llc | Interposer Based Monolithic Microwave Integrate Circuit (iMMIC) |
US9048392B2 (en) | 2010-04-23 | 2015-06-02 | Cree, Inc. | Light emitting device array assemblies and related methods |
DK2506370T3 (en) * | 2011-03-30 | 2016-01-18 | Huawei Tech Co Ltd | Submount device for VCSELs |
US20140001622A1 (en) * | 2012-06-27 | 2014-01-02 | Infineon Technologies Ag | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages |
US20140015405A1 (en) * | 2012-07-12 | 2014-01-16 | Elementech International Co., Ltd. | Light emitting diode module |
US20140048824A1 (en) * | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
JP6024957B2 (ja) * | 2012-09-24 | 2016-11-16 | 東芝ライテック株式会社 | 発光装置および照明装置 |
CN103594462A (zh) * | 2013-11-07 | 2014-02-19 | 昆山开威电子有限公司 | Led集成封装结构及其封装方法 |
WO2018117361A1 (ko) * | 2016-12-23 | 2018-06-28 | 주식회사 루멘스 | 마이크로 엘이디 모듈 및 그 제조방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290539A (en) * | 1963-09-16 | 1966-12-06 | Rca Corp | Planar p-nu junction light source with reflector means to collimate the emitted light |
US3914137A (en) * | 1971-10-06 | 1975-10-21 | Motorola Inc | Method of manufacturing a light coupled monolithic circuit by selective epitaxial deposition |
US3860424A (en) * | 1971-12-30 | 1975-01-14 | Bell Telephone Labor Inc | Led display |
US3936694A (en) * | 1973-12-28 | 1976-02-03 | Sony Corporation | Display structure having light emitting diodes |
US3964157A (en) * | 1974-10-31 | 1976-06-22 | Bell Telephone Laboratories, Incorporated | Method of mounting semiconductor chips |
JPS5429239B2 (nl) * | 1974-12-04 | 1979-09-21 | ||
US4040078A (en) * | 1976-05-11 | 1977-08-02 | Bell Telephone Laboratories, Incorporated | Opto-isolators and method of manufacture |
US4165474A (en) * | 1977-12-27 | 1979-08-21 | Texas Instruments Incorporated | Optoelectronic displays using uniformly spaced arrays of semi-sphere light-emitting diodes |
US4241277A (en) * | 1979-03-01 | 1980-12-23 | Amp Incorporated | LED Display panel having bus conductors on flexible support |
FR2491714A1 (fr) * | 1980-10-06 | 1982-04-09 | Radiotechnique Compelec | Dispositif semi-conducteur a diodes electroluminescentes localisees et son procede de fabrication |
GB2115198A (en) * | 1982-02-19 | 1983-09-01 | British Steel Corp | Improvements in or relating to visual display instrument component assemblies |
JPS6089988A (ja) * | 1983-10-24 | 1985-05-20 | Toshiba Corp | 複写機用ledアレイ光源 |
JPS60136788A (ja) * | 1983-12-26 | 1985-07-20 | 日本ビクター株式会社 | Led平面パネルデイスプレイの製作法 |
US4611886A (en) * | 1983-12-29 | 1986-09-16 | At&T Bell Laboratories | Integrated optical circuit package |
JPS6129562A (ja) * | 1984-07-20 | 1986-02-10 | Sanyo Electric Co Ltd | 印字用発光ダイオ−ド |
JPH0825302B1 (nl) * | 1984-09-27 | 1996-03-13 | Sanyo Denki Kk | |
EP0206176B1 (en) * | 1985-06-28 | 1992-01-02 | Takiron Co. Ltd. | An optical guide matrix for a dot-matrix luminous display |
-
1988
- 1988-12-12 KR KR1019880016530A patent/KR910006706B1/ko not_active IP Right Cessation
-
1989
- 1989-05-30 US US07/358,161 patent/US4936808A/en not_active Expired - Lifetime
- 1989-06-02 NL NL8901403A patent/NL192359C/nl not_active IP Right Cessation
- 1989-06-06 FR FR8907465A patent/FR2641394B1/fr not_active Expired - Lifetime
- 1989-07-12 JP JP1178209A patent/JPH0644642B2/ja not_active Expired - Fee Related
- 1989-07-17 DE DE3923633A patent/DE3923633C2/de not_active Expired - Lifetime
- 1989-11-24 GB GB8926626A patent/GB2225897B/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB8926626D0 (en) | 1990-01-17 |
DE3923633A1 (de) | 1990-06-13 |
DE3923633C2 (de) | 1994-12-22 |
KR900011053A (ko) | 1990-07-11 |
JPH02174274A (ja) | 1990-07-05 |
JPH0644642B2 (ja) | 1994-06-08 |
US4936808A (en) | 1990-06-26 |
NL8901403A (nl) | 1990-07-02 |
FR2641394A1 (fr) | 1990-07-06 |
GB2225897A (en) | 1990-06-13 |
KR910006706B1 (ko) | 1991-08-31 |
GB2225897B (en) | 1992-12-23 |
NL192359C (nl) | 1997-06-04 |
FR2641394B1 (fr) | 1994-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1A | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
V4 | Discontinued because of reaching the maximum lifetime of a patent |
Effective date: 20090602 |